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1. 发明授权

US06254479B1 Game machine 有权
标题翻译：游戏机
公开(公告)号：US06254479B1
公开(公告)日：2001-07-03
申请号：US09233645
申请日：1999-01-19
申请人： Genichiro Okitani , Ryosuke Toriyama , Takaaki Ishii , Yukari Shibata , Yukio Ozaki
发明人： Genichiro Okitani , Ryosuke Toriyama , Takaaki Ishii , Yukari Shibata , Yukio Ozaki
IPC分类号： A63F1300
CPC分类号： G07F17/34 , G07F17/3244
摘要： In a game machine which comprises a roulette part for rotating an indicating mark along an outside of a play field, the indicating mark is stopped in accordance with a signal from a stop switch. If the indicating mark is stopped in a center position of a prize area which is indicated with a chance gage, a payment of medals as a reward is allowed. If the indicating mark is stopped in a position which is included in the prize area but don't coincide with the center position, a process of a lottery with a random number is carried out and a gage volume of a level gage is changed in the basis of the random number. An additional chance of a payment of medals is given corresponding to a position in which the indicating mark is stopped.
摘要翻译：在包括用于沿着游戏场的外部旋转指示标记的轮盘部分的游戏机中，根据来自停止开关的信号停止指示标记。如果指示标记被停止在用机会表示的奖励区域的中心位置，则允许奖励作为奖励的支付。如果指示标记被停止在包括在奖励区域中但与中心位置不一致的位置，则执行具有随机数的彩票的处理，并且在随机数的基础。对应于指示标记停止的位置，给予额外奖金的机会。

2. 发明授权

US09437465B2 Substrate processing apparatus and method of manufacturing semiconductor device 有权
标题翻译：基板处理装置及半导体装置的制造方法
公开(公告)号：US09437465B2
公开(公告)日：2016-09-06
申请号：US12631152
申请日：2009-12-04
申请人： Satoru Takahata , Yukio Ozaki , Reizo Nunozawa
发明人： Satoru Takahata , Yukio Ozaki , Reizo Nunozawa
IPC分类号： H01L21/203 , H01L21/67 , C23C16/52 , C23C16/54 , G05B19/4063 , G05B19/418
CPC分类号： H01L21/67276 , C23C16/52 , C23C16/54 , G05B19/4063 , G05B19/41875 , G05B2219/31437 , G05B2219/45031 , Y02P90/14 , Y02P90/18 , Y02P90/20 , Y02P90/22
摘要： When a step is delayed, an operator can be rapidly informed of the delay. A substrate processing apparatus comprises a process system configured to process a substrate; a control unit configured to control the process system for performing a plurality of steps; and a manipulation unit configured to monitor a progress of each of the plurality of steps, wherein when a time elapsed after the control unit goes into a hold state exceeds an allowable time previously allocated to the one of the plurality of steps while waiting for a completion of the one of the plurality of steps started by the process system, the control unit transmits an alarm message to the manipulation unit so as to inform the manipulation unit that the allowable time is exceeded, terminates the hold state, and performs a recovery action.
摘要翻译：当一个步骤被延迟时，可以迅速地通知操作者延迟。衬底处理设备包括被配置为处理衬底的工艺系统; 控制单元，被配置为控制所述处理系统以执行多个步骤; 以及操作单元，被配置为监视所述多个步骤中的每一个的进度，其中当所述控制单元进入保持状态之后经过的时间超过预先分配给所述多个步骤中的所述一个步骤的允许时间，同时等待完成在由处理系统启动的多个步骤中的一个步骤中，控制单元向操作单元发送报警消息，以通知操作单元超过允许时间，终止保持状态，并执行恢复动作。

