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1. 发明授权

US08769810B2 Part mounting method 有权
标题翻译：零件安装方法
公开(公告)号：US08769810B2
公开(公告)日：2014-07-08
申请号：US12699958
申请日：2010-02-04
申请人： Toru Nishino , Kazuyuki Ikura
发明人： Toru Nishino , Kazuyuki Ikura
IPC分类号： H05K3/30 , H05K13/00 , H05K13/04 , H05K13/08 , H01L21/70 , H01L21/82 , H01L23/00 , H01L25/00
CPC分类号： H05K13/0015 , H01L21/70 , H01L21/82 , H01L24/75 , H01L24/81 , H01L24/82 , H01L24/85 , H01L25/50 , H01L27/14601 , H01L31/18 , H01L2224/16 , H01L2224/279 , H01L2224/43 , H01L2224/75 , H01L2224/75743 , H01L2224/81121 , H01L2224/81801 , H01L2224/82 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H05K13/0413 , H05K13/0452 , H05K13/0478 , H05K13/08 , Y10T29/49117 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/49147 , Y10T29/49169 , Y10T29/53174 , H01L2224/0401 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A part mounting method of mounting first mounting parts and a second mounting part to a board includes taking an image of a configuration of the second mounting part and performing an image-recognition, mounting the first mounting parts to the board based on a result of the image-recognition of the configuration of the second mounting part, and mounting the second mounting part to the board based on a result of an image-recognition of the first mounting parts mounted to the board.
摘要翻译：将第一安装部件和第二安装部件安装到基板的部件安装方法包括：拍摄第二安装部件的构造的图像并执行图像识别，基于所述第一安装部件的结果将所述第一安装部件安装到所述板上对第二安装部件的构造进行图像识别，以及基于安装到板的第一安装部件的图像识别的结果将第二安装部件安装到基板。

2. 发明授权

US07938160B2 Ultrasonic bonding apparatus 失效
标题翻译：超声波接合装置
公开(公告)号：US07938160B2
公开(公告)日：2011-05-10
申请号：US12564423
申请日：2009-09-22
申请人： Yasuyuki Masuda , Yukio Ozaki , Jun Matsueda , Kazuyuki Ikura , Taizan Kobayashi , Toshinori Kasuga
发明人： Yasuyuki Masuda , Yukio Ozaki , Jun Matsueda , Kazuyuki Ikura , Taizan Kobayashi , Toshinori Kasuga
IPC分类号： B32B37/00
CPC分类号： H01L24/75 , H01L24/12 , H01L24/83 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/73204 , H01L2224/83121 , H01L2224/83192 , H01L2224/83855 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01074 , H01L2924/0665 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2224/0401
摘要： An ultrasonic bonding apparatus includes an ultrasonic bonding unit, and a wiping unit configured to wipe out pre-cured underfill that has adhered to a tool surface of a head, by using a wiping member. The ultrasonic bonding unit includes a first driver configured to drive the head to press an electronic component upon a substrate, and an ultrasonic generator. The wiping unit includes a wiping table used to wipe out the tool surface, a feed mechanism configured to supply a wiping member to the wiping table and to roll up the wiping member, a cartridge configured to house the wiping table and the feed mechanism, and a second driver configured to drive the cartridge in the plane. The first driver is configured to press the head upon the wiping member on the wiping table.
摘要翻译：超声波接合装置包括超声波接合单元和擦拭单元，其被构造成通过使用擦拭构件来擦拭已经粘附到头部的工具表面的预固化底部填充物。超声波接合单元包括：第一驱动器，被配置为驱动头部将基板上的电子部件按压，以及超声波发生器。擦拭单元包括用于擦除工具表面的擦拭台，用于将擦拭构件供给到擦拭台并卷起擦拭构件的进给机构，构造成容纳擦拭台和进给机构的盒，以及第二驱动器，其被配置为在所述平面内驱动所述盒。第一个驱动器被配置为将头部压在擦拭台上的擦拭构件上。

