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1. 发明申请

WO2003100446A2 HIGH PERFORMACE PROBE SYSTEM 审中-公开
标题翻译：高性能探测系统
公开(公告)号：WO2003100446A2
公开(公告)日：2003-12-04
申请号：PCT/US2003/014490
申请日：2003-05-07
申请人： FORMFACTOR, INC.
发明人： CHRAFT, Matthew, E. , HENSON, Roy, J. , MILLER, Charles, A. , TSENG, Chih-Chiang
IPC分类号： G01R1/073
CPC分类号： G01R1/07314 , G01R3/00
摘要： A probe system for providing signal paths between an integrated circuit (IC) tester and input/output, power and ground pads on the surfaces of ICs to be tested includes a probe board assembly, a flex cable and a set of probes arranged to contact the IC's I/O pads. The probe board assembly includes one or more rigid substrate layers with traces and vias formed on or within the substrate layers providing relatively low bandwidth signal paths linking the tester to probes accessing some of the IC's pads. The flex cable provides relatively high bandwidth signal paths linking the tester to probes accessing others of the IC's pads. A flex strip may alternatively be disposed behind a substrate with probes.
摘要翻译：用于在集成电路（IC）测试器和要测试的IC的表面上的输入/输出，电源和接地焊盘之间提供信号路径的探针系统包括探针板组件，柔性电缆和一组探针， IC的I / O焊盘。探针板组件包括一个或多个刚性衬底层，其具有形成在衬底层上或衬底层内的迹线和通孔，其提供将测试器连接到访问IC的一些衬垫的探针的相对低带宽的信号路径。柔性电缆提供相对高带宽的信号路径，将测试仪连接到访问IC其他焊盘的探针。柔性带可替代地设置在具有探针的基底之后。

2. 发明公开

EP1407280A1 METHOD OF MANUFACTURING A PROBE CARD 有权
标题翻译：一种用于制造针卡
公开(公告)号：EP1407280A1
公开(公告)日：2004-04-14
申请号：EP02742417.5
申请日：2002-07-10
申请人： FORMFACTOR, INC.
发明人： GRUBE, Gary, W. , KHANDROS, Igor, K. , ELDRIDGE, Benjamin, N. , MATHIEU, Gaetan, L. , LOTFIZADEH, Poya , TSENG, Chih-Chiang
IPC分类号： G01R1/073
CPC分类号： G01R31/2886 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07378 , G01R3/00 , Y10T29/49126
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.

3. 发明申请

WO2003100446A3 HIGH PERFORMANCE PROBE SYSTEM FOR TESTING SEMICONDUCTOR WAFERS 审中-公开
公开(公告)号：WO2003100446A3
公开(公告)日：2003-12-04
申请号：PCT/US2003/014490
申请日：2003-05-07
申请人： FORMFACTOR, INC.
发明人： CHRAFT, Matthew, E. , HENSON, Roy, J. , MILLER, Charles, A. , TSENG, Chih-Chiang
IPC分类号： G01R1/073
摘要： A probe system for providing signal paths between an integrated circuit (IC) tester (52) and input/output, power and ground pads (54) on the surfaces of ICs (56) to be tested includes a probe board assembly (50), a flex cable (86) and a set of probes (80) arranged to contact the IC's I/O pads (54). The probe board assembly (50) includes one or more rigid substrate layers (60, 62, 64) with traces and vias formed on or within the substrate layers providing relatively low bandwidth signal paths linking the tester (52) to probes (80) accessing some of the IC's pads (54). The flex cable (86) provides relatively high bandwidth signal paths linking the tester (52) to probes (80) accessing others of the IC's pads (54). A flex strip may alternatively be disposed behind a substrate with probes.

4. 发明申请

WO2003007003A1 METHOD OF MANUFACTURING A PROBE CARD 审中-公开
标题翻译：制作探针卡的方法
公开(公告)号：WO2003007003A1
公开(公告)日：2003-01-23
申请号：PCT/US2002/022303
申请日：2002-07-10
申请人： FORMFACTOR, INC. , GRUBE, Gary, W. , KHANDROS, Igor, K. , ELDRIDGE, Benjamin, N. , MATHIEU, Gaetan, L. , LOTFIZADEH, Poya , TSENG, Chih-Chiang
发明人： GRUBE, Gary, W. , KHANDROS, Igor, K. , ELDRIDGE, Benjamin, N. , MATHIEU, Gaetan, L. , LOTFIZADEH, Poya , TSENG, Chih-Chiang
IPC分类号： G01R1/073
CPC分类号： G01R31/2886 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07378 , G01R3/00 , Y10T29/49126
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
摘要翻译：一种设计和制造探针卡组件的方法包括将探针卡组件的一个或多个元件预制成一个或多个预定的设计。此后，接收关于新设计的半导体器件的设计数据以及描述用于测试半导体器件的测试器和测试算法的数据。使用接收到的数据，选择一个或多个预制元素。再次使用接收的数据，定制一个或多个所选择的预制元素。然后使用选定和定制的元件构建探针卡组件。

5. 发明授权

EP1407280B1 METHOD OF MANUFACTURING A PROBE CARD 有权
标题翻译：一种用于制造针卡
公开(公告)号：EP1407280B1
公开(公告)日：2005-11-23
申请号：EP02742417.5
申请日：2002-07-10
申请人： FormFactor, Inc.
发明人： GRUBE, Gary, W. , KHANDROS, Igor, K. , ELDRIDGE, Benjamin, N. , MATHIEU, Gaetan, L. , LOTFIZADEH, Poya , TSENG, Chih-Chiang
IPC分类号： G01R1/073
CPC分类号： G01R31/2886 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07378 , G01R3/00 , Y10T29/49126
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.

6. 发明公开

EP1506414A2 HIGH PEFORMANCE PROBE SYSTEM FOR TESTING SEMICONDUCTOR WAFERS 审中-公开
标题翻译：高性能探针测量系统的半导体晶圆
公开(公告)号：EP1506414A2
公开(公告)日：2005-02-16
申请号：EP03736564.0
申请日：2003-05-07
申请人： FORMFACTOR, INC.
发明人： CHRAFT, Matthew, E. , HENSON, Roy, J. , MILLER, Charles, A. , TSENG, Chih-Chiang
IPC分类号： G01R1/073 , G01R31/316
CPC分类号： G01R1/07314 , G01R3/00
摘要： A probe system for providing signal paths between an integrated circuit (IC) tester (52) and input/output, power and ground pads (54) on the surfaces of ICs (56) to be tested includes a probe board assembly (50), a flex cable (86) and a set of probes (80) arranged to contact the IC's I/O pads (54). The probe board assembly (50) includes one or more rigid substrate layers (60, 62, 64) with traces and vias formed on or within the substrate layers providing relatively low bandwidth signal paths linking the tester (52) to probes (80) accessing some of the IC's pads (54). The flex cable (86) provides relatively high bandwidth signal paths linking the tester (52) to probes (80) accessing others of the IC's pads (54). A flex strip may alternatively be disposed behind a substrate with probes.

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