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1. 发明申请

US20100327751A1 SELF-BALLASTED LAMP AND LIGHTING EQUIPMENT 审中-公开
标题翻译：自封灯和照明设备
公开(公告)号：US20100327751A1
公开(公告)日：2010-12-30
申请号：US12825956
申请日：2010-06-29
申请人： Erika Takenaka , Shigeru Osawa , Yusuke Shibahara , Takeshi Hisayasu , Kazuto Morikawa , Tomohiro Sanpei , Mokoto Sakai
发明人： Erika Takenaka , Shigeru Osawa , Yusuke Shibahara , Takeshi Hisayasu , Kazuto Morikawa , Tomohiro Sanpei , Mokoto Sakai
IPC分类号： H01J13/32 , H05B37/02
CPC分类号： F21V23/002 , F21K9/232 , F21K9/233 , F21V3/061 , F21V3/062 , F21V29/773 , F21Y2115/10
摘要： The present invention provides a self-ballasted lamp which efficiently conducts heat of a plurality of LED chips of a light emitting module to its holder, and can prevent the temperature rise of the LED chips. The holder has a base portion, an edge portion provided at one end side of the base portion, which is thick at the base portion side thereof and thin at the distal end side thereof, and heat radiation fins provided at the other end side from the edge part and at the circumference of the base portion. The heat from the semiconductor light emitting elements is conducted from the base portion to the edge part and radiated therefrom. At this time, the edge part is thickened at the base portion side, wherein the thermal capacity is increased, and the heat conduction is improved.
摘要翻译：本发明提供了一种自发镇流灯，其有效地将发光模块的多个LED芯片的热量传导到其保持器，并且可以防止LED芯片的温度升高。保持器具有基部，设置在基部的一端侧的边缘部，其基部侧较厚，其前端侧较薄，并且设置在另一端侧的散热片边缘部分和基部的圆周处。来自半导体发光元件的热量从基部传导到边缘部分并从其辐射。此时，边缘部分在基部侧增厚，其中热容量增加，并且热传导得到改善。

2. 发明申请

US20100219735A1 LIGHTING DEVICE AND LIGHTING FIXTURE 失效
标题翻译：照明设备和照明设备
公开(公告)号：US20100219735A1
公开(公告)日：2010-09-02
申请号：US12713230
申请日：2010-02-26
申请人： Makoto Sakai , Shigeru Osawa , Yusuke Shibahara , Takeshi Hisayasu , Kazuto Morikawa , Tomohiro Sanpei , Erika Takenaka
发明人： Makoto Sakai , Shigeru Osawa , Yusuke Shibahara , Takeshi Hisayasu , Kazuto Morikawa , Tomohiro Sanpei , Erika Takenaka
IPC分类号： H01J61/52
CPC分类号： F21V23/06 , F21K9/23 , F21K9/238 , F21V3/00 , F21V23/002 , F21V23/006 , F21V29/773 , F21V29/89 , F21Y2113/13 , F21Y2115/10 , F21Y2115/30
摘要： A lighting device and a lighting fixture of the embodiment of the present invention comprises a thermally conductive main body having a substrate support portion in one end portion, and having a through-hole and a groove portion formed in the substrate support portion, the through-hole penetrating from the one end portion to the other end portion of the main body, the groove portion extending continuously from the through-hole, a substrate mounted with a semiconductor light-emitting device, and disposed on the substrate support portion, an electrical connector connected to the semiconductor light-emitting device, a power supply device housed in the main body and configured to light the semiconductor light-emitting device, a wire connected to the power supply device and to the electrical connector while being inserted through the through-hole and the groove portion, and a base member provided in the other end portion of the main body and connected to the power supply device. Therefore, a lighting device and a lighting fixture of this embodiment of the present invention reduced in size, is configured to be suitable for mass production and is capable of producing a certain luminous flux.
摘要翻译：本发明实施例的照明装置和照明器具包括：导热主体，其在一个端部具有基板支撑部分，并且具有形成在基板支撑部分中的通孔和槽部，所述槽从所述主体的一端部延伸到另一端部，所述槽部从所述通孔连续地延伸，安装有半导体发光装置的基板，并且设置在所述基板支撑部上，电连接器连接到所述半导体发光装置的电源装置，容纳在所述主体中并且被配置为使所述半导体发光装置点亮的电源装置，连接到所述电源装置的电线和所述电连接器，同时插入所述通孔和槽部，以及设置在主体的另一端部并连接到电源装置的基部构件。因此，本发明的该实施例的照明装置和照明器具尺寸减小，被配置为适合于批量生产并且能够产生一定的光通量。