3. 发明授权

US07938160B2 Ultrasonic bonding apparatus 失效
标题翻译：超声波接合装置
公开(公告)号：US07938160B2
公开(公告)日：2011-05-10
申请号：US12564423
申请日：2009-09-22
申请人： Yasuyuki Masuda , Yukio Ozaki , Jun Matsueda , Kazuyuki Ikura , Taizan Kobayashi , Toshinori Kasuga
发明人： Yasuyuki Masuda , Yukio Ozaki , Jun Matsueda , Kazuyuki Ikura , Taizan Kobayashi , Toshinori Kasuga
IPC分类号： B32B37/00
CPC分类号： H01L24/75 , H01L24/12 , H01L24/83 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/73204 , H01L2224/83121 , H01L2224/83192 , H01L2224/83855 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01074 , H01L2924/0665 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2224/0401
摘要： An ultrasonic bonding apparatus includes an ultrasonic bonding unit, and a wiping unit configured to wipe out pre-cured underfill that has adhered to a tool surface of a head, by using a wiping member. The ultrasonic bonding unit includes a first driver configured to drive the head to press an electronic component upon a substrate, and an ultrasonic generator. The wiping unit includes a wiping table used to wipe out the tool surface, a feed mechanism configured to supply a wiping member to the wiping table and to roll up the wiping member, a cartridge configured to house the wiping table and the feed mechanism, and a second driver configured to drive the cartridge in the plane. The first driver is configured to press the head upon the wiping member on the wiping table.
摘要翻译：超声波接合装置包括超声波接合单元和擦拭单元，其被构造成通过使用擦拭构件来擦拭已经粘附到头部的工具表面的预固化底部填充物。超声波接合单元包括：第一驱动器，被配置为驱动头部将基板上的电子部件按压，以及超声波发生器。擦拭单元包括用于擦除工具表面的擦拭台，用于将擦拭构件供给到擦拭台并卷起擦拭构件的进给机构，构造成容纳擦拭台和进给机构的盒，以及第二驱动器，其被配置为在所述平面内驱动所述盒。第一个驱动器被配置为将头部压在擦拭台上的擦拭构件上。

4. 发明授权

US07823618B2 Ultrasonic bonding apparatus 有权
标题翻译：超声波接合装置
公开(公告)号：US07823618B2
公开(公告)日：2010-11-02
申请号：US12564444
申请日：2009-09-22
申请人： Yasuyuki Masuda , Yukio Ozaki , Jun Matsueda , Kazuyuki Ikura , Taizan Kobayashi , Toshinori Kasuga
发明人： Yasuyuki Masuda , Yukio Ozaki , Jun Matsueda , Kazuyuki Ikura , Taizan Kobayashi , Toshinori Kasuga
IPC分类号： B32B37/00
CPC分类号： H01L24/81 , H01L21/563 , H01L24/75 , H01L2224/16 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/7565 , H01L2224/757 , H01L2224/7592 , H01L2224/81121 , H01L2224/81205 , H01L2224/81801 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01074 , H01L2924/3011 , H01L2924/3025 , H01L2224/0401
摘要： An ultrasonic bonding apparatus includes a head that includes a tool surface configured to mount an electronic component, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with a substrate, and a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table. The wiping unit includes a solvent supply unit configured to supply a solvent configured to powder the underfill, to the wiping member on the wiping table, a sealed cartridge configured to house the wiping table and a feed mechanism configured to supply the wiping member to the wiping table and to roll up the wiping member from the wiping table, and a cartridge support member that includes a motor configured to drive the feed mechanism, and is detachably attached to the cartridge.
摘要翻译：一种超声波接合装置，包括：头部，其包括被配置为安装电子部件的工具表面;超声波接合单元，其被配置为使所述电子部件与基板超声波结合;以及擦拭单元，其构造成擦除已经粘附到所述电子部件上的预固化底部填充物通过在擦拭台上使用擦拭构件来使头部的工具表面。擦拭单元包括：溶剂供给单元，被配置为将构成为将底部填充剂粉末化的溶剂供给到擦拭台上的擦拭部件;被配置为容纳擦拭台的密封盒;以及供给机构，其构造成将擦拭部件供给到擦拭部并且从擦拭台卷起擦拭构件，以及盒支撑构件，其包括构造成驱动进给机构的马达，并且可拆卸地附接到卡盘。

