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1. 发明申请

US20060076693A1 Self-releasing spring structures and methods 有权
标题翻译：自释弹簧结构及方法
公开(公告)号：US20060076693A1
公开(公告)日：2006-04-13
申请号：US10959180
申请日：2004-10-07
申请人： Thomas Hantschel , Sven Kosgalwies , David Fork , Eugene Chow
发明人： Thomas Hantschel , Sven Kosgalwies , David Fork , Eugene Chow
IPC分类号： H01L23/52
CPC分类号： G01R1/06716 , G01R3/00 , Y10T29/49609
摘要： According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.
摘要翻译：根据各种示例性实施例，公开了一种弹簧装置，其包括基板，设置在基板上的自放电层和设置在自放电层上的应力金属层，其中应力金属层内部的应力量导致剥离力高于自释放层和应力金属层之间的粘附力。此外，根据各种示例性实施例的制造弹簧装置的方法包括提供衬底，在衬底上提供自释放层，并在自释放层上方提供应力金属层，其中，在本发明中也公开了应力金属层导致比自发层和应力金属层之间的粘附力高的剥离力。

2. 发明申请

US20060105122A1 Micro-machined structure production using encapsulation 失效
公开(公告)号：US20060105122A1
公开(公告)日：2006-05-18
申请号：US10986712
申请日：2004-11-12
申请人： Thomas Hantschel , Sven Kosgalwies , Eugene Chow , Gordon Jagerson
发明人： Thomas Hantschel , Sven Kosgalwies , Eugene Chow , Gordon Jagerson
IPC分类号： B31B45/00
CPC分类号： B81C1/00666 , G01R1/06755 , G01R1/07357 , H01L2924/00013 , H01L2924/01006 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H05K3/4092 , Y10T29/49146 , Y10T29/49147 , Y10T29/49204 , Y10T428/13 , Y10T428/1317 , Y10T428/24174 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.

3. 发明申请

US20060057031A1 Capillary-channel probes for liquid pickup, transportation and dispense using stressy metal 有权
标题翻译：用于采用压力金属的液体拾取，运输和分配的毛细管通道探头
公开(公告)号：US20060057031A1
公开(公告)日：2006-03-16
申请号：US11267762
申请日：2005-11-03
申请人： Thomas Hantschel , David Fork , Eugene Chow , Dirk De Bruyker , Michel Rosa
发明人： Thomas Hantschel , David Fork , Eugene Chow , Dirk De Bruyker , Michel Rosa
IPC分类号： B01L3/00 , G01N33/00
CPC分类号： G01N35/1074 , B01J2219/00387 , B01L3/0244 , B01L3/0255 , B01L3/502715 , B01L2300/0819 , B01L2400/025 , B01L2400/0406 , B41J2/14314 , B41J2/16 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1639 , B41J2/1643 , C40B60/14 , G01N35/1009 , G01N2035/00237 , G01N2035/1037 , G03F7/0002 , Y10T436/2575
摘要： Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved.
摘要翻译：公开了可用于微阵列系统，浸笔纳米光刻系统，流体回路和微流体系统的流体导管，其使用包括至少一个毛细通道的通道弹簧探针。由释放时从基板弯曲的弹簧梁（例如，应力金属梁）形成，通道可以集成到弹簧梁中或形成在弹簧梁上。由窄通道产生的毛细管力允许液体被通道弹簧探针收集，保持和分配。由于可以使用传统的半导体工艺制造通道弹簧梁，所以可以实现显着的设计灵活性和成本效率。

