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1. 发明申请

WO2005055369A2 METHODS FOR MAKING VERTICAL ELECTRICAL FEED THROUGH STRUCTURES 审中-公开
标题翻译：通过结构制作垂直电气进给的方法
公开(公告)号：WO2005055369A2
公开(公告)日：2005-06-16
申请号：PCT/US2004/039394
申请日：2004-11-22
申请人： FORMFACTOR, INC. , MATHIEU, Gaetan, L. , KHANDROS, Igor, K. , REYNOLDS, Carl, V.
发明人： MATHIEU, Gaetan, L. , KHANDROS, Igor, K. , REYNOLDS, Carl, V.
IPC分类号： H01R
CPC分类号： H05K3/42 , G01R1/06711 , G01R1/07307 , G01R3/00 , H05K3/308 , H05K2201/09836 , H05K2203/0338
摘要： Methods are provided for making vertical feed through electrical connection structures in a substrate or tile. The vertical feed throughs can be configured to make plated through holes usable for inserting and attaching connector probes. . Probes may be attached to the plated through holes or attachment wells to create resilient spring contacts to form a wafer probe card assembly. A twisted tube plated through hole structure is formed by supporting twisted sacrificial wires coated with the plating material in a substrate, and later etching away the wires. Vertical feed throughs can also be configured to make tiles attachable and detachable as a layer between other substrates. The vertical feed through paths are formed with one end of each feed through hole permanently encapsulating a first electrical contact, and a second end supporting another pluggable and unpluggable electrical probe contact. Decoupling capacitors can be further plugged into holes formed in close proximity to the vertical feed through holes to increase performance of the decoupling capacitor.
摘要翻译：提供了用于通过基底或瓦片中的电连接结构进行垂直馈送的方法。垂直进料通道可以配置为制造可用于插入和连接连接器探头的电镀通孔。。探针可以附着到电镀通孔或连接孔，以产生弹性弹簧触点，以形成晶片探针卡组件。通过将涂覆有电镀材料的扭转牺牲线支撑在基板中，并且随后蚀刻掉线来形成扭曲管镀通孔结构。垂直进料通道也可以被配置成使得瓦片可附着和分离成其它基底之间的层。垂直进料通道形成有每个进料通孔的一端，其永久地密封第一电接触，第二端支撑另一可插拔和可拔出的电探针接触。去耦电容器可以进一步插入靠近垂直馈通孔形成的孔中，以提高去耦电容的性能。

2. 发明申请

WO2007008790A2 PROBE CARD ASSEMBLY WITH AN INTERCHANGEABLE PROBE INSERT 审中-公开
标题翻译：探针卡组装与可交换的探头插入
公开(公告)号：WO2007008790A2
公开(公告)日：2007-01-18
申请号：PCT/US2006/026723
申请日：2006-07-07
申请人： FORMFACTOR, INC. , ELDRIDGE, Benjamin, N. , REYNOLDS, Carl, V. , KAWAMATA, Nobuhiro , SAEKI, Takao
发明人： ELDRIDGE, Benjamin, N. , REYNOLDS, Carl, V. , KAWAMATA, Nobuhiro , SAEKI, Takao
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G01R31/31905
摘要： A probe card assembly can include an insert holder configured to hold a probe insert, which can include probes disposed in a particular configuration for probing a device to be tested. The probe card assembly can provide an electrical interface to a tester that can control testing of the device, and while attached to the probe card assembly, the insert holder can hold the probe insert such that the probe insert is electrically connected to electrical paths within the probe card assembly that are part of the interface to the tester. The probe insert of the probe card assembly can be replaced by detaching the insert holder, replacing the probe insert with a new probe insert, and then reattaching the insert holder to the probe card assembly. The probe insert and holder can be integrally formed and comprise a single structure that can be detached from a probe card assembly and replaced with a different probe insert and holder.
摘要翻译：探针卡组件可以包括构造成保持探针插入件的插入物保持器，其可以包括以特定构造设置的探针，用于探测待测试的装置。探针卡组件可以向测试器提供电接口，该接口可以控制设备的测试，并且在附接到探针卡组件时，插入物保持器可以保持探针插入件，使得探针插入件电连接到内部的电路径探针卡组件是测试仪接口的一部分。探针卡组件的探针插入可以通过拆卸插入物夹持器，用新的探针插入物代替探针插入物，然后将插入物夹持器重新连接到探针卡组件来代替。探针插入物和保持器可以一体地形成并且包括可以从探针卡组件分离并且用不同的探针插入物和保持器代替的单个结构。

