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1. 发明授权

US08901576B2 Silicon photonics wafer using standard silicon-on-insulator processes through substrate removal or transfer 有权
标题翻译：硅光子晶片使用标准的绝缘体上硅工艺，通过衬底去除或转移
公开(公告)号：US08901576B2
公开(公告)日：2014-12-02
申请号：US13353162
申请日：2012-01-18
申请人： Fuad E. Doany , Benjamin G. Lee , Alexander V. Rylyakov , Clint L. Schow , Marc A. Taubenblatt
发明人： Fuad E. Doany , Benjamin G. Lee , Alexander V. Rylyakov , Clint L. Schow , Marc A. Taubenblatt
IPC分类号： H01L33/00 , H01L29/18 , H01L21/00
CPC分类号： H01L21/76251
摘要： Processing for a silicon photonics wafer is provided. A silicon photonics wafer that includes an active silicon photonics layer, a thin buried oxide layer, and a silicon substrate is received. The thin buried oxide layer is located between the active silicon photonics layer and the silicon substrate. An electrical CMOS wafer that includes an active electrical layer is also received. The active silicon photonics layer of the silicon photonics wafer is flip chip bonded to the active electrical layer of the electrical CMOS wafer. The silicon substrate is removed exposing a backside surface of the thin buried oxide layer. A low-optical refractive index backing wafer is added to the exposed backside surface of the thin buried oxide layer. The low-optical refractive index backing wafer is a glass substrate or silicon substrate wafer. The silicon substrate wafer includes a thick oxide layer that is attached to the thin buried oxide layer.
摘要翻译：提供了硅光子晶片的处理。接收包括有源硅光子学层，薄掩埋氧化物层和硅衬底的硅光子晶片。薄的掩埋氧化物层位于有源硅光子层和硅衬底之间。还接收包括有源电层的电CMOS晶片。硅光子晶片的有源硅光子层被倒装芯片结合到电CMOS晶片的有源电层。去除暴露出薄的掩埋氧化物层的背面的硅衬底。将低光学折射率背衬晶片添加到薄的掩埋氧化物层的暴露的背面。低光学折射率背衬晶片是玻璃衬底或硅衬底晶片。硅衬底晶片包括附着到薄掩埋氧化物层的厚氧化物层。

2. 发明申请

US20130181233A1 SILICON PHOTONICS WAFER USING STANDARD SILICON-ON-INSULATOR PROCESSES THROUGH SUBSTRATE REMOVAL OR TRANSFER 有权
标题翻译：使用通过基板去除或转移的标准硅绝缘体工艺的硅光电晶体
公开(公告)号：US20130181233A1
公开(公告)日：2013-07-18
申请号：US13353162
申请日：2012-01-18
申请人： Fuad E. Doany , Benjamin G. Lee , Alexander V. Rylyakov , Clint L. Schow , Marc A. Taubenblatt
发明人： Fuad E. Doany , Benjamin G. Lee , Alexander V. Rylyakov , Clint L. Schow , Marc A. Taubenblatt
IPC分类号： H01L33/60 , H01L33/08
CPC分类号： H01L21/76251
摘要： Processing for a silicon photonics wafer is provided. A silicon photonics wafer that includes an active silicon photonics layer, a thin buried oxide layer, and a silicon substrate is received. The thin buried oxide layer is located between the active silicon photonics layer and the silicon substrate. An electrical CMOS wafer that includes an active electrical layer is also received. The active silicon photonics layer of the silicon photonics wafer is flip chip bonded to the active electrical layer of the electrical CMOS wafer. The silicon substrate is removed exposing a backside surface of the thin buried oxide layer. A low-optical refractive index backing wafer is added to the exposed backside surface of the thin buried oxide layer. The low-optical refractive index backing wafer is a glass substrate or silicon substrate wafer. The silicon substrate wafer includes a thick oxide layer that is attached to the thin buried oxide layer.
摘要翻译：提供了硅光子晶片的处理。接收包括有源硅光子学层，薄掩埋氧化物层和硅衬底的硅光子晶片。薄的掩埋氧化物层位于有源硅光子层和硅衬底之间。还接收包括有源电层的电CMOS晶片。硅光子晶片的有源硅光子层被倒装芯片结合到电CMOS晶片的有源电层。去除暴露出薄的掩埋氧化物层的背面的硅衬底。将低光学折射率背衬晶片添加到薄的掩埋氧化物层的暴露的背面。低光学折射率背衬晶片是玻璃衬底或硅衬底晶片。硅衬底晶片包括附着到薄掩埋氧化物层的厚氧化物层。

