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1. 发明授权

US07700439B2 Silicided nonvolatile memory and method of making same 有权
标题翻译：硅化非易失性存储器及其制造方法
公开(公告)号：US07700439B2
公开(公告)日：2010-04-20
申请号：US11376410
申请日：2006-03-15
申请人： Erwin J. Prinz , Ko-Min Chang , Robert F. Steimle
发明人： Erwin J. Prinz , Ko-Min Chang , Robert F. Steimle
IPC分类号： H01L21/336
CPC分类号： H01L27/11521 , B82Y10/00 , H01L21/28273 , H01L27/115
摘要： A memory device is formed on a semiconductor substrate. A select gate electrode and a control gate electrode are formed adjacent to one another. One of either the select gate electrode or the control gate electrodes is recessed with respect to the other. The recess allows for a manufacturable process with which to form silicided surfaces on both the select gate electrode and the control gate electrode.
摘要翻译：存储器件形成在半导体衬底上。选择栅电极和控制栅电极彼此相邻地形成。选择栅极电极或控制栅电极中的一个相对于另一个凹陷。该凹槽允许用于在选择栅极电极和控制栅极电极上形成硅化物表面的可制造工艺。

2. 发明授权

US07341914B2 Method for forming a non-volatile memory and a peripheral device on a semiconductor substrate 有权
标题翻译：在半导体衬底上形成非易失性存储器和外围器件的方法
公开(公告)号：US07341914B2
公开(公告)日：2008-03-11
申请号：US11376411
申请日：2006-03-15
申请人： Erwin J. Prinz , Ko-Min Chang , Robert F. Steimle
发明人： Erwin J. Prinz , Ko-Min Chang , Robert F. Steimle
IPC分类号： H01L21/336
CPC分类号： H01L27/105 , H01L27/11526 , H01L27/11546
摘要： A method for forming a semiconductor device includes forming a first gate electrode over a semiconductor substrate, wherein the first gate electrode comprises silicon and forming a second gate electrode over the semiconductor substrate and adjacent the first gate electrode, wherein the second gate electrode comprises silicon. Nanoclusters are present in the first gate electrode. A peripheral transistor area is formed devoid of nanoclusters.
摘要翻译：一种用于形成半导体器件的方法包括在半导体衬底上形成第一栅电极，其中第一栅电极包括硅并在半导体衬底上形成并邻近第一栅电极的第二栅电极，其中第二栅电极包括硅。纳米簇存在于第一栅电极中。外围晶体管区域形成为没有纳米团簇。

3. 发明授权

US06791883B2 Program and erase in a thin film storage non-volatile memory 有权
标题翻译：在薄膜存储非易失性存储器中编程和擦除
公开(公告)号：US06791883B2
公开(公告)日：2004-09-14
申请号：US10178658
申请日：2002-06-24
申请人： Craig T. Swift , Jane A. Yater , Alexander B. Hoefler , Ko-Min Chang , Erwin J. Prinz , Bruce L. Morton
发明人： Craig T. Swift , Jane A. Yater , Alexander B. Hoefler , Ko-Min Chang , Erwin J. Prinz , Bruce L. Morton
IPC分类号： G11C1600
CPC分类号： G11C16/0466
摘要： A non-volatile memory having a thin film dielectric storage element is programmed by hot carrier injection (HCI) and erased by tunneling. The typical structure for the memory cells for this type of memory is silicon, oxide, nitride, oxide, and silicon (SONOS). The hot carrier injection provides relatively fast programming for SONOS, while the tunneling provides for erase that avoids the difficulties with the hot hole erase (HHE) type erase that generally accompanies hot carrier injection for programming. HHE is significantly more damaging to dielectrics leading to reliability issues. HHE also has a relatively narrow area of erasure that may not perfectly match the pattern for the HCI programming leaving an incomplete erasure. The tunnel erase effectively covers the entire area so there is no concern about incomplete erase. Although tunnel erase is slower than HHE, erase time is generally less critical in a system operation than is programming time.
摘要翻译：具有薄膜电介质存储元件的非易失性存储器通过热载流子注入（HCI）编程并通过隧道擦除。这种存储器的存储单元的典型结构是硅，氧化物，氮化物，氧化物和硅（SONOS）。热载波注入为SONOS提供相对快速的编程，而隧道提供擦除，避免了通常伴随热载流子注入进行编程的热孔擦除（HHE）类型擦除的困难。 HHE对电介质的破坏性更大，导致可靠性问题。 HHE还具有相对较窄的擦除区域，可能不完全匹配HCI编程的模式，从而导致不完整的擦除。隧道擦除有效地覆盖整个区域，所以不用担心不完全擦除。虽然隧道擦除比HHE慢，但擦除时间在系统操作中通常不如编程时间那么重要。

