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    • 9. 发明申请
    • METHOD OF FORMING GROUP IV SEMICONDUCTOR JUNCTIONS USING LASER PROCESSING
    • 使用激光加工形成IV族半导体结的方法
    • US20080305619A1
    • 2008-12-11
    • US12114141
    • 2008-05-02
    • Francesco LemmiAndreas MeiselHomer Antoniadis
    • Francesco LemmiAndreas MeiselHomer Antoniadis
    • H01L21/20H01L21/02
    • H01L31/182H01L21/0237H01L21/02524H01L21/02532H01L21/02601H01L21/02628H01L21/02675H01L31/03682H01L31/03921H01L31/068H01L31/077Y02E10/546Y02E10/547Y02P70/521
    • A method forming a Group IV semiconductor junction on a substrate is disclosed. The method includes depositing a first set Group IV semiconductor nanoparticles on the substrate. The method also includes applying a first laser at a first laser wavelength, a first fluence, a first pulse duration, a first number of repetitions, and a first repetition rate to the first set Group IV semiconductor nanoparticles to form a first densified film with a first thickness, wherein the first laser wavelength and the first fluence are selected to limit a first depth profile of the first laser to the first thickness. The method further includes depositing a second set Group IV semiconductor nanoparticles on the first densified film. The method also includes applying a second laser at a second laser wavelength, a second fluence, a second pulse duration, a second number of repetitions, and a second repetition rate to the second set Group IV semiconductor nanoparticles to form a second densified film with a second thickness, wherein the second laser wavelength and the second fluence are selected to limit a second depth profile of the second laser to the second thickness.
    • 公开了一种在衬底上形成IV族半导体结的方法。 该方法包括在衬底上沉积第一组IV族半导体纳米颗粒。 该方法还包括将第一激光波长的第一激光,第一注量,第一脉冲持续时间,第一次重复和第一重复率应用于第一组IV族半导体纳米颗粒,以形成第一致密化膜,其具有 第一厚度,其中选择第一激光波长和第一注量以将第一激光器的第一深度分布限制到第一厚度。 该方法还包括在第一致密化膜上沉积第二组IV族半导体纳米颗粒。 该方法还包括将第二激光器以第二激光波长,第二注量,第二脉冲持续时间,第二数量的重复和第二重复率施加到第二组IV族半导体纳米颗粒以形成第二致密化膜,其具有 第二厚度,其中选择第二激光波长和第二注量以将第二激光器的第二深度分布限制到第二厚度。