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1. 发明申请

WO2009042976A3 APPARATUS FOR TESTING DEVICES 审中-公开
公开(公告)号：WO2009042976A3
公开(公告)日：2009-04-02
申请号：PCT/US2008/078036
申请日：2008-09-26
申请人： FORMFACTOR, INC. , HOBBS, Eric D. , KAWAMATA, Nobuhiro , MCFARLAND, Andrew W. , URAKAWA, Yoichi , REYNOLDS, Carl, V.
发明人： HOBBS, Eric D. , KAWAMATA, Nobuhiro , MCFARLAND, Andrew W. , URAKAWA, Yoichi , REYNOLDS, Carl, V.
IPC分类号： H01L21/66
摘要： Methods and apparatus for testing semiconductor devices are provided herein. In some embodiments, an assembly for testing semiconductor devices can include a probe card assembly; and a thermal barrier disposed proximate an upper surface of the probe card assembly, the thermal barrier can restrict thermal transfer between tester side boundary conditions and portions of the probe card assembly disposed beneath the thermal barrier.

2. 发明申请

WO2009042679A2 STIFFENER ASSEMBLY FOR USE WITH TESTING DEVICES 审中-公开
标题翻译：用于测试设备的增强器组件
公开(公告)号：WO2009042679A2
公开(公告)日：2009-04-02
申请号：PCT/US2008/077512
申请日：2008-09-24
申请人： FORMFACTOR, INC. , HOBBS, Eric D. , MCFARLAND, Andrew W.
发明人： HOBBS, Eric D. , MCFARLAND, Andrew W.
IPC分类号： G01R1/067 , H01L21/66 , H01R12/00
CPC分类号： G01R1/07378
摘要： A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener assembly for use with testing devices can be part of a probe card assembly that can include a stiffener assembly comprising an upper stiffener coupled to a plurality of lower stiffeners; and a substrate constrained between the upper stiffener and the plurality of lower stiffeners, the stiffener assembly restricting non-planar flex of the substrate while facilitating radial movement of the substrate with respect to the stiffener assembly.
摘要翻译：本文提供了用于测试设备的加强件组件。在一些实施例中，与测试装置一起使用的加强件组件可以是探针卡组件的一部分，该探针卡组件可以包括加强件组件，该加强件组件包括与多个下加强件耦合的上加强件; 以及限制在所述上加强件和所述多个下加强件之间的基板，所述加强件组件限制所述基板的非平面弯曲，同时促进所述基板相对于所述加强件组件的径向移动。

3. 发明申请

WO2009105497A3 APPARATUS AND METHOD FOR ADJUSTING THERMALLY INDUCED MOVEMENT OF ELECTRO-MECHANICAL ASSEMBLIES 审中-公开
公开(公告)号：WO2009105497A3
公开(公告)日：2009-08-27
申请号：PCT/US2009/034440
申请日：2009-02-19
申请人： FORMFACTOR, INC. , MCFARLAND, Andrew W. , YASUMURA, Kevin Y. , HOBBS, Eric D. , BREINLINGER, Keith J.
发明人： MCFARLAND, Andrew W. , YASUMURA, Kevin Y. , HOBBS, Eric D. , BREINLINGER, Keith J.
IPC分类号： H01L21/66 , G01R1/073
摘要： A thermal adjustment apparatus for adjusting one or more thermally induced movements of an electro-mechanical assembly includes: a compensating element expanding at a first rate different from a second rate at which the electro-mechanical assembly expands for generating a counteracting force in response to changes in temperature; and a coupling mechanism coupling the compensating element to the electro-mechanical assembly, and being adjustable to control an amount of the counteracting force applied to the electro-mechanical assembly as temperature changes.

4. 发明申请

WO2008082859A2 STIFFENER ASSEMBLY FOR USE WITH TESTING DEVICES 审中-公开
标题翻译：用于测试设备的增强器组件
公开(公告)号：WO2008082859A2
公开(公告)日：2008-07-10
申请号：PCT/US2007/086892
申请日：2007-12-08
申请人： FORMFACTOR, INC. , HOBBS, Eric D. , MCFARLAND, Andrew W.
发明人： HOBBS, Eric D. , MCFARLAND, Andrew W.
IPC分类号： H01L21/67 , G01R1/067 , G01R31/02
CPC分类号： G01R1/07378
摘要： A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener for use with testing devices includes an inner member; an outer member disposed in a predominantly spaced apart relation to the inner member; and a plurality of alignment mechanisms for orienting the inner and outer members with respect to each other, wherein the alignment mechanisms transfer forces applied to a lower surface of the inner member to the outer member and provide the predominant conductive heat transfer passageway between the inner and outer members.
摘要翻译：本文提供了用于测试设备的加强件组件。在一些实施例中，用于测试装置的加强件包括内部构件; 以与所述内部构件成主要间隔的关系设置的外部构件; 以及用于使内部构件和外部构件相对于彼此定向的多个对准机构，其中对准机构将施加到内部构件的下表面的力传递到外部构件，并且在内部构件和外部构件之间提供主导热传递通道外部成员。