3. 发明授权

US07823618B2 Ultrasonic bonding apparatus 有权
标题翻译：超声波接合装置
公开(公告)号：US07823618B2
公开(公告)日：2010-11-02
申请号：US12564444
申请日：2009-09-22
申请人： Yasuyuki Masuda , Yukio Ozaki , Jun Matsueda , Kazuyuki Ikura , Taizan Kobayashi , Toshinori Kasuga
发明人： Yasuyuki Masuda , Yukio Ozaki , Jun Matsueda , Kazuyuki Ikura , Taizan Kobayashi , Toshinori Kasuga
IPC分类号： B32B37/00
CPC分类号： H01L24/81 , H01L21/563 , H01L24/75 , H01L2224/16 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/7565 , H01L2224/757 , H01L2224/7592 , H01L2224/81121 , H01L2224/81205 , H01L2224/81801 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01074 , H01L2924/3011 , H01L2924/3025 , H01L2224/0401
摘要： An ultrasonic bonding apparatus includes a head that includes a tool surface configured to mount an electronic component, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with a substrate, and a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table. The wiping unit includes a solvent supply unit configured to supply a solvent configured to powder the underfill, to the wiping member on the wiping table, a sealed cartridge configured to house the wiping table and a feed mechanism configured to supply the wiping member to the wiping table and to roll up the wiping member from the wiping table, and a cartridge support member that includes a motor configured to drive the feed mechanism, and is detachably attached to the cartridge.
摘要翻译：一种超声波接合装置，包括：头部，其包括被配置为安装电子部件的工具表面;超声波接合单元，其被配置为使所述电子部件与基板超声波结合;以及擦拭单元，其构造成擦除已经粘附到所述电子部件上的预固化底部填充物通过在擦拭台上使用擦拭构件来使头部的工具表面。擦拭单元包括：溶剂供给单元，被配置为将构成为将底部填充剂粉末化的溶剂供给到擦拭台上的擦拭部件;被配置为容纳擦拭台的密封盒;以及供给机构，其构造成将擦拭部件供给到擦拭部并且从擦拭台卷起擦拭构件，以及盒支撑构件，其包括构造成驱动进给机构的马达，并且可拆卸地附接到卡盘。

4. 发明申请

US20100122457A1 APPLICATION METHOD AND APPARATUS FOR RESIN 有权
标题翻译：树脂的应用方法和装置
公开(公告)号：US20100122457A1
公开(公告)日：2010-05-20
申请号：US12617076
申请日：2009-11-12
申请人： Kazuyuki Ikura , Junzou Une , Jun Matsueda
发明人： Kazuyuki Ikura , Junzou Une , Jun Matsueda
IPC分类号： H01L21/56 , H05K13/04 , H05K3/30
CPC分类号： H01L21/563 , H01L24/75 , H01L24/83 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/83192 , H01L2924/00014 , H01L2924/15787 , Y10T29/49121 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/53178 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An application method for resin includes applying resin to a first electronic component in an application chamber under a first internal pressure, moving a second electronic component into an internal pressure adjustment chamber under a second internal pressure which is higher than the first internal pressure and adjusting an internal pressure of the internal pressure adjustment chamber from the second internal pressure to the first internal pressure, and moving the second electronic component into the application chamber while moving the first electronic component into the internal pressure adjustment chamber after the step of application of the resin has been completed.
摘要翻译：一种树脂涂布方法，其特征在于，在第一内部压力下，将涂布树脂涂布在涂敷室内的第一电子部件上，在高于第一内部压力的第二内部压力下将第二电子部件移动到内部压力调节室内，内部压力调节室的内部压力从第二内部压力到第一内部压力，并且在施加树脂的步骤之后将第二电子部件移动到内部压力调节室中，同时将第二电子部件移动到施加室中已经完成

5. 发明授权

US08431052B2 Manufacturing apparatus and method for optical waveguide structure 有权
标题翻译：光波导结构的制造装置和方法
公开(公告)号：US08431052B2
公开(公告)日：2013-04-30
申请号：US13008533
申请日：2011-01-18
申请人： Kazuyuki Ikura
发明人： Kazuyuki Ikura
IPC分类号： B29D11/00
CPC分类号： G02B6/4214 , G02B6/13 , G02B6/30 , G02B6/42 , G02B6/4249 , G02B6/4292
摘要： A manufacturing apparatus for an optical waveguide structure including a clad structure having grooves in a curved surface thereof and a clad film attached to the curved surface includes a clad film shape retaining portion that has a curved surface along which the clad film is held. a position checking portion that checks the position of the clad film on the clad film shape retaining portion, and a first position adjusting portion that adjusts the position of the clad film shape retaining portion so that the clad film on the clad film shape retaining portion is disposed at a reference position while checking the position of the clad film with the position checking portion.
摘要翻译：一种用于光波导结构的制造装置，其包括其曲面上具有凹槽的包层结构和附接到该曲面的包层膜，包括具有保持包层膜的弯曲表面的包覆膜形状保持部。检查包覆膜形状保持部分上的包层膜的位置的位置检查部分和调节包膜形状保持部分的位置的第一位置调节部分，使得包膜形状保持部分上的包膜膜是设置在参考位置，同时用位置检查部分检查包覆膜的位置。