4. 发明申请

US20100240156A1 METHOD FOR PROVIDING A NON-VOLATILE MEMORY 有权
标题翻译：提供非易失性存储器的方法
公开(公告)号：US20100240156A1
公开(公告)日：2010-09-23
申请号：US12405308
申请日：2009-03-17
申请人： Mohammed Suhail , Ko-Min Chang , Peter J. Kuhn , Erwin J. Prinz
发明人： Mohammed Suhail , Ko-Min Chang , Peter J. Kuhn , Erwin J. Prinz
IPC分类号： H01L21/66
CPC分类号： G11C29/06 , G11C16/04 , G11C29/50 , G11C29/50004 , G11C29/50016 , G11C2029/0403
摘要： Testing a non volatile memory by exposing the non volatile memory to particle radiation (e.g. xenon ions) to emulate memory cell damage due to data state changing events of a non volatile memory cell. After the exposing, the memory cells are subjected to tests and the results of the tests are used to develop reliability indications of the non volatile memory. Integrated circuits with non volatile memories of the same design are provided. Reliability representations of the integrated circuits can be made with respect to a number of data state charging events based on the exposure and subsequent tests.
摘要翻译：通过将非易失性存储器暴露于粒子辐射（例如氙离子）来测试非易失性存储器，以模拟由非易失性存储器单元的数据状态改变事件引起的存储器单元损坏。在曝光之后，对存储器单元进行测试，并且测试结果用于开发非易失性存储器的可靠性指示。提供了具有相同设计的非易失性存储器的集成电路。集成电路的可靠性表示可以基于曝光和随后的测试相对于多个数据状态充电事件进行。

5. 发明授权

US07955877B2 Method for simulating long-term performance of a non-volatile memory by exposing the non-volatile memory to heavy-ion radiation 有权
标题翻译：通过将非易失性存储器暴露于重离子辐射来模拟非易失性存储器的长期性能的方法
公开(公告)号：US07955877B2
公开(公告)日：2011-06-07
申请号：US12405308
申请日：2009-03-17
申请人： Mohammed Suhail , Ko-Min Chang , Peter J. Kuhn , Erwin J. Prinz
发明人： Mohammed Suhail , Ko-Min Chang , Peter J. Kuhn , Erwin J. Prinz
IPC分类号： G01R31/26 , H01L21/66
CPC分类号： G11C29/06 , G11C16/04 , G11C29/50 , G11C29/50004 , G11C29/50016 , G11C2029/0403
摘要： Testing a non volatile memory by exposing the non volatile memory to particle radiation (e.g. xenon ions) to emulate memory cell damage due to data state changing events of a non volatile memory cell. After the exposing, the memory cells are subjected to tests and the results of the tests are used to develop reliability indications of the non volatile memory. Integrated circuits with non volatile memories of the same design are provided. Reliability representations of the integrated circuits can be made with respect to a number of data state charging events based on the exposure and subsequent tests.
摘要翻译：通过将非易失性存储器暴露于粒子辐射（例如氙离子）来测试非易失性存储器，以模拟由非易失性存储器单元的数据状态改变事件引起的存储器单元损坏。在曝光之后，对存储器单元进行测试，并且测试结果用于开发非易失性存储器的可靠性指示。提供了具有相同设计的非易失性存储器的集成电路。集成电路的可靠性表示可以基于曝光和随后的测试相对于多个数据状态充电事件进行。