5. 发明申请

WO2008042676A2 METHOD AND APPARATUS FOR INDIRECT PLANARIZATION 审中-公开
标题翻译：用于间接平面化的方法和装置
公开(公告)号：WO2008042676A2
公开(公告)日：2008-04-10
申请号：PCT/US2007/079612
申请日：2007-09-27
申请人： FORMFACTOR, INC. , HOBBS, Eric D. , SLOCUM, Alexander H.
发明人： HOBBS, Eric D. , SLOCUM, Alexander H.
IPC分类号： G01R31/02
CPC分类号： G01R1/07364
摘要： Methods and apparatus for indirect planarization of a substrate are provided herein. In one embodiment, an apparatus for indirectly planarizing a probe card assembly includes an adjustment portion for controlling a force applied to a probe substrate of the probe card assembly; a force application portion configured to apply the force to the probe substrate at a location that is laterally offset from the adjustment portion; and a mechanism coupling the adjustment portion to the force application portion.
摘要翻译：本文提供了用于衬底的间接平面化的方法和装置。在一个实施例中，用于间接平面化探针卡组件的装置包括用于控制施加到探针卡组件的探针基板的力的调节部分; 力施加部，其构造成在从所述调节部侧向偏移的位置处向所述探针基板施加力; 以及将调节部联接到力施加部的机构。

6. 发明申请

WO2009042940A2 COMPONENT ASSEMBLY AND ALIGNMENT 审中-公开
标题翻译：组件装配和对准
公开(公告)号：WO2009042940A2
公开(公告)日：2009-04-02
申请号：PCT/US2008/077984
申请日：2008-09-26
申请人： FORMFACTOR, INC. , ELDRIDGE, Benjamin, N. , HOBBS, Eric D. , MATHIEU, Gaetan, L.
发明人： ELDRIDGE, Benjamin, N. , HOBBS, Eric D. , MATHIEU, Gaetan, L.
IPC分类号： H01L21/66 , H01L21/68
CPC分类号： G01R31/2891 , G01R1/06716 , G01R1/07342 , G11C29/56 , G11C29/56016 , G11C2029/5602 , H01L21/682 , Y10T29/49002
摘要： A method or an apparatus for aligning a plurality of structures can include applying a first force in a first plane to a first structure. The method can also include constraining in the first plane the first structure with respect to a second structure such that the first structure is in a position with respect to the second structure that aligns first features on the first structure with second features on the second structures. The second feature can be in a second plane that is generally parallel to the first plane. The first and second structures can be first and second electronic components, which can be components of a probe card assembly.
摘要翻译：用于对准多个结构的方法或设备可以包括将第一平面中的第一力施加到第一结构。该方法还可以包括在第一平面中约束相对于第二结构的第一结构，使得第一结构相对于将第一结构上的第一特征与第二结构上的第二特征对准的第二结构处于相对位置。第二特征可以在通常平行于第一平面的第二平面中。第一和第二结构可以是第一和第二电子部件，其可以是探针卡组件的部件。

7. 发明申请

WO2008008570A2 SAWING TILE CORNERS ON PROBE CARD SUBSTRATES 审中-公开
标题翻译：在探针卡片基板上锯成角度
公开(公告)号：WO2008008570A2
公开(公告)日：2008-01-17
申请号：PCT/US2007/069816
申请日：2007-05-25
申请人： FORMFACTOR, INC. , ELDRIDGE, Benjamin, N. , MATHEWS, Peter B. , SHINDE, Makarand, S. , HOBBS, Eric D. , HENSON, Roy, J.
发明人： ELDRIDGE, Benjamin, N. , MATHEWS, Peter B. , SHINDE, Makarand, S. , HOBBS, Eric D. , HENSON, Roy, J.
IPC分类号： G01R31/26
CPC分类号： G01R1/07342
摘要： A composite substrate for testing semiconductor devices is formed by selecting a plurality of substantially identical individual substrates, cutting a corner from at least some of the individual substrates in accordance with their position in a final array configuration, and then assembling the individual substrates into the final array configuration. The final array configuration of substrates with corners cut or sawed away conforms more closely to the surface area of a wafer being tested, and can easily fit within space limits of a test environment.
摘要翻译：用于测试半导体器件的复合衬底通过选择多个基本上相同的单独衬底形成，根据它们在最终阵列构型中的位置从至少一些单个衬底切割拐角，然后将各个衬底组装成最终阵列配置。具有切割或锯切的角落的基底的最终阵列配置更接近于正被测试的晶片的表面积，并且可以容易地配合在测试环境的空间极限内。

