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    • 3. 发明申请
    • STACKED MEMORY DEVICE WITH HELPER PROCESSOR
    • 具有帮助处理器的堆叠存储器件
    • US20140040532A1
    • 2014-02-06
    • US13567958
    • 2012-08-06
    • Yasuko WatanabeGabriel H. LohJames M. O'ConnorMichael IgnatowskiNuwan S. Jayasena
    • Yasuko WatanabeGabriel H. LohJames M. O'ConnorMichael IgnatowskiNuwan S. Jayasena
    • G06F12/00
    • G06F13/1668G06F13/4234Y02D10/14Y02D10/151
    • A processing system comprises one or more processor devices and other system components coupled to a stacked memory device having a set of stacked memory layers and a set of one or more logic layers. The set of logic layers implements a helper processor that executes instructions to perform tasks in response to a task request from the processor devices or otherwise on behalf of the other processor devices. The set of logic layers also includes a memory interface coupled to memory cell circuitry implemented in the set of stacked memory layers and coupleable to the processor devices. The memory interface operates to perform memory accesses for the processor devices and for the helper processor. By virtue of the helper processor's tight integration with the stacked memory layers, the helper processor may perform certain memory-intensive operations more efficiently than could be performed by the external processor devices.
    • 处理系统包括一个或多个处理器设备和耦合到具有一组堆叠存储器层和一组一个或多个逻辑层的堆叠存储器件的其他系统组件。 这组逻辑层实现了一个辅助处理器,其执行指令以响应于来自处理器设备的任务请求或以其他方式代表其他处理器设备执行任务。 该组逻辑层还包括耦合到在该组堆叠存储器层中实现并且可耦合到处理器设备的存储器单元电路的存储器接口。 存储器接口操作以对处理器设备和辅助处理器执行存储器访问。 由于辅助处理器与堆叠的存储器层的紧密集成,辅助处理器可以比由外部处理器设备执行的更有效地执行某些存储器密集型操作。
    • 5. 发明申请
    • STACKED MEMORY DEVICE WITH METADATA MANGEMENT
    • 具有元数据的堆叠存储器件
    • US20140040698A1
    • 2014-02-06
    • US13567945
    • 2012-08-06
    • Gabriel H. LohJames M. O'ConnorBradford M. BeckmannMichael Ignatowski
    • Gabriel H. LohJames M. O'ConnorBradford M. BeckmannMichael Ignatowski
    • G06F12/00G06F12/10G06F11/08
    • G06F13/1668G06F11/1004Y02D10/14
    • A processing system comprises one or more processor devices and other system components coupled to a stacked memory device having a set of stacked memory layers and a set of one or more logic layers. The set of logic layers implements a metadata manager that offloads metadata management from the other system components. The set of logic layers also includes a memory interface coupled to memory cell circuitry implemented in the set of stacked memory layers and coupleable to the devices external to the stacked memory device. The memory interface operates to perform memory accesses for the external devices and for the metadata manager. By virtue of the metadata manager's tight integration with the stacked memory layers, the metadata manager may perform certain memory-intensive metadata management operations more efficiently than could be performed by the external devices.
    • 处理系统包括一个或多个处理器设备和耦合到具有一组堆叠存储器层和一组一个或多个逻辑层的堆叠存储器件的其他系统组件。 逻辑层集合实现了从其他系统组件卸载元数据管理的元数据管理器。 逻辑层集合还包括耦合到存储单元电路的存储器接口,该存储器单元电路被实现在该组堆叠存储器层中,并且可耦合到堆叠存储器件外部的器件。 存储器接口用于对外部设备和元数据管理器执行存储器访问。 由于元数据管理器与堆叠存储器层的紧密集成,元数据管理器可以比由外部设备执行的更有效地执行某些存储器密集型元数据管理操作。
    • 6. 发明授权
    • Quality of service support using stacked memory device with logic die
    • 使用具有逻辑模块的堆叠存储器件的服务质量支持
    • US09201777B2
    • 2015-12-01
    • US13726144
    • 2012-12-23
    • Lisa R. HsuGabriel H. LohBradford M. BeckmannMichael Ignatowski
    • Lisa R. HsuGabriel H. LohBradford M. BeckmannMichael Ignatowski
    • G06F12/00G06F12/02
    • G06F12/00G06F12/0246G06F13/16H01L2224/16227H01L2924/1431H01L2924/1434H01L2924/15311
    • A die-stacked memory device implements an integrated QoS manager to provide centralized QoS functionality in furtherance of one or more specified QoS objectives for the sharing of the memory resources by other components of the processing system. The die-stacked memory device includes a set of one or more stacked memory dies and one or more logic dies. The logic dies implement hardware logic for a memory controller and the QoS manager. The memory controller is coupleable to one or more devices external to the set of one or more stacked memory dies and operates to service memory access requests from the one or more external devices. The QoS manager comprises logic to perform operations in furtherance of one or more QoS objectives, which may be specified by a user, by an operating system, hypervisor, job management software, or other application being executed, or specified via hardcoded logic or firmware.
    • 堆叠堆叠的存储器件实现集成的QoS管理器以提供集中的QoS功能,以促进一个或多个指定的QoS目标,以便由处理系统的其他组件共享存储器资源。 芯片堆叠的存储器件包括一组一个或多个堆叠的存储器管芯和一个或多个逻辑管芯。 逻辑模块为存储器控制器和QoS管理器实现硬件逻辑。 存储器控制器可耦合到一个或多个堆叠的存储器管芯组的外部的一个或多个器件,并且操作以从一个或多个外部器件服务存储器访问请求。 QoS管理器包括用于执行可由操作系统,管理程序,作业管理软件或正在执行的其它应用程序或通过硬编码逻辑或固件指定的一个或多个QoS目标的操作的逻辑。