5. 发明授权

US5028883A Tone controller for attenuating noise in the signal generated by receiver from weak electric field, and receiver having the tone controller 失效
标题翻译：用于衰减由弱电场接收器产生的信号中的噪声的音调控制器，以及具有音调控制器的接收机
公开(公告)号：US5028883A
公开(公告)日：1991-07-02
申请号：US409292
申请日：1989-09-19
申请人： Masashi Itoh , Yutaka Matsumoto , Yukio Ozaki
发明人： Masashi Itoh , Yutaka Matsumoto , Yukio Ozaki
IPC分类号： H03G9/00 , H03G5/22 , H04B1/16
CPC分类号： H03G5/22
摘要： A tone control circuit having a first differential amplifier and a second differential amplifier. The first differential amplifier comprises first and second transistors whose emitters are connected. The second differential amplifier comprises third and fourth transistors whose emitters are connected. The base and collector of the third transistor are connected to the base of the second transistor and the collector of the first transistor, respectively. The base and collector of the fourth transistor are connected to the base of the first transistor and the collector of the second transistor, respectively. A demodulated signal is input to the differential amplifier, and also to the second different amplifier via a band-pass filter. When a tone control signal is supplied to the bases of the first to fourth transistors, a signal generated by attenuating at least the low-frequency component of the demodulated signal is output from a tone control-signal output terminal connected to the collectors of the first to fourth transistors.
摘要翻译：一种音调控制电路，具有第一差分放大器和第二差分放大器。第一差分放大器包括其发射器连接的第一和第二晶体管。第二差分放大器包括发射器连接的第三和第四晶体管。第三晶体管的基极和集电极分别连接到第二晶体管的基极和第一晶体管的集电极。第四晶体管的基极和集电极分别连接到第一晶体管的基极和第二晶体管的集电极。解调信号通过带通滤波器输入到差分放大器，并输入到第二个不同的放大器。当音调控制信号被提供给第一至第四晶体管的基极时，通过衰减至少解调信号的低频分量产生的信号从连接到第一至第四晶体管的集电极的音调控制信号输出端输出到第四晶体管。

6. 发明授权

US5010396A Television projector for projection display 失效
标题翻译：电视投影机用于投影显示
公开(公告)号：US5010396A
公开(公告)日：1991-04-23
申请号：US514803
申请日：1990-04-26
申请人： Masaaki Hanyu , Yukio Ozaki
发明人： Masaaki Hanyu , Yukio Ozaki
IPC分类号： G02B5/22 , G03B21/00 , H04N5/74 , H04N9/31
CPC分类号： H04N9/31
摘要： A TV projector for a three-tube projection display which projects a red picture, a green picture and a blue picture by three TV projectors. The TV projector comprises a projection TV CRT and a compound lens including a component lens containing a light-absorbing substance capable of absorbing light components of the corresponding color picture in the sideband of the spectrum of the color picture. The TV projector is capable of projecting individual monochromatic color pictures of high purity to display a high-contrast color pictures having no color shade on a screen.
摘要翻译：一种用于三管投影显示器的电视投影仪，其由三台电视投影机投射红色图像，绿色图像和蓝色图像。 TV投影机包括投影电视CRT和复合透镜，该复合透镜包括含有能够吸收彩色图像的光谱边带中的相应彩色图像的光分量的吸光物质的分量透镜。电视投影机能够投射高纯度的各种单色彩色图像，以在屏幕上显示不具有色调的高对比度彩色图像。