3. 发明申请

WO2002075783A2 WAFER LEVEL INTERPOSER 审中-公开
公开(公告)号：WO2002075783A2
公开(公告)日：2002-09-26
申请号：PCT/US2002/007863
申请日：2002-03-13
申请人： FORMFACTOR, INC. , ELDRIDGE, Benjamin, N. , REYNOLDS, Carl, V.
发明人： ELDRIDGE, Benjamin, N. , REYNOLDS, Carl, V.
IPC分类号： H01L
CPC分类号： G01R1/07378 , G01R1/07307 , H01L2924/0002 , H01L2924/00
摘要： Double-sided interposer assemblies and methods for forming and using them. In one example of the invention, an interposer comprises a substrate having a first surface and a second surface opposite of said first surface, a first plurality of contact elements disposed on said first side of said substrate, and a second plurality of contact elements disposed on said second surface of said substrate, wherein said interposer connects electronic devices via said first and said second plurality of contact elements.
摘要翻译：双面插入器组件及其形成和使用方法。在本发明的一个示例中，插入器包括具有第一表面和与所述第一表面相对的第二表面的基板，设置在所述基板的所述第一侧上的第一多个接触元件和设置在所述第一表面上的第二多个接触元件所述基板的所述第二表面，其中所述插入件经由所述第一和第二多个接触元件连接电子器件。

4. 发明申请

WO2009042976A3 APPARATUS FOR TESTING DEVICES 审中-公开
公开(公告)号：WO2009042976A3
公开(公告)日：2009-04-02
申请号：PCT/US2008/078036
申请日：2008-09-26
申请人： FORMFACTOR, INC. , HOBBS, Eric D. , KAWAMATA, Nobuhiro , MCFARLAND, Andrew W. , URAKAWA, Yoichi , REYNOLDS, Carl, V.
发明人： HOBBS, Eric D. , KAWAMATA, Nobuhiro , MCFARLAND, Andrew W. , URAKAWA, Yoichi , REYNOLDS, Carl, V.
IPC分类号： H01L21/66
摘要： Methods and apparatus for testing semiconductor devices are provided herein. In some embodiments, an assembly for testing semiconductor devices can include a probe card assembly; and a thermal barrier disposed proximate an upper surface of the probe card assembly, the thermal barrier can restrict thermal transfer between tester side boundary conditions and portions of the probe card assembly disposed beneath the thermal barrier.

5. 发明申请

WO2008070590A2 PROBING APPARATUS WITH GUARDED SIGNAL TRACES 审中-公开
标题翻译：具有防护信号迹线的探测设备
公开(公告)号：WO2008070590A2
公开(公告)日：2008-06-12
申请号：PCT/US2007/086199
申请日：2007-11-30
申请人： FORMFACTOR, INC. , ELDRIDGE, Benjamin, N. , REYNOLDS, Carl, V. , SAEKI, Takao , URAKAWA, Yoichi
发明人： ELDRIDGE, Benjamin, N. , REYNOLDS, Carl, V. , SAEKI, Takao , URAKAWA, Yoichi
IPC分类号： G01R31/02
CPC分类号： G01R1/18 , G01R1/07307 , G01R31/2889
摘要： probing apparatus can comprise a substrate, conductive signal traces, probes, and electromagnetic shielding. The substrate can have a first surface and a second surface opposite the first surface, and the electrically conductive first signal traces can be disposed on the first surface of the first substrate. The probes can be attached to the first signal traces, and the electromagnetic shielding structures can be disposed about the signal traces.
摘要翻译：探测装置可以包括衬底，导电信号迹线，探针和电磁屏蔽。基板可以具有第一表面和与第一表面相对的第二表面，并且导电的第一信号迹线可以设置在第一基板的第一表面上。探头可以连接到第一条信号线，电磁屏蔽结构可以设置在信号线周围。

6. 发明申请

WO2002075783A3 WAFER LEVEL INTERPOSER 审中-公开
公开(公告)号：WO2002075783A3
公开(公告)日：2002-09-26
申请号：PCT/US2002/007863
申请日：2002-03-13
申请人： FORMFACTOR, INC. , ELDRIDGE, Benjamin, N. , REYNOLDS, Carl, V.
发明人： ELDRIDGE, Benjamin, N. , REYNOLDS, Carl, V.
IPC分类号： H01L23/48
摘要： Double-sided interposer assemblies and methods for forming and using them. In one example of the invention, an interposer (1078) comprises a substrate having a first surface (1082) and a second surface (1086) opposite of said first surface, a first plurality of contact elements (1080) disposed on said first side (1082) of said substrate, and a second plurality of contact elements (1084) disposed on said second surface (1086) of said substrate, wherein said interposer (1078) connects electronic devices (1088, 1090) via said first and said second plurality of contact elements.