6. 发明授权

US07524719B2 Method of making self-aligned split gate memory cell 失效
标题翻译：制造自对准分离栅极存储单元的方法
公开(公告)号：US07524719B2
公开(公告)日：2009-04-28
申请号：US11469163
申请日：2006-08-31
申请人： Robert F. Steimle , Ko-Min Chang
发明人： Robert F. Steimle , Ko-Min Chang
IPC分类号： H01L21/8238
CPC分类号： H01L27/115 , H01L27/11521 , H01L27/11524
摘要： A method for forming a split gate memory cell (10,11) using a semiconductor substrate (12) includes forming a select gate structure (48) and a sacrificial structure (50) over the substrate. An opening is between the select gate structure and the sacrificial structure. The opening is lined with a storage layer (56,168). The opening is further filled with select gate material (58,170). The sacrificial structure is removed after filling the opening with the select gate material.
摘要翻译：使用半导体衬底（12）形成分离栅极存储单元（10,11）的方法包括在衬底上形成选择栅极结构（48）和牺牲结构（50）。选择栅极结构和牺牲结构之间有一个开口。开口衬有存储层（56,168）。开口进一步填充选择栅极材料（58,170）。在用选择栅极材料填充开口之后去除牺牲结构。

7. 发明申请

US20080121974A1 SELF-ALIGNED SPLIT GATE MEMORY CELL AND METHOD OF MAKING 失效
标题翻译：自对准分割栅存储单元及其制作方法
公开(公告)号：US20080121974A1
公开(公告)日：2008-05-29
申请号：US11469163
申请日：2006-08-31
申请人： Robert F. Steimle , Ko-Min Chang
发明人： Robert F. Steimle , Ko-Min Chang
IPC分类号： H01L29/788 , H01L21/336
CPC分类号： H01L27/115 , H01L27/11521 , H01L27/11524
摘要： A method for forming a split gate memory cell (10,11) using a semiconductor substrate (12) includes forming a select gate structure (48) and a sacrificial structure (50) over the substrate. An opening is between the select gate structure and the sacrificial structure. The opening is lined with a storage layer (56,168). The opening is further filled with select gate material (58,170). The sacrificial structure is removed after filling the opening with the select gate material.
摘要翻译：使用半导体衬底（12）形成分离栅极存储单元（10,11）的方法包括在衬底上形成选择栅极结构（48）和牺牲结构（50）。选择栅极结构和牺牲结构之间有一个开口。开口衬有存储层（56,168）。开口进一步填充选择栅极材料（58,170）。在用选择栅极材料填充开口之后去除牺牲结构。

8. 发明授权

US08921155B2 Resistive random access memory (RAM) cell and method for forming 有权
标题翻译：电阻随机存取存储器（RAM）单元及其形成方法
公开(公告)号：US08921155B2
公开(公告)日：2014-12-30
申请号：US13085217
申请日：2011-04-12
申请人： Feng Zhou , Ko-Min Chang , Cheong Min Hong
发明人： Feng Zhou , Ko-Min Chang , Cheong Min Hong
IPC分类号： H01L21/027 , H01L45/00
CPC分类号： H01L45/08 , H01L45/1233 , H01L45/146 , H01L45/1633 , H01L45/1675
摘要： A resistive random access memory cell uses a substrate and includes a gate stack over the substrate. The gate stack includes a first copper layer over the substrate, a copper oxide layer over the first copper layer, and a second copper layer over the copper oxide layer.
摘要翻译：电阻式随机存取存储器单元使用衬底并且在衬底上包括栅极堆叠。栅极堆叠包括在衬底上的第一铜层，在第一铜层上方的氧化铜层和氧化铜层上的第二铜层。

