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1. 发明申请

US20060169597A1 Method and composition for polishing a substrate 审中-公开
标题翻译：抛光基材的方法和组合物
公开(公告)号：US20060169597A1
公开(公告)日：2006-08-03
申请号：US11356352
申请日：2006-02-15
申请人： Feng Liu , Tianbao Du , Alain Duboust , Wei-Yung Hsu , Robert Ewald , Yuan Tian , You Wang , Stan Tsai
发明人： Feng Liu , Tianbao Du , Alain Duboust , Wei-Yung Hsu , Robert Ewald , Yuan Tian , You Wang , Stan Tsai
IPC分类号： B23H9/00 , B23H7/00
CPC分类号： C25F3/02 , B23H5/08
摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, a corrosion inhibitor having an azole group, an organic acid salt, a pH adjusting agent to provide a pH between about 2 and about 10, and a solvent, and a solvent. The composition may be used in a conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer. The polishing compositions and methods described herein improve the effective removal rate of materials from the substrate surface, such as copper, with a reduction in planarization type defects and yielding a desirable surface finish.
摘要翻译：提供了抛光组合物和从衬底表面去除导电材料的方法。在一个方面，组合物包括酸基电解质体系，具有唑基的腐蚀抑制剂，有机酸盐，pH调节剂以提供约2至约10的pH以及溶剂和溶剂。该组合物可以用于导电材料去除工艺中，包括在包括电极的工艺设备中设置其上形成有导电材料层的衬底，在电极和衬底之间提供组合物，在电极和衬底之间施加偏压，以及从导电材料层去除导电材料。本文所述的抛光组合物和方法提高了材料从衬底表面（例如铜）的有效去除速率，同时平坦化型缺陷减少并产生理想的表面光洁度。

2. 发明申请

US20070099552A1 CONDUCTIVE PAD WITH ION EXCHANGE MEMBRANE FOR ELECTROCHEMICAL MECHANICAL POLISHING 失效
标题翻译：带有离子交换膜的电化学机械电化学机械抛光
公开(公告)号：US20070099552A1
公开(公告)日：2007-05-03
申请号：US11555145
申请日：2006-10-31
申请人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel Carl , Ralph Wadensweiler , Manoocher Birang , Paul Butterfield , Rashid Mavliev , Stan Tsai , You Wang , Jie Diao , Renhe Jia , Lakshmanan Karuppiah , Robert Ewald
发明人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel Carl , Ralph Wadensweiler , Manoocher Birang , Paul Butterfield , Rashid Mavliev , Stan Tsai , You Wang , Jie Diao , Renhe Jia , Lakshmanan Karuppiah , Robert Ewald
IPC分类号： B23F21/03
CPC分类号： B24B37/046 , B24B27/0023 , B24B37/24 , B24B37/26 , B24D3/34 , B82Y30/00
摘要： An article of manufacture and apparatus are provided for processing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive polishing surface. An electrode is disposed below the polishing surface having a dielectric material therebetween. A plurality of apertures may be formed in the polishing surface and the dielectric material to at least partially expose the electrode to the polishing surface. A membrane may be disposed between the electrode and the polishing surface that is permeable to ions and current to promote continuity between the electrode and the polishing surface.
摘要翻译：提供了一种用于处理基板表面的制造和设备。在一个方面，提供了一种用于抛光衬底的制品，所述衬底包括具有至少部分导电的抛光表面的主体的抛光制品。电极设置在其间具有介电材料的抛光表面下方。可以在抛光表面和电介质材料中形成多个孔，以至少部分地将电极暴露于抛光表面。可以在电极和抛光表面之间设置膜，其可透过离子和电流，以促进电极和抛光表面之间的连续性。

3. 发明申请

US20080108288A1 Conductive Polishing Article for Electrochemical Mechanical Polishing 审中-公开
标题翻译：电化学机械抛光导电抛光制品
公开(公告)号：US20080108288A1
公开(公告)日：2008-05-08
申请号：US11934878
申请日：2007-11-05
申请人： Yongqi Hu , Yan Wang , Alain Duboust , Stan Tsai , Feng Liu , Liang-Yuh Chen , Robert Ewald
发明人： Yongqi Hu , Yan Wang , Alain Duboust , Stan Tsai , Feng Liu , Liang-Yuh Chen , Robert Ewald
IPC分类号： B24B39/06 , H01L21/3105
CPC分类号： B23H5/08 , B23H5/10 , B24B37/046 , B24B37/14 , B24B37/16 , B24B37/205 , B24B37/22 , B24B37/24 , B24B37/26 , B24B53/017 , H01L21/32125
摘要： Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft material and, in one embodiment, the exposed surface may be planar.
摘要翻译：提供了用于处理基板的抛光制品的实施例。在一个实施例中，用于处理衬底的抛光制品包括其上设置有导电层的织物层。导电层具有适于抛光衬底的暴露表面。织物层可以是编织的或非织造的。导电层可以由软质材料组成，并且在一个实施例中，暴露表面可以是平面的。