6. 发明申请

US20100325884A1 MOUNTING APPARATUS AND MOUNTING METHOD 有权
标题翻译：安装设备和安装方法
公开(公告)号：US20100325884A1
公开(公告)日：2010-12-30
申请号：US12824707
申请日：2010-06-28
申请人： Toru Nishino , Kazuyuki Ikura
发明人： Toru Nishino , Kazuyuki Ikura
IPC分类号： H05K3/30 , H05K13/04
CPC分类号： H05K3/305 , H05K2203/0195 , H05K2203/1115 , Y02P70/613 , Y10T29/49131 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191
摘要： A mounting apparatus includes a stage device on which an installation substrate and a component are placed, a suction head provided vertically above the stage device, the suction unit moving in a direction perpendicular to the stage device, a contact attached to the suction head that comes into contact with an electrode of the component, a camera provided vertically above the suction head, the camera moving in a direction perpendicular to the suction head, and a control unit that controls operation of the stage device, operation of the suction head, application of electricity to the contact, and operation of the camera.
摘要翻译：一种安装装置，包括：台架装置，其上设置有安装基板和部件;垂直设置在平台装置上方的抽吸头，所述抽吸单元沿垂直于所述平台装置的方向移动，附接到所述抽吸头的接触件与构件的电极接触，垂直设置在吸头上方的照相机，照相机沿垂直于吸头的方向移动;以及控制单元，其控制舞台装置的操作，吸头的操作，接触电，以及相机的操作。

7. 发明申请

US20100038406A1 ULTRASONIC BONDING APPARATUS 失效
标题翻译：超声波接合装置
公开(公告)号：US20100038406A1
公开(公告)日：2010-02-18
申请号：US12564423
申请日：2009-09-22
申请人： Yasuyuki MASUDA , Yukio OZAKI , Jun MATSUEDA , Kazuyuki IKURA , Taizan KOBAYASHI , Toshinori KASUGA
发明人： Yasuyuki MASUDA , Yukio OZAKI , Jun MATSUEDA , Kazuyuki IKURA , Taizan KOBAYASHI , Toshinori KASUGA
IPC分类号： B23K1/06
CPC分类号： H01L24/75 , H01L24/12 , H01L24/83 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/73204 , H01L2224/83121 , H01L2224/83192 , H01L2224/83855 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01074 , H01L2924/0665 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2224/0401
摘要： An ultrasonic bonding apparatus includes an ultrasonic bonding unit, and a wiping unit configured to wipe out pre-cured underfill that has adhered to a tool surface of a head, by using a wiping member. The ultrasonic bonding unit includes a first driver configured to drive the head to press an electronic component upon a substrate, and an ultrasonic generator. The wiping unit includes a wiping table used to wipe out the tool surface, a feed mechanism configured to supply a wiping member to the wiping table and to roll up the wiping member, a cartridge configured to house the wiping table and the feed mechanism, and a second driver configured to drive the cartridge in the plane. The first driver is configured to press the head upon the wiping member on the wiping table.
摘要翻译：超声波接合装置包括超声波接合单元和擦拭单元，其被构造成通过使用擦拭构件来擦拭已经粘附到头部的工具表面的预固化底部填充物。超声波接合单元包括：第一驱动器，被配置为驱动头部将基板上的电子部件按压，以及超声波发生器。擦拭单元包括用于擦除工具表面的擦拭台，用于将擦拭构件供给到擦拭台并卷起擦拭构件的进给机构，构造成容纳擦拭台和进给机构的盒，以及第二驱动器，其被配置为在所述平面内驱动所述盒。第一个驱动器被配置为将头部压在擦拭台上的擦拭构件上。

8. 发明申请

US20100024667A1 PRESSURE-HEATING APPARATUS AND METHOD 审中-公开
标题翻译：压力加热装置和方法
公开(公告)号：US20100024667A1
公开(公告)日：2010-02-04
申请号：US12472687
申请日：2009-05-27
申请人： Kazuyuki Ikura
发明人： Kazuyuki Ikura
IPC分类号： B30B15/34 , B25J11/00 , B25J15/00
CPC分类号： B30B15/34 , B30B15/067 , H01L24/75 , H01L24/83 , H01L24/97 , H01L2224/75252 , H01L2224/75253 , H01L2224/75305 , H01L2224/75315 , H01L2224/7598 , H01L2224/83 , H01L2924/00013 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： A pressure-heating apparatus includes: a stage configured to place an object to be pressure-heated thereon; a pressure-heating head arranged to oppose to the stage; and a pressure drive mechanism configured to movably support the pressure-heating head relative to said stage. The pressure-heating head includes: a plurality of pressure-heating tools; a holder configured to independently accommodate each of the pressure-heating tools; a single heater block configured to contact with ends of the pressure-heating tools to transmit a heat; and a plurality of supporters configured to independently and movably support the pressure-heating tools relative to the holder, respectively.
摘要翻译：压力加热装置包括：被配置为放置要在其上加压加热的物体的台; 设置为与舞台相对的加压头; 以及压力驱动机构，其构造成相对于所述平台可移动地支撑所述加热头。压力加热头包括：多个压力加热工具; 保持器，其构造成独立地容纳每个所述加压工具; 单个加热器块，其构造成与加压工具的端部接触以传递热量; 以及多个支撑构件，其被配置成分别独立地且可移动地支撑所述压力加热工具相对于所述支架。

