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1. 发明申请

WO2007124050A2 PROBE STRUCTURES WITH ELECTRONIC COMPONENTS 审中-公开
标题翻译：具有电子元件的探测结构
公开(公告)号：WO2007124050A2
公开(公告)日：2007-11-01
申请号：PCT/US2007/009660
申请日：2007-04-19
申请人： FORMFACTOR, INC. , KHANDROS, Igor, K. , GRITTERS, John K.
发明人： KHANDROS, Igor, K. , GRITTERS, John K.
IPC分类号： G01R31/02
CPC分类号： G01R31/312 , G01R1/06727 , G01R1/06744 , G01R1/07342 , G01R3/00
摘要： A probe apparatus can include a substrate, a contact structure attached to the substrate, and an electronic component electrically connected to the contact structure. The electronic component can be attached to the contact structure.
摘要翻译：探针装置可以包括衬底，附接到衬底的接触结构和电连接到接触结构的电子部件。电子部件可以附接到接触结构。

2. 发明申请

WO2008024726A3 CARBON NANOTUBE CONTACT STRUCTURES 审中-公开
公开(公告)号：WO2008024726A3
公开(公告)日：2008-02-28
申请号：PCT/US2007/076345
申请日：2007-08-21
申请人： FORMFACTOR, INC. , ELDRIDGE, Benjamin, N. , GRITTERS, John K. , KHANDROS, Igor, K. , MARTENS, Rod , MATHIEU, Gaetan, L.
发明人： ELDRIDGE, Benjamin, N. , GRITTERS, John K. , KHANDROS, Igor, K. , MARTENS, Rod , MATHIEU, Gaetan, L.
IPC分类号： H01R12/00
摘要： A carbon nanotube contact structure (1400) can be used for making pressure connections to a DUT The contact structure can be formed using a carbon nanotube film (1100) or with carbon nanotubes in solution The carbon nanotube film can be grown in a trench in a sacrificial substrate in which a contact structure such as a beam or contact element (1403) is then formed by metal plating The film can also be formed on a contact element and have metal posts dispersed therein to provide rigidity and elasticity Contact structures or portions thereof can also be plated with a solution containing carbon nanotubes The resulting contact structure can be tough, and can provide good electrical conductivity.

3. 发明申请

WO2003007003A1 METHOD OF MANUFACTURING A PROBE CARD 审中-公开
标题翻译：制作探针卡的方法
公开(公告)号：WO2003007003A1
公开(公告)日：2003-01-23
申请号：PCT/US2002/022303
申请日：2002-07-10
申请人： FORMFACTOR, INC. , GRUBE, Gary, W. , KHANDROS, Igor, K. , ELDRIDGE, Benjamin, N. , MATHIEU, Gaetan, L. , LOTFIZADEH, Poya , TSENG, Chih-Chiang
发明人： GRUBE, Gary, W. , KHANDROS, Igor, K. , ELDRIDGE, Benjamin, N. , MATHIEU, Gaetan, L. , LOTFIZADEH, Poya , TSENG, Chih-Chiang
IPC分类号： G01R1/073
CPC分类号： G01R31/2886 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07378 , G01R3/00 , Y10T29/49126
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
摘要翻译：一种设计和制造探针卡组件的方法包括将探针卡组件的一个或多个元件预制成一个或多个预定的设计。此后，接收关于新设计的半导体器件的设计数据以及描述用于测试半导体器件的测试器和测试算法的数据。使用接收到的数据，选择一个或多个预制元素。再次使用接收的数据，定制一个或多个所选择的预制元素。然后使用选定和定制的元件构建探针卡组件。

4. 发明申请

WO2005081001A1 PROBING A DEVICE 审中-公开
标题翻译：探索一个设备
公开(公告)号：WO2005081001A1
公开(公告)日：2005-09-01
申请号：PCT/US2005/005087
申请日：2005-02-15
申请人： FORMFACTOR, INC. , COOPER, Timothy, E. , ELDRIDGE, Benjamin, N. , KHANDROS, Igor, K. , MARTENS, Rod , MATHIEU, Gaetan, L.
发明人： COOPER, Timothy, E. , ELDRIDGE, Benjamin, N. , KHANDROS, Igor, K. , MARTENS, Rod , MATHIEU, Gaetan, L.
IPC分类号： G01R31/02
CPC分类号： G01R31/2886 , G01R31/2887
摘要： An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.
摘要翻译：电子设备移动到第一位置，使得电子设备的端子是与端子电接触的相邻探头。然后电子设备水平或对角地移动，使得端子接触探针。然后通过探头将测试数据传送到电子设备和从电子设备传送。