7. 发明授权

US4618752A Gas-insulated interrupter 失效
标题翻译：气体绝缘灭弧室
公开(公告)号：US4618752A
公开(公告)日：1986-10-21
申请号：US693894
申请日：1985-01-23
申请人： Yukio Ozaki , Osamu Fujisawa , Ryukichi Sakai , Hiroshi Hasegawa
发明人： Yukio Ozaki , Osamu Fujisawa , Ryukichi Sakai , Hiroshi Hasegawa
IPC分类号： H02B13/02 , H01H31/02 , H01H33/56 , H01H33/64 , H02B13/035 , H01H33/54
CPC分类号： H02B13/035
摘要： A gas-insulated interrupter comprising an interrupting unit, a hermetically-sealable housing enclosing the interrupting unit therein, and a pair of rigid terminal conductors connected to the interrupting unit at spaced positions is disclosed. The housing has formed therein a single opening sufficiently large to allow the interrupting unit and the terminal conductors as assembled to pass therethrough. The large single opening in the housing is closed by a single closure member rigidly supporting the terminal conductors and hermetically closing the opening in the housing while mechanically rigidly supporting the terminal conductors and the interrupting unit.
摘要翻译：公开了一种气体绝缘断路器，其包括中断单元，封闭其中断单元的气密密封壳体以及在间隔位置处连接到中断单元的一对刚性端子导体。壳体在其中形成有足够大的单个开口，以允许组装的中断单元和端子导体穿过其中。壳体中的大的单个开口由刚性地支撑端子导体的单个闭合构件封闭，并且密封地封闭壳体中的开口，同时机械地刚性地支撑端子导体和中断单元。

8. 发明授权

US08457774B2 Substrate processing apparatus, control method of the substrate processing apparatus, manufacturing method of semiconductor device and apparatus state shifting method 有权
标题翻译：基板处理装置，基板处理装置的控制方法，半导体装置的制造方法以及装置状态移动方法
公开(公告)号：US08457774B2
公开(公告)日：2013-06-04
申请号：US12897111
申请日：2010-10-04
申请人： Yukio Ozaki , Satoru Takahata , Ichiro Nunomura
发明人： Yukio Ozaki , Satoru Takahata , Ichiro Nunomura
IPC分类号： G06F19/00
CPC分类号： H01L21/67276
摘要： To perform a maintenance work safely by a maintenance engineer, even if the maintenance work is performed with power of a substrate processing apparatus turned-on. A substrate processing apparatus, comprising: a controller that inhibits a shift from an idling state to a standby state, when a generation of a prescribed event is detected; the controller further comprising: a shift indicating part that controls an apparatus state so as to be shifted from the idling state possible to receive an indication of execution of the recipe, being an apparatus state possible to step into the substrate processing apparatus, to the standby state possible to execute a recipe, being an apparatus state impossible to step into the substrate processing apparatus; and an event detection part that detects a generation of the prescribed event for inhibiting a shift from the idling state to the standby state and notifies the shift indicating part of the prescribed event.
摘要翻译：为了维护工程人员进行维护工作，即使维护工作是在打开基板处理装置的电源的情况下执行的。一种基板处理装置，包括：当检测到规定事件的产生时，禁止从怠速状态向待机状态的转移的控制器; 所述控制器还包括：移动指示部，其控制装置状态以从所述怠速状态转移，以接收所述配方的执行指示，作为可能进入所述基板处理装置的装置状态到所述待机状态可以执行配方，作为不可能进入基板处理装置的装置状态; 以及事件检测部，其检测用于禁止从空转状态向待机状态的转换的规定事件的生成，并通知规定事件的换档指示部。