4. 发明申请

US20070144915A1 PROCESS AND COMPOSITION FOR PASSIVATING A SUBSTRATE DURING ELECTROCHEMICAL MECHANICAL POLISHING 审中-公开
标题翻译：电化学机械抛光过程中用于剥离基材的方法和组合
公开(公告)号：US20070144915A1
公开(公告)日：2007-06-28
申请号：US11613918
申请日：2006-12-20
申请人： Yuan Tian , Renhe Jia , Feng Liu , Yongqi Hu , Stan Tsai , Liang-Yuh Chen , Robert Ewald
发明人： Yuan Tian , Renhe Jia , Feng Liu , Yongqi Hu , Stan Tsai , Liang-Yuh Chen , Robert Ewald
IPC分类号： B23H7/00 , H05K3/07
CPC分类号： C25F3/02 , B23H5/08 , H01L21/32125
摘要： Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a method of electrochemically processing a substrate using a conductive polishing article is provided. The method includes disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising a cathode coupled to the conductive polishing article and an anode, wherein the substrate is in electrical contact with the anode, supplying a polishing composition comprising a cathodic inhibitor and an anodic inhibitor, forming a protective film on the cathode to prevent corrosion of the cathode, and polishing the substrate. In another embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes a corrosion inhibitor selected from the group of an amino acid based inhibitor, a polymeric based corrosion inhibitor, an oxidizer, a chelating inhibitor or combinations thereof.
摘要翻译：提供了用于处理其上设置有导电材料层的基板的组合物和方法。在一个实施例中，提供了使用导电抛光制品电化学处理衬底的方法。该方法包括将包括形成在其上的导电材料层的衬底放置在包括耦合到导电抛光制品的阴极和阳极的处理装置中，其中衬底与阳极电接触，提供包含阴极抑制剂的抛光组合物，阳极抑制剂，在阴极上形成保护膜以防止阴极腐蚀，并抛光衬底。在另一个实施方案中，提供了一种用于处理其上设置有导电材料层的基材的组合物，其组成包括选自氨基酸基抑制剂，聚合物基腐蚀抑制剂，氧化剂，螯合抑制剂或组合的腐蚀抑制剂其中。

5. 发明授权

US07344432B2 Conductive pad with ion exchange membrane for electrochemical mechanical polishing 失效
标题翻译：带离子交换膜的导电垫用于电化学机械抛光
公开(公告)号：US07344432B2
公开(公告)日：2008-03-18
申请号：US11555145
申请日：2006-10-31
申请人： Liang-Yun Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid A. Mavliev , Stan D. Tsai , You Wang , Jie Diao , Renhe Jia , Lakshmanan Karuppiah , Robert Ewald
发明人： Liang-Yun Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid A. Mavliev , Stan D. Tsai , You Wang , Jie Diao , Renhe Jia , Lakshmanan Karuppiah , Robert Ewald
IPC分类号： B23H5/06 , B23H3/00 , B24D11/02 , C25F3/30 , B24B49/00 , H05K3/07
CPC分类号： B24B37/046 , B24B27/0023 , B24B37/24 , B24B37/26 , B24D3/34 , B82Y30/00
摘要： An article of manufacture and apparatus are provided for processing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive polishing surface. An electrode is disposed below the polishing surface having a dielectric material therebetween. A plurality of apertures may be formed in the polishing surface and the dielectric material to at least partially expose the electrode to the polishing surface. A membrane may be disposed between the electrode and the polishing surface that is permeable to ions and current to promote continuity between the electrode and the polishing surface.
摘要翻译：提供了一种用于处理基板表面的制造和设备。在一个方面，提供了一种用于抛光衬底的制品，所述衬底包括具有至少部分导电的抛光表面的主体的抛光制品。电极设置在其间具有介电材料的抛光表面下方。可以在抛光表面和电介质材料中形成多个孔，以至少部分地将电极暴露于抛光表面。可以在电极和抛光表面之间设置膜，其可透过离子和电流，以促进电极和抛光表面之间的连续性。

