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    • 1. 发明授权
    • System for sputtering and method thereof
    • 溅射系统及其方法
    • US08658002B2
    • 2014-02-25
    • US12911569
    • 2010-10-25
    • Eu-Gene KangWon-Hyouk Jang
    • Eu-Gene KangWon-Hyouk Jang
    • C23C14/34
    • C23C14/34C23C14/545H01J37/32963H01J37/3299H01J37/34
    • A sputtering method includes receiving etch time information for a first substrate detected in a dry etching process, calculating a deposition time for a second substrate from the etch time information for the first substrate, and executing sputtering for the second substrate based the calculated deposition time. The thickness of the thin film deposited on the substrate in the sputter device may be uniformly maintained by using etch end point information detected in an end point detection (EPD) device. A sputtering system comprises a sputter device for executing a sputtering process for depositing a thin film on a substrate by a sputtering method, an EPD device for generating EPD information including etch time information for the substrate for a calculation of a deposition time during which the thin film is deposited, and a controller for calculating a deposition time by using the EPD information, and for controlling the sputter device based on the calculated deposition time.
    • 溅射方法包括接收在干蚀刻工艺中检测到的第一衬底的蚀刻时间信息,根据第一衬底的蚀刻时间信息计算第二衬底的沉积时间,以及基于计算的沉积时间执行第二衬底的溅射。 可以通过使用在端点检测(EPD)装置中检测到的蚀刻终点信息,均匀地保持沉积在溅射装置中的基板上的薄膜的厚度。 溅射系统包括用于执行用于通过溅射法在衬底上沉积薄膜的溅射工艺的溅射装置,用于产生EPD信息的EPD装置,包括用于计算沉积时间的衬底的蚀刻时间信息, 以及用于通过使用EPD信息计算沉积时间的控制器,以及基于计算出的沉积时间来控制溅射装置。
    • 2. 发明申请
    • System for Sputtering and Method Thereof
    • 溅射系统及其方法
    • US20110272275A1
    • 2011-11-10
    • US12911569
    • 2010-10-25
    • Eu-Gene KangWon-Hyouk Jang
    • Eu-Gene KangWon-Hyouk Jang
    • C23C14/34
    • C23C14/34C23C14/545H01J37/32963H01J37/3299H01J37/34
    • A sputtering method includes receiving etch time information for a first substrate detected in a dry etching process, calculating a deposition time for a second substrate from the etch time information for the first substrate, and executing sputtering for the second substrate based the calculated deposition time. The thickness of the thin film deposited on the substrate in the sputter device may be uniformly maintained by using etch end point information detected in an end point detection (EPD) device. A sputtering system comprises a sputter device for executing a sputtering process for depositing a thin film on a substrate by a sputtering method, an EPD device for generating EPD information including etch time information for the substrate for a calculation of a deposition time during which the thin film is deposited, and a controller for calculating a deposition time by using the EPD information, and for controlling the sputter device based on the calculated deposition time.
    • 溅射方法包括接收在干蚀刻工艺中检测到的第一衬底的蚀刻时间信息,根据第一衬底的蚀刻时间信息计算第二衬底的沉积时间,以及基于计算的沉积时间执行第二衬底的溅射。 可以通过使用在端点检测(EPD)装置中检测到的蚀刻终点信息,均匀地保持沉积在溅射装置中的基板上的薄膜的厚度。 溅射系统包括用于执行用于通过溅射法在衬底上沉积薄膜的溅射工艺的溅射装置,用于产生EPD信息的EPD装置,包括用于计算沉积时间的衬底的蚀刻时间信息, 以及用于通过使用EPD信息计算沉积时间的控制器,以及基于计算出的沉积时间来控制溅射装置。
    • 3. 发明授权
    • Device and method for fabricating display device
    • 显示装置制造装置及方法
    • US08899174B2
    • 2014-12-02
    • US12896496
    • 2010-10-01
    • Won-Hyouk JangEu-Gene KangJoo-Hwa LeeMin-Jeong Hwang
    • Won-Hyouk JangEu-Gene KangJoo-Hwa LeeMin-Jeong Hwang
    • C23C16/52C23C16/448C23C16/44C23C16/00B05C11/00
    • C23C16/00B05C11/00C23C16/44C23C16/448C23C16/52
    • A device for manufacturing a display device includes a deposition source; a deposition thickness calculator for calculating a deposition thickness of a deposition material deposited on a substrate; and a controller for controlling a power of a heater which heats the deposition source by comparing the deposition thickness calculated with a reference thickness. The controller controls the power of the heater either at least one time for each substrate on which the thin film is to be deposited or at regular intervals while the deposition material is deposited. Influence of measurement noise that is included in a quartz crystal sensor for measuring a deposition speed may be minimized, and distribution of deposition thickness of an organic light emitting material may be reduced, thereby increasing the yield of the deposition process and producing quality display devices.
    • 一种用于制造显示装置的装置包括沉积源; 沉积厚度计算器,用于计算沉积在衬底上的沉积材料的沉积厚度; 以及控制器,用于通过比较用参考厚度计算的沉积厚度来控制加热沉积源的加热器的功率。 控制器对于要沉积薄膜的每个衬底至少一次控制加热器的功率,或者在沉积材料沉积时以规则的间隔控制加热器的功率。 包含在用于测量沉积速度的石英晶体传感器中的测量噪声的影响可以被最小化,并且可以减少有机发光材料的沉积厚度的分布,从而提高沉积工艺的产量并产生高质量的显示装置。
    • 4. 发明申请
    • DEVICE AND METHOD FOR FABRICATING DISPLAY DEVICE
    • 用于制造显示装置的装置和方法
    • US20110189380A1
    • 2011-08-04
    • US12896496
    • 2010-10-01
    • Won-Hyouk JangEu-Gene KangJoo-Hwa LeeMin-Jeong Hwang
    • Won-Hyouk JangEu-Gene KangJoo-Hwa LeeMin-Jeong Hwang
    • C23C16/52C23C16/00
    • C23C16/00B05C11/00C23C16/44C23C16/448C23C16/52
    • A device for manufacturing a display device includes a deposition source; a deposition thickness calculator for calculating a deposition thickness of a deposition material deposited on a substrate; and a controller for controlling a power of a heater which heats the deposition source by comparing the deposition thickness calculated with a reference thickness. The controller controls the power of the heater either at least one time for each substrate on which the thin film is to be deposited or at regular intervals while the deposition material is deposited. Influence of measurement noise that is included in a quartz crystal sensor for measuring a deposition speed may be minimized, and distribution of deposition thickness of an organic light emitting material may be reduced, thereby increasing the yield of the deposition process and producing quality display devices.
    • 一种用于制造显示装置的装置包括沉积源; 沉积厚度计算器,用于计算沉积在基底上的沉积材料的沉积厚度; 以及控制器,用于通过比较用参考厚度计算的沉积厚度来控制加热沉积源的加热器的功率。 控制器对于要沉积薄膜的每个衬底至少一次控制加热器的功率,或者在沉积材料沉积时以规则的间隔控制加热器的功率。 包含在用于测量沉积速度的石英晶体传感器中的测量噪声的影响可以被最小化,并且可以减少有机发光材料的沉积厚度的分布,从而提高沉积工艺的产量并产生高质量的显示装置。