7. 发明公开

EP1904861A2 PROBE CARD ASSEMBLY WITH AN INTERCHANGEABLE PROBE INSERT 审中-公开
标题翻译：具有可互换测试插入PRÜFKARTENBAUGRUPPE
公开(公告)号：EP1904861A2
公开(公告)日：2008-04-02
申请号：EP06774597.6
申请日：2006-07-07
申请人： FormFactor, Inc.
发明人： ELDRIDGE, Benjamin, N. , SAEKI, Takao , KAWAMATA, Nobuhiro , REYNOLDS, Carl, V.
IPC分类号： G01R31/02
CPC分类号： G01R1/07364 , G01R1/07378
摘要： A probe card assembly can include an insert holder configured to hold a probe insert, which can include probes disposed in a particular configuration for probing a device to be tested. The probe card assembly can provide an electrical interface to a tester that can control testing of the device, and while attached to the probe card assembly, the insert holder can hold the probe insert such that the probe insert is electrically connected to electrical paths within the probe card assembly that are part of the interface to the tester. The probe insert of the probe card assembly can be replaced by detaching the insert holder, replacing the probe insert with a new probe insert, and then reattaching the insert holder to the probe card assembly. The probe insert and holder can be integrally formed and comprise a single structure that can be detached from a probe card assembly and replaced with a different probe insert and holder.

8. 发明申请

WO2004059331A2 APPARATUS AND METHOD FOR LIMITING OVER TRAVEL IN A PROBE CARD ASSEMBLY 审中-公开
标题翻译：用于限制探针卡组件中的旅行的装置和方法
公开(公告)号：WO2004059331A2
公开(公告)日：2004-07-15
申请号：PCT/US2003/040316
申请日：2003-12-15
申请人： FORMFACTOR, INC.
发明人： COOPER, Timothy, E. , ELDRIDGE, Benjamin, N. , REYNOLDS, Carl, V. , SHENOY, Ravindra, V.
IPC分类号： G01R1/073
CPC分类号： G01R31/2887 , G01R3/00 , G01R31/2886
摘要： Methods and apparatuses for testing semiconductor devices are disclosed. Over travel stops limit over travel of a device to be tested with respect to probes of a probe card assembly. Feedback control techniques are employed to control relative movement of the device and the probe card assembly. A probe card assembly includes flexible base for absorbing excessive over travel of the device to be tested with respect to the probe card assembly.
摘要翻译：公开了用于测试半导体器件的方法和设备。超程停止限制待测设备相对于探针卡组件的探针的行程。采用反馈控制技术来控制装置和探针卡组件的相对运动。探针卡组件包括柔性基座，用于吸收被测装置相对于探针卡组件的过度行进。

9. 发明申请

WO2003054564A2 PROBE CARD COVERING SYSTEM AND METHOD 审中-公开
标题翻译：探针卡覆盖系统和方法
公开(公告)号：WO2003054564A2
公开(公告)日：2003-07-03
申请号：PCT/US2002/040982
申请日：2002-12-19
申请人： FORMFACTOR, INC.
发明人： ELDRIDGE, Benjamin, N. , REYNOLDS, Carl, V.
IPC分类号： G01R31/316
CPC分类号： G01R31/2851 , G01R31/2886
摘要： The present invention discloses a cover over electrical contacts of a probe card used in testing die on a wafer. A testing machine is disclosed as having the covered probe card therein. Various mechanisms for uncovering the electrical contacts while it is located in the tester machine are disclosed.
摘要翻译：本发明公开了一种用于在晶片上测试模具的探针卡的电触点上的盖子。公开了一种在其中具有覆盖的探针卡的测试机。公开了用于在电触点位于测试器机器中时露出电触点的各种机构。

10. 发明申请

WO2003054564A3 PROBE CARD COVERING SYSTEM AND METHOD 审中-公开
公开(公告)号：WO2003054564A3
公开(公告)日：2003-07-03
申请号：PCT/US2002/040982
申请日：2002-12-19
申请人： FORMFACTOR, INC.
发明人： ELDRIDGE, Benjamin, N. , REYNOLDS, Carl, V.
IPC分类号： G01R31/316
摘要： The present invention discloses a cover (210) over electrical contacts (11) of a probe card used in testing die on a wafer. A testing machine is disclosed as having the covered probe card therein. Various mechanisms for uncovering the electrical contacts while it is located in the tester machine are disclosed.

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