9. 发明授权

US07595582B2 Resonator, ultrasonic die bonding head, and ultrasonic die bonding apparatus 失效
标题翻译：谐振器，超声波芯片接合头和超声波芯片接合装置
公开(公告)号：US07595582B2
公开(公告)日：2009-09-29
申请号：US11143646
申请日：2005-06-03
申请人： Yukio Ozaki , Toshinori Kasuga
发明人： Yukio Ozaki , Toshinori Kasuga
IPC分类号： H01L41/053
CPC分类号： H01L24/75 , H01L24/81 , H01L2224/75 , H01L2224/75355 , H01L2224/81121 , H01L2224/81205 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082
摘要： A resonator 1 of the present invention includes: a vibrating member 13 holding an electronic component 12 and applying a vibration to the electronic component 12; and a depressing member 15 applying a depressing force for a side of a substrate 11 to the electronic component 12 through the vibrating member 13. The depressing member 15 includes: leg portions 15b which are disposed so as to leave spaces between the leg portions and both side faces 13a of the vibrating member 13 parallel with a vibration direction A; and supporting portions 15c through which the leg portions 15b and the side faces 13a of the vibrating member 13 are to be coupled to each other. With respect to a size of a cross section of each of the supporting portions 15c parallel with the side face 13a of the vibrating member 13, a length L2 along the vibration direction A of the vibrating member 13 is shorter than a length L1 along a depressing direction B of the depressing member 15.
摘要翻译：本发明的谐振器1包括：保持电子部件12并向电子部件12施加振动的振动部件13; 以及按压部件15，通过振动部件13向基板11的侧面施加按压力。按压部件15包括：腿部15b，其设置成在腿部与两者之间留有间隙振动部件13的与振动方向A平行的侧面13a; 以及支撑部分15c，腿部15b和振动构件13的侧面13a将彼此联接。对于与振动部件13的侧面13a平行的支撑部15c的截面尺寸，沿着振动部件13的振动方向A的长度L2比沿着振动部件13的振动方向A的长度L1短按压构件15的方向B.

10. 发明授权

US07566586B2 Method of manufacturing a semiconductor device 失效
标题翻译：制造半导体器件的方法
公开(公告)号：US07566586B2
公开(公告)日：2009-07-28
申请号：US11634119
申请日：2006-12-06
申请人： Norio Kainuma , Hidehiko Kira , Kenji Kobae , Kimio Nakamura , Kuniko Ishikawa , Yukio Ozaki
发明人： Norio Kainuma , Hidehiko Kira , Kenji Kobae , Kimio Nakamura , Kuniko Ishikawa , Yukio Ozaki
IPC分类号： H01L21/00
CPC分类号： H01L21/563 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81205 , H01L2224/81801 , H01L2224/83192 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/00 , H01L2924/3512
摘要： A method of manufacturing a semiconductor device flip-chip bonds electrode terminals of a substrate and a semiconductor chip together by solid-phase diffusion and underfills a gap between the substrate and the semiconductor chip with a thermosetting resin without the bonds between the terminals breaking due to heat in an underfill hardening step. The method includes a bonding step of flip-chip bonding the electrode terminals of the substrate and the semiconductor chip by solid-phase diffusion, an underfill filling step of filling the gap between the substrate and the semiconductor chip with the underfill material, and the underfill hardening step where the underfill material is heated to the hardening temperature to harden the underfill material. During the underfill hardening step, a member with a lower coefficient of thermal expansion out of the substrate and the semiconductor chip is heated to a higher temperature than the other member.
摘要翻译：半导体器件倒装芯片的制造方法通过固相扩散将基板和半导体芯片的电极端子连接在一起，并且用热固性树脂对基板和半导体芯片之间的间隙进行底部填充，而不会由于端子断裂而导致端子之间的结合在底部填充硬化步骤中加热。该方法包括通过固相扩散将基板和半导体芯片的电极端子倒装连接的接合步骤，用底部填充材料填充基板和半导体芯片之间的间隙的底部填充步骤，以及底部填充硬化步骤，其中将底部填充材料加热至硬化温度以使底部填充材料硬化。在底部填充硬化工序中，将从基板和半导体芯片的热膨胀系数较低的部件加热到比其他部件高的温度。

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