8. 发明申请

WO2012128907A2 NON-LINEAR VERTICAL LEAF SPRING 审中-公开
标题翻译：非线性垂直叶子弹簧
公开(公告)号：WO2012128907A2
公开(公告)日：2012-09-27
申请号：PCT/US2012/027216
申请日：2012-03-01
申请人： FORMFACTOR, INC. , BREINLINGER, Keith J. , ARMSTRONG, Michael J. , ELDRIDGE, Benjamin N. , GRITTERS, John K. , HOBBS, Eric D.
发明人： BREINLINGER, Keith J. , ARMSTRONG, Michael J. , ELDRIDGE, Benjamin N. , GRITTERS, John K. , HOBBS, Eric D.
IPC分类号： G01R1/067 , G01R31/26 , G01R31/28
CPC分类号： G01R1/06716 , G01R1/06733 , G01R1/07357 , H01R13/2407 , H01R43/16 , Y10T29/49204
摘要： An electrically conductive contact element can include a first base and a second base with elongate, spaced apart leaves between the bases. A first end of each leaf can be coupled to the first base and an opposite second end of the leaf can be coupled to the second base. A body of the leaf between the first end and the second end can be sufficiently elongate to respond to a force through said contact element substantially parallel with the first axis and the second axis by first compressing axially while said force is less than a buckling force and then bending while said force is greater than the buckling force.
摘要翻译：导电接触元件可以包括第一基部和在基部之间具有细长间隔开的叶片的第二基部。每个叶片的第一端可以联接到第一基部，并且叶片的相对的第二端可以联接到第二基部。在第一端和第二端之间的叶片的主体可以是足够伸长的，以响应于通过所述接触元件的力，所述力通过在所述力小于屈曲力的同时第一轴向压缩而基本上平行于第一轴线和第二轴线，并且然后在所述力大于屈曲力时弯曲。

9. 发明申请

WO2012082510A3 PROBE CARD STIFFENER WITH DECOUPLING 审中-公开
公开(公告)号：WO2012082510A3
公开(公告)日：2012-06-21
申请号：PCT/US2011/063889
申请日：2011-12-08
申请人： FORMFACTOR, INC. , CHANG, Kevin S. , HOBBS, Eric D.
发明人： CHANG, Kevin S. , HOBBS, Eric D.
IPC分类号： H01L21/66 , G01R1/073
摘要： A stiffener for a probe card assembly can include decoupling mechanisms disposed within radial arms of the stiffener. The decoupling mechanisms can be compliant in a direction along a radial direction of said radial arm and rigid in a direction perpendicular to said radial arm. The decoupling mechanisms can decouple the stiffener from thermally induced differential radial contraction and expansion of the stiffener relative to the cardholder to which the stiffener is mounted. This can reduce thermally-induced vertical translation of the probe card assembly.

10. 发明申请

WO2011082180A2 TEST SYSTEMS AND METHODS FOR TESTING ELECTRONIC DEVICES 审中-公开
标题翻译：用于测试电子设备的测试系统和方法
公开(公告)号：WO2011082180A2
公开(公告)日：2011-07-07
申请号：PCT/US2010/062256
申请日：2010-12-28
申请人： FORMFACTOR, INC. , BERRY, Tommie E. , BREINLINGER, Keith J. , HOBBS, Eric D. , LORANGER, Marc , SLOCUM, Alexander H. , WILSON, Adrian S.
发明人： BERRY, Tommie E. , BREINLINGER, Keith J. , HOBBS, Eric D. , LORANGER, Marc , SLOCUM, Alexander H. , WILSON, Adrian S.
IPC分类号： G01R31/26 , H01L21/66
CPC分类号： G01R31/2891
摘要： Devices under test (DUTs) can be tested in a test system that includes an aligner and test cells. A DUT can be moved into and clamped in an aligned position on a carrier in the aligner. In the align position, electrically conductive terminals of the DUT can be in a predetermined position with respect to carrier alignment features of the carrier. The DUT/carrier combination can then be moved from the aligner into one of the test cells, where alignment features of the carrier are mechanically coupled with alignment features of a contactor in the test cell. The mechanical coupling automatically aligns terminals of the DUT with probes of the contactor. The probes thus contact and make electrical connections with the terminals of the DUT. The DUT is then tested. The aligner and each of the test cells can be separate and independent devices so that a DUT can be aligned in the aligner while other DUTs, having previously been aligned to a carrier in the aligner, are tested in a test cell.
摘要翻译：被测器件（DUT）可以在包括对准器和测试单元的测试系统中进行测试。被测设备可以被移入和对准在对准器中的载体上的对准位置。在对准位置，DUT的导电端子可以相对于载体的载体对准特征处于预定位置。然后可以将DUT /载体组合从对准器移动到其中一个测试单元中，其中载体的对准特征与测试单元中的接触器的对准特征机械耦合。机械耦合自动将DUT的端子与接触器的探针对齐。探头因此接触并与DUT的端子电连接。然后测试DUT。对准器和每个测试单元可以是分离的和独立的器件，以便DUT可以在对准器中对准，而先前已经与对准器中的载体对准的其他DUT在测试单元中进行测试。

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