9. 发明授权

US5646060A Method for making an EEPROM cell with isolation transistor 失效
标题翻译：用隔离晶体管制造EEPROM单元的方法
公开(公告)号：US5646060A
公开(公告)日：1997-07-08
申请号：US471619
申请日：1995-05-30
申请人： Ko-Min Chang , Danny Pak-Chum Shum , Kuo-Tung Chang
发明人： Ko-Min Chang , Danny Pak-Chum Shum , Kuo-Tung Chang
IPC分类号： G11C17/00 , G11C16/04 , H01L21/8247 , H01L27/115 , H01L29/788 , H01L29/792
CPC分类号： H01L27/115 , H01L29/7883
摘要： An EEPROM cell (40) includes a floating gate transistor (47) and an isolation transistor (45). Both a floating gate (48) and an isolation gate (46) are formed on a tunnel dielectric (44) within the cell. The isolation gate is coupled to a doped source region (52) of the floating gate transistor. The isolation transistor is not biased during a program operation of the cell, enabling a thin tunnel dielectric (less than 120 angstroms) to be used beneath all portions of both gates within the cell. Thus, the need for both a conventional tunnel dielectric and a gate dielectric is eliminated. The cell tolerates over-erasure, can be programmed at low programming voltages, and has good current drive due to the thin tunnel dielectric throughout the cell.
摘要翻译： EEPROM单元（40）包括浮栅晶体管（47）和隔离晶体管（45）。浮动栅极（48）和隔离栅极（46）均形成在电池内的隧道电介质（44）上。隔离栅极耦合到浮栅晶体管的掺杂源极区（52）。在单元的编程操作期间，隔离晶体管不被偏置，使得能够在单元内的两个栅极的所有部分下方使用薄的隧道电介质（小于120埃）。因此，消除了对常规隧道电介质和栅极电介质的需要。电池容忍过度擦除，可以在低编程电压下编程，并且由于整个电池中的薄隧道电介质而具有良好的电流驱动。

10. 发明授权

US5605855A Process for fabricating a graded-channel MOS device 失效
标题翻译：用于制造渐变通道MOS器件的工艺
公开(公告)号：US5605855A
公开(公告)日：1997-02-25
申请号：US395339
申请日：1995-02-28
申请人： Ko-Min Chang , Marius Orlowski , Craig Swift , Shih-Wei Sun , Shiang-Chyong Luo
发明人： Ko-Min Chang , Marius Orlowski , Craig Swift , Shih-Wei Sun , Shiang-Chyong Luo
IPC分类号： H01L29/78 , H01L21/265 , H01L21/336 , H01L29/10 , H01L21/8234
CPC分类号： H01L29/66583 , H01L21/2652 , H01L29/1045 , H01L29/1083 , H01L29/66537 , H01L29/66553
摘要： A process for fabricating a graded-channel MOS device includes the formation of a masking layer (16) on the surface of a semiconductor substrate (10) and separated from the surface by a gate oxide layer (12). A first doped region (22) is formed in a channel region (20) of the semiconductor substrate (10) using the masking layer (16) as a doping mask. A second doped region (24) is formed in the channel region (20) and extends from the principal surface (14) of the semiconductor substrate (10) to the first doped region (22). A gate electrode (34) is formed within an opening (18) in the masking layer (16) and aligned to the channel region (20). Upon removal of the masking layer (16) source and drain regions (36, 38) are formed in the semiconductor substrate (10) and aligned to the gate electrode (34).
摘要翻译：用于制造渐变沟道MOS器件的工艺包括在半导体衬底（10）的表面上形成掩模层（16），并通过栅氧化层（12）从表面分离。使用掩模层（16）作为掺杂掩模，在半导体衬底（10）的沟道区（20）中形成第一掺杂区（22）。第二掺杂区域（24）形成在沟道区域（20）中并且从半导体衬底（10）的主表面（14）延伸到第一掺杂区域（22）。栅极电极（34）形成在掩模层（16）的开口（18）内，并与沟道区域（20）对准。在去除掩模层（16）时，源极和漏极区（36,38）形成在半导体衬底（10）中并与栅电极（34）对齐。

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