3. 发明授权

US08760042B2 Lighting device having a through-hole and a groove portion formed in the thermally conductive main body 失效
标题翻译：具有形成在导热性主体中的通孔和槽部的照明装置
公开(公告)号：US08760042B2
公开(公告)日：2014-06-24
申请号：US12713230
申请日：2010-02-26
申请人： Makoto Sakai , Shigeru Osawa , Yusuke Shibahara , Takeshi Hisayasu , Kazuto Morikawa , Tomohiro Sanpei , Erika Takenaka
发明人： Makoto Sakai , Shigeru Osawa , Yusuke Shibahara , Takeshi Hisayasu , Kazuto Morikawa , Tomohiro Sanpei , Erika Takenaka
IPC分类号： H01J61/52
CPC分类号： F21V23/06 , F21K9/23 , F21K9/238 , F21V3/00 , F21V23/002 , F21V23/006 , F21V29/773 , F21V29/89 , F21Y2113/13 , F21Y2115/10 , F21Y2115/30
摘要： A lighting device and a lighting fixture of the embodiment of the present invention comprises a thermally conductive main body having a substrate support portion in one end portion, and having a through-hole and a groove portion formed in the substrate support portion, the through-hole penetrating from the one end portion to the other end portion of the main body, the groove portion extending continuously from the through-hole, a substrate mounted with a semiconductor light-emitting device, and disposed on the substrate support portion, an electrical connector connected to the semiconductor light-emitting device, a power supply device housed in the main body and configured to light the semiconductor light-emitting device, a wire connected to the power supply device and to the electrical connector while being inserted through the through-hole and the groove portion, and a base member provided in the other end portion of the main body and connected to the power supply device. Therefore, a lighting device and a lighting fixture of this embodiment of the present invention reduced in size, is configured to be suitable for mass production and is capable of producing a certain luminous flux.
摘要翻译：本发明实施例的照明装置和照明器具包括：导热主体，其在一个端部具有基板支撑部分，并且具有形成在基板支撑部分中的通孔和槽部，所述槽从所述主体的一端部延伸到另一端部，所述槽部从所述通孔连续地延伸，安装有半导体发光装置的基板，并且设置在所述基板支撑部上，电连接器连接到所述半导体发光装置的电源装置，容纳在所述主体中并且被配置为使所述半导体发光装置点亮的电源装置，连接到所述电源装置的电线和所述电连接器，同时插入所述通孔和槽部，以及设置在主体的另一端部并连接到电源装置的基部构件。因此，本发明的该实施例的照明装置和照明器具尺寸减小，被配置为适合于批量生产并且能够产生一定的光通量。