6. 发明申请

US20060276111A1 Conditioning element for electrochemical mechanical processing 审中-公开
标题翻译：电化学机械加工的调节元件
公开(公告)号：US20060276111A1
公开(公告)日：2006-12-07
申请号：US11142918
申请日：2005-06-02
申请人： Yuan Tian , Alpay Yilmaz , Gerald Alonzo , Martin Wohlert , Yongqi Hu , Stan Tsai , Robert Ewald , Shou-Sung Chang
发明人： Yuan Tian , Alpay Yilmaz , Gerald Alonzo , Martin Wohlert , Yongqi Hu , Stan Tsai , Robert Ewald , Shou-Sung Chang
IPC分类号： B24B1/00 , B24B33/00
CPC分类号： B24B53/017 , B24B53/12
摘要： Embodiments of a conditioning element for conditioning a processing pad are provided herein. In one embodiment, a conditioning element for conditioning a processing pad includes a body having a face. A plurality of diamond particles are disposed on the face and define a conditioning surface. The diamond particles are of a type selected from the group consisting of very blocky (4D), blocky (3D), and irregular (2D), and have a shape ratio less than or equal to 1.2. In one embodiment, the diamond particles have an average size of between about 85 and about 115 μm. In one embodiment, the size of the diamond particles may have a standard of deviation that is less than about 5 μm. In one embodiment, the diamond particles may have a spacing of greater than 400 μm.
摘要翻译：本文提供了用于调节加工垫的调节元件的实施例。在一个实施例中，用于调节处理垫的调节元件包括具有面的主体。多个金刚石颗粒设置在面上并限定调理表面。金刚石颗粒是选自非常块状（4D），块状（3D）和不规则（2D）的类型，并且具有小于或等于1.2的形状比。在一个实施方案中，金刚石颗粒的平均尺寸为约85至约115μm。在一个实施方案中，金刚石颗粒的尺寸可以具有小于约5μm的偏差标准。在一个实施例中，金刚石颗粒可以具有大于400μm的间隔。

7. 发明申请

US20060249395A1 Process and composition for electrochemical mechanical polishing 审中-公开
标题翻译：电化学机械抛光的工艺和组成
公开(公告)号：US20060249395A1
公开(公告)日：2006-11-09
申请号：US11389867
申请日：2006-03-27
申请人： You Wang , Junzi Zhao , Jie Diao , Renhe Jia , Stan Tsai , Lakshmanan Karuppiah , Robert Ewald
发明人： You Wang , Junzi Zhao , Jie Diao , Renhe Jia , Stan Tsai , Lakshmanan Karuppiah , Robert Ewald
IPC分类号： C09K13/00 , B23H9/00 , B23H3/00
CPC分类号： C09K3/1463 , B23H5/08
摘要： Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a leveler a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.
摘要翻译：提供了用于处理其上设置有导电材料层的基板的组合物和方法。在一个实施方案中，提供了一种用于处理其上设置有导电材料层的基材的组合物，其组成包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，pH调节剂，整理剂，溶剂，并且pH在约3至约10之间。该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，以及去除导电材料层。

8. 发明申请

US20060079244A1 System and method for collecting continuous location updates while minimizing overall network utilization 有权
标题翻译：用于收集连续位置更新同时最大限度地减少整体网络利用率的系统和方法
公开(公告)号：US20060079244A1
公开(公告)日：2006-04-13
申请号：US11223842
申请日：2005-09-09
申请人： Jeffrey Posner , Robert Ewald
发明人： Jeffrey Posner , Robert Ewald
IPC分类号： H04Q7/20
CPC分类号： H04W60/04 , H04L12/14 , H04L12/1432 , H04L67/18 , H04L67/24 , H04W64/00
摘要： A wireless device and method for providing location updates to a wireless network includes determining a current location of the wireless device, comparing the current location to a second location and transmitting a location update, including presence information, to the wireless network when the current location differs from the second location by at least a predetermined geographical distance. The predetermined geographical distance is determined in accordance with at least one of subscription information associated with the subscriber unit, including a subscription fee paid, an enabled service and a network state. The current location may be determined via GPS, wireless network based position determination or other method.
摘要翻译：用于向无线网络提供位置更新的无线设备和方法包括：当当前位置不同时确定无线设备的当前位置，将当前位置与第二位置进行比较，并向无线网络发送包括存在信息的位置更新从第二位置至少预定的地理距离。根据与用户单元相关联的订阅信息中的至少一个确定预定的地理距离，包括支付订阅费用，启用服务和网络状态。当前位置可以通过GPS，基于无线网络的位置确定或其他方法来确定。

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