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    • 1. 发明申请
    • Self-releasing spring structures and methods
    • 自释弹簧结构及方法
    • US20060076693A1
    • 2006-04-13
    • US10959180
    • 2004-10-07
    • Thomas HantschelSven KosgalwiesDavid ForkEugene Chow
    • Thomas HantschelSven KosgalwiesDavid ForkEugene Chow
    • H01L23/52
    • G01R1/06716G01R3/00Y10T29/49609
    • According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.
    • 根据各种示例性实施例,公开了一种弹簧装置,其包括基板,设置在基板上的自放电层和设置在自放电层上的应力金属层,其中应力金属层内部的应力量 导致剥离力高于自释放层和应力金属层之间的粘附力。 此外,根据各种示例性实施例的制造弹簧装置的方法包括提供衬底,在衬底上提供自释放层,并在自释放层上方提供应力金属层,其中, 在本发明中也公开了应力金属层导致比自发层和应力金属层之间的粘附力高的剥离力。
    • 6. 发明申请
    • Self-Releasing Spring Structures And Methods
    • 自我释放弹簧结构与方法
    • US20090077807A1
    • 2009-03-26
    • US12256060
    • 2008-10-22
    • Thomas HantschelSven KosgalwiesDavid K. ForkEugene M. Chow
    • Thomas HantschelSven KosgalwiesDavid K. ForkEugene M. Chow
    • B23P13/00
    • G01R1/06716G01R3/00Y10T29/49609
    • According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.
    • 根据各种示例性实施例,公开了一种弹簧装置,其包括基板,设置在基板上的自放电层和设置在自放电层上的应力金属层,其中应力金属层内部的应力量 导致剥离力高于自释放层和应力金属层之间的粘附力。 此外,根据各种示例性实施例的制造弹簧装置的方法包括提供衬底,在衬底上提供自释放层,并在自释放层上方提供应力金属层,其中, 在本发明中也公开了应力金属层导致比自发层和应力金属层之间的粘附力高的剥离力。
    • 8. 发明授权
    • Self-releasing spring structures and methods
    • 自释弹簧结构及方法
    • US07943504B2
    • 2011-05-17
    • US12256060
    • 2008-10-22
    • Thomas HantschelSven KosgalwiesDavid K. ForkEugene M. Chow
    • Thomas HantschelSven KosgalwiesDavid K. ForkEugene M. Chow
    • H01L21/4763
    • G01R1/06716G01R3/00Y10T29/49609
    • According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.
    • 根据各种示例性实施例,公开了一种弹簧装置,其包括基板,设置在基板上的自放电层和设置在自放电层上的应力金属层,其中应力金属层内部的应力量 导致剥离力高于自释放层和应力金属层之间的粘附力。 此外,根据各种示例性实施例的制造弹簧装置的方法包括提供衬底,在衬底上提供自释放层,并在自释放层上方提供应力金属层,其中, 在本发明中也公开了应力金属层导致比自发层和应力金属层之间的粘附力高的剥离力。