4. 发明授权

US08368113B2 Light emitting device and lighting apparatus 失效
标题翻译：发光装置及照明装置
公开(公告)号：US08368113B2
公开(公告)日：2013-02-05
申请号：US13114609
申请日：2011-05-24
申请人： Shuhei Matsuda , Erika Takenaka , Tomohiro Sanpei , Kazuto Morikawa , Masahiro Izumi , Kiyoshi Nishimura
发明人： Shuhei Matsuda , Erika Takenaka , Tomohiro Sanpei , Kazuto Morikawa , Masahiro Izumi , Kiyoshi Nishimura
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , F21V7/06 , F21V29/76 , F21Y2115/10 , H01L24/45 , H01L33/486 , H01L33/62 , H01L33/641 , H01L33/647 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/12041 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： According to one embodiment, a light emitting device includes a ceramics substrate, a metallic thermally-conductive layer formed on the substrate in which the substrate involves no electric connection, a light emitting element mounted on the metallic thermally-conductive layer, and a metallic bonding layer interposed between the metallic thermally-conductive layer and the light emitting element to bond the light emitting element to the metallic thermally-conductive layer.
摘要翻译：根据一个实施例，发光器件包括陶瓷衬底，形成在衬底上的金属导热层，其中衬底不涉及电连接，安装在金属导热层上的发光元件和金属接合介于金属导热层和发光元件之间的层，以将发光元件结合到金属导热层。

5. 发明申请

US20100301731A1 LIGHT EMITTING MODULE AND ILLUMINATION DEVICE 有权
标题翻译：发光模块和照明装置
公开(公告)号：US20100301731A1
公开(公告)日：2010-12-02
申请号：US12790395
申请日：2010-05-28
申请人： KAZUTO MORIKAWA , Masahiro Izumi , Kiyoshi Nishimura , Tomohiro Sanpei , Erika Takenaka , Shuhei Matsuda
发明人： KAZUTO MORIKAWA , Masahiro Izumi , Kiyoshi Nishimura , Tomohiro Sanpei , Erika Takenaka , Shuhei Matsuda
IPC分类号： H01K1/28
CPC分类号： H05K1/0274 , F21K9/23 , F21K9/232 , F21Y2115/10 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H05K3/284 , H05K2201/0108 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014
摘要： According to one embodiment, a light-emitting module includes a module substrate, a reflective layer, conductive layers, a light-emitting element, and a sealing member. A reflective layer is provided on a surface of an insulating layer of the module substrate, and the conductive layers are provided in the vicinity of the reflective layer. Further, the light-emitting element is provided on the reflective layer. Moreover, the translucent sealing member has translucency and bury the reflective layer, the conductive layers, and the light-emitting element. The ratio of the area occupied by the reflective layer and the conductive layers to the sealed region sealed by the sealing member is equal to or greater than 80%.
摘要翻译：根据一个实施例，发光模块包括模块衬底，反射层，导电层，发光元件和密封构件。在模块基板的绝缘层的表面上设置反射层，并且在反射层附近设置导电层。此外，发光元件设置在反射层上。此外，半透明密封构件具有半透明性并且掩埋反射层，导电层和发光元件。反射层和导电层占据密封部件密封的密封区域的面积的比例等于或大于80％。

6. 发明授权

US08098003B2 Light emitting module and illumination device 有权
标题翻译：发光模块和照明装置
公开(公告)号：US08098003B2
公开(公告)日：2012-01-17
申请号：US12790395
申请日：2010-05-28
申请人： Kazuto Morikawa , Masahiro Izumi , Kiyoshi Nishimura , Tomohiro Sanpei , Erika Takenaka , Shuhei Matsuda
发明人： Kazuto Morikawa , Masahiro Izumi , Kiyoshi Nishimura , Tomohiro Sanpei , Erika Takenaka , Shuhei Matsuda
IPC分类号： H01J5/16
CPC分类号： H05K1/0274 , F21K9/23 , F21K9/232 , F21Y2115/10 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H05K3/284 , H05K2201/0108 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014
摘要： According to one embodiment, a light-emitting module includes a module substrate, a reflective layer, conductive layers, a light-emitting element, and a sealing member. A reflective layer is provided on a surface of an insulating layer of the module substrate, and the conductive layers are provided in the vicinity of the reflective layer. Further, the light-emitting element is provided on the reflective layer. Moreover, the translucent sealing member has translucency and bury the reflective layer, the conductive layers, and the light-emitting element. The ratio of the area occupied by the reflective layer and the conductive layers to the sealed region sealed by the sealing member is equal to or greater than 80%.
摘要翻译：根据一个实施例，发光模块包括模块衬底，反射层，导电层，发光元件和密封构件。在模块基板的绝缘层的表面上设置反射层，并且在反射层附近设置导电层。此外，发光元件设置在反射层上。此外，半透明密封构件具有半透明性并且掩埋反射层，导电层和发光元件。反射层和导电层占据密封部件密封的密封区域的面积的比例等于或大于80％。