4. 发明申请

US20050006829A1 High force metal plated spring structure 有权
标题翻译：高强度金属电镀弹簧结构
公开(公告)号：US20050006829A1
公开(公告)日：2005-01-13
申请号：US10615653
申请日：2003-07-08
申请人： Eugene Chow , David Fork , Thomas Hantschel , Koenraad Van Schuylenbergh , Christopher Chua
发明人： Eugene Chow , David Fork , Thomas Hantschel , Koenraad Van Schuylenbergh , Christopher Chua
IPC分类号： F16F1/02 , H01L27/148 , F16F1/00 , F16F9/00 , H01L29/768
CPC分类号： F16F1/027
摘要： Lithographically defined and etched spring structures are produced by various methods such that they avoid the formation of a plated metal wedge on an underside of the spring structure after release. A post is utilized to offset the spring from an underlying substrate by a distance greater than the thickness of the plated metal. A trench is etched into the substrate below the spring to provide clearance during deflection of the spring. Another spring includes a knee (bend) that provides the necessary clearance during deflection. A plating process is limited to the upper side of another spring. A released spring is used as a shadow mask for patterning resist that prevents wedge formation during plating. Various tip arrangements are disclosed that can be utilized with each spring structure
摘要翻译：通过各种方法制造光刻定义和蚀刻的弹簧结构，使得它们在释放之后避免在弹簧结构的下侧上形成电镀金属楔。使用柱子将弹簧从下面的衬底偏移大于电镀金属的厚度的距离。在弹簧下方的衬底中蚀刻沟槽，以在弹簧偏转期间提供间隙。另一个弹簧包括在偏转期间提供必要的间隙的膝盖（弯头）。电镀工艺限于另一弹簧的上侧。释放的弹簧用作用于图案化抗蚀剂的荫罩，其防止电镀期间的楔形成。公开了可以与每个弹簧结构一起使用的各种尖端装置

5. 发明授权

US08080293B2 Micro-machined structure production using encapsulation 有权
标题翻译：微加工结构生产采用封装
公开(公告)号：US08080293B2
公开(公告)日：2011-12-20
申请号：US12728047
申请日：2010-03-19
申请人： Thomas Hantschel , Sven Kosgalwies , Eugene M. Chow , Gordon Todd Jagerson, Jr.
发明人： Thomas Hantschel , Sven Kosgalwies , Eugene M. Chow , Gordon Todd Jagerson, Jr.
IPC分类号： H01R12/00
CPC分类号： B81C1/00666 , G01R1/06755 , G01R1/07357 , H01L2924/00013 , H01L2924/01006 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H05K3/4092 , Y10T29/49146 , Y10T29/49147 , Y10T29/49204 , Y10T428/13 , Y10T428/1317 , Y10T428/24174 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.
摘要翻译：微加工（例如，应力工程弹簧）结构通过形成剥离层，形成部分或完全封装的梁/弹簧结构，然后通过蚀刻释放层来释放梁/弹簧结构来制造。封装结构在释放期间保护梁/弹簧，因此释放层和梁/弹簧都可以使用电镀和/或使用相同的材料形成。封装结构可以是金属，抗蚀剂，聚合物，氧化物或氮化物，并且可以在释放过程之后被去除，或者作为完成的微加工结构的一部分保留。

6. 发明申请

US20090077807A1 Self-Releasing Spring Structures And Methods 有权
标题翻译：自我释放弹簧结构与方法
公开(公告)号：US20090077807A1
公开(公告)日：2009-03-26
申请号：US12256060
申请日：2008-10-22
申请人： Thomas Hantschel , Sven Kosgalwies , David K. Fork , Eugene M. Chow
发明人： Thomas Hantschel , Sven Kosgalwies , David K. Fork , Eugene M. Chow
IPC分类号： B23P13/00
CPC分类号： G01R1/06716 , G01R3/00 , Y10T29/49609
摘要： According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.
摘要翻译：根据各种示例性实施例，公开了一种弹簧装置，其包括基板，设置在基板上的自放电层和设置在自放电层上的应力金属层，其中应力金属层内部的应力量导致剥离力高于自释放层和应力金属层之间的粘附力。此外，根据各种示例性实施例的制造弹簧装置的方法包括提供衬底，在衬底上提供自释放层，并在自释放层上方提供应力金属层，其中，在本发明中也公开了应力金属层导致比自发层和应力金属层之间的粘附力高的剥离力。

7. 发明申请

US20120021170A1 Micro-Machined Structure Production Using Encapsulation 失效
标题翻译：使用封装的微加工结构生产
公开(公告)号：US20120021170A1
公开(公告)日：2012-01-26
申请号：US13248660
申请日：2011-09-29
申请人： Thomas Hantschel , Sven Kosgalwies , Eugene M. Chow , Gordon Todd Jagerson, JR.
发明人： Thomas Hantschel , Sven Kosgalwies , Eugene M. Chow , Gordon Todd Jagerson, JR.
IPC分类号： B32B3/22
CPC分类号： B81C1/00666 , G01R1/06755 , G01R1/07357 , H01L2924/00013 , H01L2924/01006 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H05K3/4092 , Y10T29/49146 , Y10T29/49147 , Y10T29/49204 , Y10T428/13 , Y10T428/1317 , Y10T428/24174 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.
摘要翻译：微加工（例如，应力工程弹簧）结构通过形成剥离层，形成部分或完全封装的梁/弹簧结构，然后通过蚀刻释放层来释放梁/弹簧结构来制造。封装结构在释放期间保护梁/弹簧，因此释放层和梁/弹簧都可以使用电镀和/或使用相同的材料形成。封装结构可以是金属，抗蚀剂，聚合物，氧化物或氮化物，并且可以在释放过程之后被去除，或者作为完成的微加工结构的一部分保留。

