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    • 8. 发明申请
    • METHOD OF FORMING GROUP IV SEMICONDUCTOR JUNCTIONS USING LASER PROCESSING
    • 使用激光加工形成IV族半导体结的方法
    • US20080305619A1
    • 2008-12-11
    • US12114141
    • 2008-05-02
    • Francesco LemmiAndreas MeiselHomer Antoniadis
    • Francesco LemmiAndreas MeiselHomer Antoniadis
    • H01L21/20H01L21/02
    • H01L31/182H01L21/0237H01L21/02524H01L21/02532H01L21/02601H01L21/02628H01L21/02675H01L31/03682H01L31/03921H01L31/068H01L31/077Y02E10/546Y02E10/547Y02P70/521
    • A method forming a Group IV semiconductor junction on a substrate is disclosed. The method includes depositing a first set Group IV semiconductor nanoparticles on the substrate. The method also includes applying a first laser at a first laser wavelength, a first fluence, a first pulse duration, a first number of repetitions, and a first repetition rate to the first set Group IV semiconductor nanoparticles to form a first densified film with a first thickness, wherein the first laser wavelength and the first fluence are selected to limit a first depth profile of the first laser to the first thickness. The method further includes depositing a second set Group IV semiconductor nanoparticles on the first densified film. The method also includes applying a second laser at a second laser wavelength, a second fluence, a second pulse duration, a second number of repetitions, and a second repetition rate to the second set Group IV semiconductor nanoparticles to form a second densified film with a second thickness, wherein the second laser wavelength and the second fluence are selected to limit a second depth profile of the second laser to the second thickness.
    • 公开了一种在衬底上形成IV族半导体结的方法。 该方法包括在衬底上沉积第一组IV族半导体纳米颗粒。 该方法还包括将第一激光波长的第一激光,第一注量,第一脉冲持续时间,第一次重复和第一重复率应用于第一组IV族半导体纳米颗粒,以形成第一致密化膜,其具有 第一厚度,其中选择第一激光波长和第一注量以将第一激光器的第一深度分布限制到第一厚度。 该方法还包括在第一致密化膜上沉积第二组IV族半导体纳米颗粒。 该方法还包括将第二激光器以第二激光波长,第二注量,第二脉冲持续时间,第二数量的重复和第二重复率施加到第二组IV族半导体纳米颗粒以形成第二致密化膜,其具有 第二厚度,其中选择第二激光波长和第二注量以将第二激光器的第二深度分布限制到第二厚度。
    • 10. 发明申请
    • METHODS OF FORMING A MULTI-DOPED JUNCTION WITH POROUS SILICON
    • 用多孔硅形成多层结的方法
    • US20110003466A1
    • 2011-01-06
    • US12794188
    • 2010-06-04
    • Giuseppe ScarderaHomer AntoniadisNick CravalhoMaxim KelmanElena RogojinaKarel Vanheusden
    • Giuseppe ScarderaHomer AntoniadisNick CravalhoMaxim KelmanElena RogojinaKarel Vanheusden
    • H01L21/22
    • H01L21/2255H01L31/022425H01L31/068H01L31/1804Y02E10/547Y02P70/521
    • A method of forming a multi-doped junction on a substrate is disclosed. The method includes providing the substrate doped with boron atoms, the substrate comprising a front crystalline substrate surface; and forming a mask on the front crystalline substrate surface, the mask comprising exposed mask areas and non-exposed mask areas. The method also includes exposing the mask to an etchant, wherein porous silicon is formed on the front crystalline substrate surface defined by the exposed mask areas; and removing the mask. The method further includes exposing the substrate to a dopant source in a diffusion furnace with a deposition ambient, the deposition ambient comprising POCl3 gas, at a first temperature and for a first time period, wherein a PSG layer is formed on the front substrate surface; and heating the substrate in a drive-in ambient to a second temperature and for a second time period. Wherein a first diffused region with a first sheet resistance is formed under the porous silicon and a second diffused region with a second sheet resistance is formed under the front crystalline substrate surface without the porous silicon, and wherein the first sheet resistance is substantially smaller than the second sheet resistance.
    • 公开了一种在衬底上形成多掺杂结的方法。 该方法包括提供掺杂有硼原子的衬底,该衬底包括前结晶衬底表面; 以及在所述前晶体衬底表面上形成掩模,所述掩模包括暴露的掩模区域和未暴露的掩模区域。 该方法还包括将掩模暴露于蚀刻剂,其中多孔硅形成在由暴露的掩模区限定的前结晶衬底表面上; 并取下面罩。 该方法还包括在第一温度和第一时间段内,使沉积环境包括沉积环境包含POCl 3气体的扩散炉中的衬底暴露于掺杂剂源,其中在前衬底表面上形成PSG层; 以及将驱动环境中的衬底加热至第二温度并持续第二时间段。 其中在多孔硅下方形成具有第一薄层电阻的第一扩散区域,并且在没有多孔硅的前结晶衬底表面下形成具有第二薄层电阻的第二扩散区域,并且其中第一薄层电阻显着小于 第二片电阻。