5. 发明申请

WO2005055369A2 METHODS FOR MAKING VERTICAL ELECTRICAL FEED THROUGH STRUCTURES 审中-公开
标题翻译：通过结构制作垂直电气进给的方法
公开(公告)号：WO2005055369A2
公开(公告)日：2005-06-16
申请号：PCT/US2004/039394
申请日：2004-11-22
申请人： FORMFACTOR, INC. , MATHIEU, Gaetan, L. , KHANDROS, Igor, K. , REYNOLDS, Carl, V.
发明人： MATHIEU, Gaetan, L. , KHANDROS, Igor, K. , REYNOLDS, Carl, V.
IPC分类号： H01R
CPC分类号： H05K3/42 , G01R1/06711 , G01R1/07307 , G01R3/00 , H05K3/308 , H05K2201/09836 , H05K2203/0338
摘要： Methods are provided for making vertical feed through electrical connection structures in a substrate or tile. The vertical feed throughs can be configured to make plated through holes usable for inserting and attaching connector probes. . Probes may be attached to the plated through holes or attachment wells to create resilient spring contacts to form a wafer probe card assembly. A twisted tube plated through hole structure is formed by supporting twisted sacrificial wires coated with the plating material in a substrate, and later etching away the wires. Vertical feed throughs can also be configured to make tiles attachable and detachable as a layer between other substrates. The vertical feed through paths are formed with one end of each feed through hole permanently encapsulating a first electrical contact, and a second end supporting another pluggable and unpluggable electrical probe contact. Decoupling capacitors can be further plugged into holes formed in close proximity to the vertical feed through holes to increase performance of the decoupling capacitor.
摘要翻译：提供了用于通过基底或瓦片中的电连接结构进行垂直馈送的方法。垂直进料通道可以配置为制造可用于插入和连接连接器探头的电镀通孔。。探针可以附着到电镀通孔或连接孔，以产生弹性弹簧触点，以形成晶片探针卡组件。通过将涂覆有电镀材料的扭转牺牲线支撑在基板中，并且随后蚀刻掉线来形成扭曲管镀通孔结构。垂直进料通道也可以被配置成使得瓦片可附着和分离成其它基底之间的层。垂直进料通道形成有每个进料通孔的一端，其永久地密封第一电接触，第二端支撑另一可插拔和可拔出的电探针接触。去耦电容器可以进一步插入靠近垂直馈通孔形成的孔中，以提高去耦电容的性能。

6. 发明申请

WO2004059328A2 COMPOSITE MOTION PROBING 审中-公开
标题翻译：复合运动探测
公开(公告)号：WO2004059328A2
公开(公告)日：2004-07-15
申请号：PCT/US2003/040909
申请日：2003-12-18
申请人： FORMFACTOR, INC.
发明人： COOPER, Timothy, E. , ELDRIDGE, Benjamin, N. , KHANDROS, Igor, K. , MARTENS, Rod , MATHIEU, Gaetan, L.
IPC分类号： G01R1/00
CPC分类号： G01R31/2887 , G01R1/06705 , G01R31/2886
摘要： An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second movement tends to reduce that stress. Test data are then communicated to and from the electronic device through the probes.
摘要翻译：电子设备相对于用于与设备进行电接触的探针移动到第一位置。然后将电子设备移动到第二位置，在第二位置电子设备被压靠在探针上，从而压缩探针。进入第二个位置的运动包括两个部分。运动的一个组成部分倾向于将电子设备压在探针上，压缩探针并在探针中引起应力。第二乐章往往会减轻压力。测试数据然后通过探针与电子设备进行通信。