9. 发明申请

US20100006231A1 ULTRASONIC BONDING APPARATUS 有权
标题翻译：超声波接合装置
公开(公告)号：US20100006231A1
公开(公告)日：2010-01-14
申请号：US12564444
申请日：2009-09-22
申请人： Yasuyuki MASUDA , Yukio OZAKI , Jun MATSUEDA , Kazuyuki IKURA , Taizan KOBAYASHI , Toshinori KASUGA
发明人： Yasuyuki MASUDA , Yukio OZAKI , Jun MATSUEDA , Kazuyuki IKURA , Taizan KOBAYASHI , Toshinori KASUGA
IPC分类号： B32B37/00
CPC分类号： H01L24/81 , H01L21/563 , H01L24/75 , H01L2224/16 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/7565 , H01L2224/757 , H01L2224/7592 , H01L2224/81121 , H01L2224/81205 , H01L2224/81801 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01074 , H01L2924/3011 , H01L2924/3025 , H01L2224/0401
摘要： An ultrasonic bonding apparatus includes a head that includes a tool surface configured to mount an electronic component, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with a substrate, and a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table. The wiping unit includes a solvent supply unit configured to supply a solvent configured to powder the underfill, to the wiping member on the wiping table, a sealed cartridge configured to house the wiping table and a feed mechanism configured to supply the wiping member to the wiping table and to roll up the wiping member from the wiping table, and a cartridge support member that includes a motor configured to drive the feed mechanism, and is detachably attached to the cartridge.
摘要翻译：一种超声波接合装置，包括：头部，其包括被配置为安装电子部件的工具表面;超声波接合单元，其被配置为使所述电子部件与基板超声波结合;以及擦拭单元，其构造成擦除已经粘附到所述电子部件上的预固化底部填充物通过在擦拭台上使用擦拭构件来使头部的工具表面。擦拭单元包括：溶剂供给单元，被配置为将构成为将底部填充剂粉末化的溶剂供给到擦拭台上的擦拭部件;被配置为容纳擦拭台的密封盒;以及供给机构，其构造成将擦拭部件供给到擦拭部并且从擦拭台卷起擦拭构件，以及盒支撑构件，其包括构造成驱动进给机构的马达，并且可拆卸地附接到卡盘。

10. 发明申请

US20100132187A1 PART MOUNTING APPARATUS AND METHOD 有权
标题翻译：部件安装设备和方法
公开(公告)号：US20100132187A1
公开(公告)日：2010-06-03
申请号：US12699958
申请日：2010-02-04
申请人： Toru Nishino , Kazuyuki Ikura
发明人： Toru Nishino , Kazuyuki Ikura
IPC分类号： B23P19/00
CPC分类号： H05K13/0015 , H01L21/70 , H01L21/82 , H01L24/75 , H01L24/81 , H01L24/82 , H01L24/85 , H01L25/50 , H01L27/14601 , H01L31/18 , H01L2224/16 , H01L2224/279 , H01L2224/43 , H01L2224/75 , H01L2224/75743 , H01L2224/81121 , H01L2224/81801 , H01L2224/82 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H05K13/0413 , H05K13/0452 , H05K13/0478 , H05K13/08 , Y10T29/49117 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/49147 , Y10T29/49169 , Y10T29/53174 , H01L2224/0401 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A part mounting apparatus mounts a plurality of mounting parts to a board. The board is placed on a placement stage. A first part support part supports a first mounting part. A second part support part supports a second mounting part. A first camera image-recognizes the first mounting part supported by the first part support part from above, and image-recognizes a mounting surface of the board placed on the placement stage from above the first part support part. A second camera image-recognizes the second mounting part supported by the second part support part from underneath.
摘要翻译：部件安装装置将多个安装部件安装到板上。该板放在放置台上。第一部件支撑部件支撑第一安装部件。第二部分支撑部件支撑第二安装部件。第一相机图像 - 从上方识别由第一部分支撑部分支撑的第一安装部分，并且从第一部分支撑部分的上方图像识别放置在放置台上的板的安装表面。第二相机图像 - 从下面识别由第二部分支撑部分支撑的第二安装部分。

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