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    • 6. 发明授权
    • Lateral MISFET and method for fabricating it
    • 侧面MISFET及其制造方法
    • US07821064B2
    • 2010-10-26
    • US11276782
    • 2006-03-14
    • Michael RuebMarkus SchmittCarolin TolksdorfUwe WahlArmin Willmeroth
    • Michael RuebMarkus SchmittCarolin TolksdorfUwe WahlArmin Willmeroth
    • H01L29/00
    • H01L29/782H01L29/0619H01L29/0696H01L29/7825
    • A lateral MISFET having a semiconductor body has a doped semiconductor substrate of a first conduction type and an epitaxial layer of a second conduction type, which is complementary to the first conduction type, the epitaxial layer being provided on the semiconductor substrate. This MISFET has, on the top side of the semiconductor body, a drain, a source, and a gate electrode with gate insulator. A semiconductor zone of the first conduction type is embedded in the epitaxial layer in a manner adjoining the gate insulator, a drift zone of the second conduction type being arranged between the semiconductor zone and the drain electrode in the epitaxial layer. The drift zone has pillar-type regions which are arranged in rows and columns and whose boundary layers have a metal layer which in each case forms a Schottky contact with the material of the drift zone.
    • 具有半导体本体的横向MISFET具有第一导电类型的掺杂半导体衬底和与第一导电类型互补的第二导电类型的外延层,外延层设置在半导体衬底上。 该MISFET在半导体本体的顶侧具有漏极,源极和具有栅极绝缘体的栅电极。 第一导电类型的半导体区域以与栅极绝缘体相邻的方式嵌入在外延层中,第二导电类型的漂移区被布置在外延层中的半导体区域和漏极之间。 漂移区具有排列成行和列的柱状区域,其边界层具有金属层,其在每种情况下与漂移区的材料形成肖特基接触。
    • 7. 发明申请
    • Lateral MISFET and method for fabricating it
    • 侧面MISFET及其制造方法
    • US20060261384A1
    • 2006-11-23
    • US11276782
    • 2006-03-14
    • Michael RuebMarkus SchmittCarolin TolksdorfUwe WahlArmin Willmeroth
    • Michael RuebMarkus SchmittCarolin TolksdorfUwe WahlArmin Willmeroth
    • H01L29/76
    • H01L29/782H01L29/0619H01L29/0696H01L29/7825
    • A lateral MISFET having a semiconductor body has a doped semiconductor substrate of a first conduction type and an epitaxial layer of a second conduction type, which is complementary to the first conduction type, the epitaxial layer being provided on the semiconductor substrate. This MISFET has, on the top side of the semiconductor body, a drain, a source, and a gate electrode with gate insulator. A semiconductor zone of the first conduction type is embedded in the epitaxial layer in a manner adjoining the gate insulator, a drift zone of the second conduction type being arranged between the semiconductor zone and the drain electrode in the epitaxial layer. The drift zone has pillar-type regions which are arranged in rows and columns and whose boundary layers have a metal layer which in each case forms a Schottky contact with the material of the drift zone.
    • 具有半导体本体的横向MISFET具有第一导电类型的掺杂半导体衬底和与第一导电类型互补的第二导电类型的外延层,外延层设置在半导体衬底上。 该MISFET在半导体本体的顶侧具有漏极,源极和具有栅极绝缘体的栅电极。 第一导电类型的半导体区域以与栅极绝缘体相邻的方式嵌入在外延层中,第二导电类型的漂移区被布置在外延层中的半导体区域和漏极之间。 漂移区具有排列成行和列的柱状区域,其边界层具有金属层,其在每种情况下与漂移区的材料形成肖特基接触。