8. 发明授权

US07943504B2 Self-releasing spring structures and methods 有权
标题翻译：自释弹簧结构及方法
公开(公告)号：US07943504B2
公开(公告)日：2011-05-17
申请号：US12256060
申请日：2008-10-22
申请人： Thomas Hantschel , Sven Kosgalwies , David K. Fork , Eugene M. Chow
发明人： Thomas Hantschel , Sven Kosgalwies , David K. Fork , Eugene M. Chow
IPC分类号： H01L21/4763
CPC分类号： G01R1/06716 , G01R3/00 , Y10T29/49609
摘要： According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.
摘要翻译：根据各种示例性实施例，公开了一种弹簧装置，其包括基板，设置在基板上的自放电层和设置在自放电层上的应力金属层，其中应力金属层内部的应力量导致剥离力高于自释放层和应力金属层之间的粘附力。此外，根据各种示例性实施例的制造弹簧装置的方法包括提供衬底，在衬底上提供自释放层，并在自释放层上方提供应力金属层，其中，在本发明中也公开了应力金属层导致比自发层和应力金属层之间的粘附力高的剥离力。

9. 发明授权

US08435612B2 Micro-machined structure production using encapsulation 失效
标题翻译：微加工结构生产采用封装
公开(公告)号：US08435612B2
公开(公告)日：2013-05-07
申请号：US13248660
申请日：2011-09-29
申请人： Thomas Hantschel , Sven Kosgalwies , Eugene M. Chow , Gordon Todd Jagerson, Jr.
发明人： Thomas Hantschel , Sven Kosgalwies , Eugene M. Chow , Gordon Todd Jagerson, Jr.
IPC分类号： B32B3/22
CPC分类号： B81C1/00666 , G01R1/06755 , G01R1/07357 , H01L2924/00013 , H01L2924/01006 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H05K3/4092 , Y10T29/49146 , Y10T29/49147 , Y10T29/49204 , Y10T428/13 , Y10T428/1317 , Y10T428/24174 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.
摘要翻译：微加工（例如，应力工程弹簧）结构通过形成剥离层，形成部分或完全封装的梁/弹簧结构，然后通过蚀刻释放层来释放梁/弹簧结构来制造。封装结构在释放期间保护梁/弹簧，因此释放层和梁/弹簧都可以使用电镀和/或使用相同的材料形成。封装结构可以是金属，抗蚀剂，聚合物，氧化物或氮化物，并且可以在释放过程之后被去除，或者作为完成的微加工结构的一部分保留。

10. 发明申请

US20100184311A1 Micro-Machined Structure Production Using Encapsulation 有权
标题翻译：使用封装的微加工结构生产
公开(公告)号：US20100184311A1
公开(公告)日：2010-07-22
申请号：US12728047
申请日：2010-03-19
申请人： Thomas Hantschel , Sven Kosgalwies , Eugene M. Chow , Gordon Todd Jagerson, JR.
发明人： Thomas Hantschel , Sven Kosgalwies , Eugene M. Chow , Gordon Todd Jagerson, JR.
IPC分类号： H01R12/00
CPC分类号： B81C1/00666 , G01R1/06755 , G01R1/07357 , H01L2924/00013 , H01L2924/01006 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H05K3/4092 , Y10T29/49146 , Y10T29/49147 , Y10T29/49204 , Y10T428/13 , Y10T428/1317 , Y10T428/24174 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.
摘要翻译：微加工（例如，应力工程弹簧）结构通过形成剥离层，形成部分或完全封装的梁/弹簧结构，然后通过蚀刻释放层来释放梁/弹簧结构来制造。封装结构在释放期间保护梁/弹簧，因此释放层和梁/弹簧都可以使用电镀和/或使用相同的材料形成。封装结构可以是金属，抗蚀剂，聚合物，氧化物或氮化物，并且可以在释放过程之后被去除，或者作为完成的微加工结构的一部分保留。

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