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    • 4. 发明授权
    • Methods for forming contact landing regions in split-gate non-volatile memory (NVM) cell arrays
    • 在分闸门非易失性存储器(NVM)单元阵列中形成接触着陆区域的方法
    • US09054208B2
    • 2015-06-09
    • US14022646
    • 2013-09-10
    • Jane A. YaterCheong Min HongSung-Taeg Kang
    • Jane A. YaterCheong Min HongSung-Taeg Kang
    • H01L21/3205H01L29/788H01L29/66H01L27/115
    • H01L27/11568H01L27/11524H01L27/11565H01L27/1157H01L29/42344H01L29/66825H01L29/7881H01L29/792
    • Methods and related structures are disclosed for forming contact landing regions in split-gate NVM (non-volatile memory) systems. A dummy select gate structure is formed while also forming select gates for split-gate NVM cells. A control gate layer is formed over the select gates and the dummy select gate structure, as well as an intervening charge storage layer. The control gate material will fill in gaps between the select gate material and the dummy select gate material. A non-patterned spacer etch is then used to etch the control gate layer to form a contact landing region associated with the dummy select gate structure while also forming spacer control gates for the split-gate NVM cells. The disclosed embodiments provide improved (e.g., more planar) contact landing regions without requiring additional processing steps and without increasing the pitch of the resulting NVM cell array.
    • 公开了用于在分闸NVM(非易失性存储器)系统中形成接触着陆区域的方法和相关结构。 形成虚拟选择栅结构,同时形成分闸NVM单元的选择栅极。 在选择栅极和虚拟选择栅极结构上形成控制栅极层,以及中间电荷存储层。 控制栅极材料将填充选择栅极材料和虚拟选择栅极材料之间的间隙。 然后使用非图案化间隔物蚀刻来蚀刻控制栅极层以形成与虚拟选择栅极结构相关联的接触着色区域,同时还形成用于分离栅极NVM单元的间隔物控制栅极。 所公开的实施例提供改进的(例如更平坦的)接触着陆区域,而不需要额外的处理步骤,而不增加所得到的NVM单元阵列的间距。
    • 6. 发明授权
    • Split gate programming
    • 分割门编程
    • US08953378B2
    • 2015-02-10
    • US13536307
    • 2012-06-28
    • Cheong Min HongSung-Taeg Kang
    • Cheong Min HongSung-Taeg Kang
    • G11C11/34
    • G11C16/0466G11C16/10G11C16/3459
    • A method for programming a split gate memory cell includes performing a first programming of the split gate memory cell in a first programming cycle of the split gate memory cell; and, subsequent to the performing the first programming of the split gate memory cell, performing a second programming of the split gate memory cell in the first programming cycle, wherein the first programming is characterized as one of source-side injection (SSI) programming and channel-initiated secondary electron (CHISEL) programming, and the second programming is characterized as the other of SSI programming and CHISEL programming.
    • 用于对分割门存储器单元进行编程的方法包括在分离栅极存储单元的第一编程周期中执行分离栅极存储单元的第一编程; 并且在执行所述分离栅极存储器单元的第一编程之后,在所述第一编程周期中执行所述分离栅极存储单元的第二编程,其中所述第一编程被表征为源侧注入(SSI)编程之一, 通道启动的二次电子(CHISEL)编程,第二个编程被表征为SSI编程和CHISEL编程中的另一个。
    • 7. 发明授权
    • Split-gate non-volatile memory (NVM) cell and device structure integration
    • 分离门非易失性存储器(NVM)单元和器件结构集成
    • US08932925B1
    • 2015-01-13
    • US13973549
    • 2013-08-22
    • Cheong Min HongKarthik Ramanan
    • Cheong Min HongKarthik Ramanan
    • H01L29/792H01L27/06H01L29/78H01L29/66H01L21/02
    • H01L29/792H01L21/02601H01L21/28273H01L27/0629H01L27/11541H01L29/42328H01L29/42332H01L29/66181H01L29/66825H01L29/66833
    • A method includes forming a first conductive layer over a substrate in a first region and second region of the substrate; patterning the first conductive layer to form a select gate in the first region and to remove the first conductive layer from the second region; forming a charge storage layer over the select gate and the substrate in the first region and over the substrate in the second region; forming a second conductive layer over the charge storage layer in the first and second regions; and patterning the second conductive layer and charge storage layer to form a control gate overlapping the select gate in the first region, wherein a first portion of the charge storage layer remains between the select gate and control gate, and to form an electrode in the second region, wherein a second portion of the charge storage layer remains between the electrode and substrate.
    • 一种方法包括在衬底的第一区域和第二区域中在衬底上形成第一导电层; 图案化第一导电层以在第一区域中形成选择栅极并从第二区域去除第一导电层; 在所述第一区域中的所述选择栅极和所述衬底上方并在所述第二区域中的所述衬底上方形成电荷存储层; 在第一和第二区域中的电荷存储层上形成第二导电层; 以及图案化所述第二导电层和电荷存储层以形成与所述第一区域中的所述选择栅极重叠的控制栅极,其中所述电荷存储层的第一部分保留在所述选择栅极和控制栅极之间,并且在所述第二区域中形成电极 区域,其中电荷存储层的第二部分保留在电极和衬底之间。