7. 发明申请

WO2003062322A1 APPARATUS AND METHOD FOR CLEANING TEST PROBES 审中-公开
标题翻译：清洁测试探针的装置和方法
公开(公告)号：WO2003062322A1
公开(公告)日：2003-07-31
申请号：PCT/US2003/001577
申请日：2003-01-16
申请人： FORMFACTOR, INC.
发明人： KHANDROS, Igor, K. , ELDRIDGE, Benjamin, N. , FANG, Treliant , MATHIEU, Gaetan, L. , GRUBE, Gary, W. , DRUSH, Michael, A. , BUCKHOLTZ, Christopher, C.
IPC分类号： C08L83/04
CPC分类号： C08G77/48 , B08B1/00 , B08B7/0028 , G01R1/06711 , G01R3/00 , Y10T428/24388 , Y10T428/31663
摘要： A probe cleaning apparatus for cleaning a probe tip use to test semiconductors dies having an abrasive substrate layer an a tacky gel layer on top of the abrasive surface of the abrasive substrate layer. The probe tip is cleaned by passing it through the tacky gel layer so that it comes in contact with the abrasive surface of the abrasive substrate, moving the probe tip across the abrasive surface of the substrate layer, and then removing the probe tip from the successive layers of the cleaning apparatus. The probe tip emerges from the cleaning apparatus free from debris associated with testing the semiconductor dies.
摘要翻译：用于清洁探针头的探针清洁装置用于测试在磨料基底层的研磨表面的顶部上具有磨料基底层和粘性凝胶层的半导体模具。通过将探针尖端通过粘性凝胶层进行清洁，使其与磨料基材的研磨表面接触，使探针尖端跨过基底层的研磨表面，然后从连续的层的清洁装置。探针尖端从清洁设备中出来，没有与测试半导体管芯相关的碎片。

8. 发明授权

EP1576378B1 COMPOSITE MOTION PROBING 有权
标题翻译：复合PRÜFKOPFBEWEGUNG
公开(公告)号：EP1576378B1
公开(公告)日：2009-08-19
申请号：EP03814300.4
申请日：2003-12-18
申请人： FormFactor, Inc.
发明人： COOPER, Timothy, E. , ELDRIDGE, Benjamin, N. , KHANDROS, Igor, K. , MARTENS, Rod , MATHIEU, Gaetan, L.
IPC分类号： G01R1/073 , G01R31/28
CPC分类号： G01R31/2887 , G01R1/06705 , G01R31/2886
摘要： An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second movement tends to reduce that stress. Test data are then communicated to and from the electronic device through the probes.

9. 发明公开

EP1576378A2 COMPOSITE MOTION PROBING 有权
标题翻译：复合运动探测
公开(公告)号：EP1576378A2
公开(公告)日：2005-09-21
申请号：EP03814300.4
申请日：2003-12-18
申请人： FormFactor, Inc.
发明人： COOPER, Timothy, E. , ELDRIDGE, Benjamin, N. , KHANDROS, Igor, K. , MARTENS, Rod , MATHIEU, Gaetan, L.
IPC分类号： G01R1/073
CPC分类号： G01R31/2887 , G01R1/06705 , G01R31/2886
摘要： An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second movement tends to reduce that stress. Test data are then communicated to and from the electronic device through the probes.
摘要翻译：电子设备相对于用于与设备进行电接触的探针移动到第一位置。然后将电子设备移动到第二位置，在第二位置电子设备被压靠在探针上，从而压缩探针。进入第二个位置的运动包括两个部分。运动的一个组成部分倾向于将电子设备压在探针上，压缩探针并在探针中引起应力。第二乐章往往会减轻压力。测试数据然后通过探针与电子设备进行通信。

10. 发明授权

EP1407280B1 METHOD OF MANUFACTURING A PROBE CARD 有权
标题翻译：一种用于制造针卡
公开(公告)号：EP1407280B1
公开(公告)日：2005-11-23
申请号：EP02742417.5
申请日：2002-07-10
申请人： FormFactor, Inc.
发明人： GRUBE, Gary, W. , KHANDROS, Igor, K. , ELDRIDGE, Benjamin, N. , MATHIEU, Gaetan, L. , LOTFIZADEH, Poya , TSENG, Chih-Chiang
IPC分类号： G01R1/073
CPC分类号： G01R31/2886 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07378 , G01R3/00 , Y10T29/49126
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.

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