3. 发明授权

US08482352B2 Differential amplifier stage with integrated offset cancellation circuit 失效
标题翻译：具有积分偏移消除电路的差分放大器级
公开(公告)号：US08482352B2
公开(公告)日：2013-07-09
申请号：US12826831
申请日：2010-06-30
申请人： Fuad E. Doany , Alexander V. Rylyakov , Clint L. Schow
发明人： Fuad E. Doany , Alexander V. Rylyakov , Clint L. Schow
IPC分类号： H03F3/45
CPC分类号： H03F3/45179 , H03F3/082 , H03F3/087 , H03F3/45183 , H03F3/45744 , H03F2200/375 , H03F2200/405 , H03F2203/45212 , H03F2203/45528 , H03F2203/45641 , H03F2203/45701 , H03F2203/45702
摘要： A differential amplifier stage and method for offset cancellation include an amplifier having an input and an output. An internal offset cancellation circuit has an input for receiving a control signal to control offset cancellation in the amplifier. The offset cancellation circuit is integrated with the amplifier but isolated from the input and the output of the amplifier, and, in accordance with its isolation, an impedance of the stage is unaffected by the offset cancellation circuit.
摘要翻译：用于偏移消除的差分放大器级和方法包括具有输入和输出的放大器。内部偏移消除电路具有用于接收控制信号以控制放大器中的偏移消除的输入。偏移消除电路与放大器集成，但与放大器的输入和输出隔离，并且根据其隔离，级的阻抗不受偏移消除电路的影响。

4. 发明授权

US08456240B2 Differential amplifier stage with integrated offset cancellation circuit 失效
公开(公告)号：US08456240B2
公开(公告)日：2013-06-04
申请号：US13594122
申请日：2012-08-24
申请人： Fuad E. Doany , Alexander V. Rylyakov , Clint L. Schow
发明人： Fuad E. Doany , Alexander V. Rylyakov , Clint L. Schow
IPC分类号： H03F3/08
CPC分类号： H03F3/45179 , H03F3/082 , H03F3/087 , H03F3/45183 , H03F3/45744 , H03F2200/375 , H03F2200/405 , H03F2203/45212 , H03F2203/45528 , H03F2203/45641 , H03F2203/45701 , H03F2203/45702
摘要： A differential amplifier stage and method for offset cancellation include an amplifier having an input and an output. An internal offset cancellation circuit has an input for receiving a control signal to control offset cancellation in the amplifier. The offset cancellation circuit is integrated with the amplifier but isolated from the input and the output of the amplifier, and, in accordance with its isolation, an impedance of the stage is unaffected by the offset cancellation circuit.

5. 发明申请

US20120001166A1 PARELLEL OPTICAL TRANSCEIVER MODULE 有权
标题翻译： PARELLEL光收发模块
公开(公告)号：US20120001166A1
公开(公告)日：2012-01-05
申请号：US12827825
申请日：2010-06-30
申请人： Fuad E. Doany , Christopher V. Jahnes , Clint L. Schow , Mehmet Soyuer , Alexander V. Rylyakov
发明人： Fuad E. Doany , Christopher V. Jahnes , Clint L. Schow , Mehmet Soyuer , Alexander V. Rylyakov
IPC分类号： H01L31/0232 , H01L21/768
CPC分类号： G02B6/12 , G02B6/4232 , G02B6/4246 , G02B6/4249 , G02B6/4259 , G02B6/4267 , H01L27/04 , H01L29/02 , H01L31/0203 , H01L2224/16225 , H01S5/40
摘要： A silicon-on-insulator wafer is provided. The silicon-on-insulator wafer includes a silicon substrate having optical vias formed therein. In addition, an optically transparent oxide layer is disposed on the silicon substrate and the optically transparent oxide layer is in contact with the optical vias. Then, a complementary metal-oxide-semiconductor layer is formed over the optically transparent oxide layer.
摘要翻译：提供了绝缘体上硅晶片。绝缘体上硅晶片包括其中形成有光通孔的硅衬底。此外，在硅衬底上设置光学透明氧化物层，并且光学透明氧化物层与光学通孔接触。然后，在光学透明氧化物层上形成互补的金属氧化物半导体层。

6. 发明授权

US09229169B2 Lens array optical coupling to photonic chip 有权
标题翻译：透镜阵列光耦合到光子芯片
公开(公告)号：US09229169B2
公开(公告)日：2016-01-05
申请号：US13211018
申请日：2011-08-16
申请人： Fuad E. Doany , Benjamin G. Lee , Clint L. Schow
发明人： Fuad E. Doany , Benjamin G. Lee , Clint L. Schow
IPC分类号： G02B6/32 , H01L21/302 , G02B6/30 , G02B6/42
CPC分类号： G02B6/32 , G02B6/30 , G02B6/4204 , G02B6/4244 , G02B6/425 , H01L21/302
摘要： A photonic integrated circuit apparatus is disclosed. The apparatus includes a photonic chip and a lens array coupling element. The photonic chip includes a waveguide at a side edge surface of the photonic chip. The lens array coupling element is mounted on a top surface of the photonic chip and on the side edge surface. The coupling element includes a lens array that is configured to modify spot sizes of light traversing to or from the waveguide. The coupling element further includes an overhang on a side of the coupling element that opposes the lens array and that abuts the top surface of the photonic chip. The overhang includes a vertical stop surface that has a depth configured to horizontally align an edge of the waveguide with a focal length of the lens array and that vertically aligns focal points of the lens array with the edge of the waveguide.
摘要翻译：公开了一种光子集成电路装置。该装置包括光子芯片和透镜阵列耦合元件。光子芯片包括在光子芯片的侧边缘表面处的波导。透镜阵列耦合元件安装在光子芯片的顶表面上并在侧边缘表面上。耦合元件包括透镜阵列，其被配置为修改横穿波导的光的光斑大小。耦合元件还包括在耦合元件的与透镜阵列相对并且邻接光子芯片的顶表面的一侧上的突出端。突出部分包括垂直的止动表面，其具有配置成将波导的边缘与透镜阵列的焦距水平对准的深度，并且使透镜阵列的焦点与波导的边缘垂直对准。

7. 发明授权

US07097884B2 Stability of ion beam generated alignment layers by surface modification 失效
公开(公告)号：US07097884B2
公开(公告)日：2006-08-29
申请号：US10606523
申请日：2003-06-26
申请人： Alessandro C. Callegari , Praveen Chaudhari , Fuad E. Doany , James P. Doyle , Eileen A. Galligan , James H. Glownia , Gareth G. Hougham , James A. Lacey , Shui-Chih Lien , Minhua Lu , Alan E. Rosenbluth , Kei-Hsiung Yang
发明人： Alessandro C. Callegari , Praveen Chaudhari , Fuad E. Doany , James P. Doyle , Eileen A. Galligan , James H. Glownia , Gareth G. Hougham , James A. Lacey , Shui-Chih Lien , Minhua Lu , Alan E. Rosenbluth , Kei-Hsiung Yang
IPC分类号： C23C14/02 , C23C14/14 , C23C14/48 , C23C14/58 , G02F1/1337
CPC分类号： G02F1/13378
摘要： A method for preparing an alignment layer surface provides a surface on the alignment layer. The surface is bombarded with ions, and reactive gas is introduced to the ion beam to saturate dangling bonds on the surface. Another method for preparing an alignment layer surface provides a surface on the alignment layer. The surface is bombarded with ions and quenched with a reactive component to saturate dangling bonds on the surface.

8. 发明授权

US06648485B1 Highly collimating tapered light guide for uniform illumination of flat panel displays 有权
标题翻译：高准直锥形光导，用于平板显示器的均匀照明
公开(公告)号：US06648485B1
公开(公告)日：2003-11-18
申请号：US09711041
申请日：2000-11-13
申请人： Evan G. Colgan , Fuad E. Doany , Akiko Nishikai , Rama N. Singh , Masaru Suzuki , Yoichi Taira
发明人： Evan G. Colgan , Fuad E. Doany , Akiko Nishikai , Rama N. Singh , Masaru Suzuki , Yoichi Taira
IPC分类号： F21V704
CPC分类号： G02B6/0016 , G02B6/0031 , G02B6/0046
摘要： A light guide system has a light guide having a first end portion opposite a second end portion. The light guide provides a first surface and a second surface between the first and second end portions, and the second surface is inclined relative to the first surface. A light source is disposed along the first end portion on a first axis. A light redistribution device is disposed on an entrance of the light guide for receiving light from the light source and redistributing a portion of the light perpendicular to the first axis to provide a uniform light distribution from the first surface.
摘要翻译：导光系统具有导光体，该导光体具有与第二端部相对的第一端部。光导件在第一和第二端部之间提供第一表面和第二表面，并且第二表面相对于第一表面倾斜。光源沿着第一端部设置在第一轴上。光再分配装置设置在光导的入口处，用于接收来自光源的光并且重新分配垂直于第一轴的光的一部分以提供从第一表面均匀的光分布。

9. 发明授权

US5433631A Flex circuit card elastomeric cable connector assembly 失效
公开(公告)号：US5433631A
公开(公告)日：1995-07-18
申请号：US268907
申请日：1994-06-29
申请人： Brian S. Beaman , Fuad E. Doany , Thomas J. Dudek , Alphonso P. Lanzetta , Da-Yuan Shih , William J. Tkazyik , George F. Walker
发明人： Brian S. Beaman , Fuad E. Doany , Thomas J. Dudek , Alphonso P. Lanzetta , Da-Yuan Shih , William J. Tkazyik , George F. Walker
IPC分类号： H01R12/71 , H01R12/79 , H01R24/00 , H01R9/09
CPC分类号： H01R12/714 , H01R12/79
摘要： A flex circuit card with an elastomeric cable connector assembly is provided for transmitting high speed signals between two or more printed circuit boards in a high performance computer system. The flex circuit card connects a cable assembly to a printed circuit board. A conductor trace in the flex circuit card extends into an elastomeric end and terminates with a ball shaped contact which is angled to wipe against mating pads on the printed circuit card for making electrical contact. The cable assembly uses multiple wires attached to a plurality of elastomeric connectors. At least one elastomeric connector is attached to each end of the cable assembly and each elastomeric connector has a plurality of contacts which are used to mate with a plurality of pads on the surface of the printed circuit board. The elastomeric connector described in the present invention provides a high density, cable-to-board interconnection that is perpendicular to the surface of the printed circuit board.

10. 发明授权

US5258236A Multi-layer thin film structure and parallel processing method for fabricating same 失效
标题翻译：多层薄膜结构及其制造方法
公开(公告)号：US5258236A
公开(公告)日：1993-11-02
申请号：US695368
申请日：1991-05-03
申请人： Gnanalingam Arjavalingam , Alina Deutsch , Fuad E. Doany , Bruce K. Furman , Donald J. Hunt , Chandrasekhar Narayan , Modest M. Oprysko , Sampath Purushothaman , Vincent Ranieri , Stephen Renick , Jane M. Shaw , Janusz S. Wilczynski , David F. Witman
发明人： Gnanalingam Arjavalingam , Alina Deutsch , Fuad E. Doany , Bruce K. Furman , Donald J. Hunt , Chandrasekhar Narayan , Modest M. Oprysko , Sampath Purushothaman , Vincent Ranieri , Stephen Renick , Jane M. Shaw , Janusz S. Wilczynski , David F. Witman
IPC分类号： B23K26/00 , B32B37/00 , H01L21/68 , H01L23/12 , H01L23/15 , H05K3/00 , H05K3/46 , B32B15/04 , H01L29/12
CPC分类号： H01L21/6835 , H01L2221/68345 , H01L2221/68359 , H05K3/0011 , H05K3/46 , Y10T156/1158 , Y10T428/12528 , Y10T428/12549 , Y10T428/12569 , Y10T428/12611
摘要： A method and apparatus for releasing a workpiece from a substrate including providing a substrate which is transparent to a predetermined wavelength of electromagnetic radiation; forming, on the substrate, a separation layer which degrades in response to the predetermined radiation; providing the workpiece on the separation layer; and directing the predetermined radiation at the separation layer through the transparent substrate so as to degrade the separation layer and to separate the workpiece from the substrate.
摘要翻译：一种用于从衬底释放工件的方法和装置，包括提供对预定波长的电磁辐射是透明的衬底; 在衬底上形成响应于预定辐射而降解的分离层; 在分离层上提供工件; 并且通过透明基板将分离层处的预定辐射引导，以使分离层退化并将工件与基板分离。

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