7. 发明申请

US20110234080A1 LIGHT-EMITTING DEVICE AND ILLUMINATION DEVICE 失效
标题翻译：发光装置和照明装置
公开(公告)号：US20110234080A1
公开(公告)日：2011-09-29
申请号：US13049571
申请日：2011-03-16
申请人： Tomohiro SANPEI , Erika Takenaka
发明人： Tomohiro SANPEI , Erika Takenaka
IPC分类号： H01K1/26
CPC分类号： H05K3/284 , F21K9/23 , F21V3/00 , F21V23/002 , F21V29/773 , F21V29/89 , F21Y2105/10 , F21Y2115/10 , H01L33/56 , H01L33/60 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48227 , H01L2224/73265 , H05K1/0274 , H05K1/056 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014 , H01L2924/00
摘要： According to one embodiment, a light-emitting device includes a substrate, a light reflection layer, a plurality of light-emitting elements, and a sealing member. The substrate includes an insulating layer constituted of epoxy resin using an acid anhydride as a hardening agent or one of a polyimide resin, a polyethylene terephthalate resin, and a fluororesin. The light reflection layer is formed on the insulating layer. The light reflection layer includes a metallic light-reflecting surface higher in optical reflectance than the insulating layer. The light-emitting elements are mounted on the light-reflecting surface. The sealing member is constituted of a material having gas permeability and translucency, and is formed on the insulating layer to seal the light reflection layer and the light-emitting elements.
摘要翻译：根据一个实施例，发光器件包括衬底，光反射层，多个发光元件和密封构件。基板包括由使用酸酐作为硬化剂的环氧树脂或聚酰亚胺树脂，聚对苯二甲酸乙二醇酯树脂和氟树脂之一构成的绝缘层。光反射层形成在绝缘层上。光反射层包括比绝缘层高的光反射率的金属光反射表面。发光元件安装在光反射表面上。密封构件由具有透气性和半透明性的材料构成，并且形成在绝缘层上以密封光反射层和发光元件。

8. 发明授权

US08783914B2 Light emitting apparatus and illumination apparatus 失效
标题翻译：发光装置和照明装置
公开(公告)号：US08783914B2
公开(公告)日：2014-07-22
申请号：US13255220
申请日：2010-03-29
申请人： Tomohiro Sanpei , Erika Takenaka
发明人： Tomohiro Sanpei , Erika Takenaka
IPC分类号： F21V7/00
CPC分类号： H01L33/56 , F21K9/68 , F21Y2115/10 , H01L25/0753 , H01L33/60 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49113 , H01L2224/73265 , H01L2224/8592 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A light emitting apparatus comprising a light reflecting surface made of a metal, a light emitting element which has an electrode and is mounted on the light reflecting surface, and a sealing member which covers the light reflecting surface and the light emitting element. The sealing member has translucency and oxygen gas permeability of 40000 cc/m2·day or below.
摘要翻译：一种发光装置，包括由金属制成的光反射表面，具有电极并安装在光反射表面上的发光元件以及覆盖光反射表面和发光元件的密封构件。密封件的半透明度和氧气渗透率为40000cc / m2·天或以下。

9. 发明授权

US08446082B2 Light-emitting device and illumination device 失效
标题翻译：发光装置和照明装置
公开(公告)号：US08446082B2
公开(公告)日：2013-05-21
申请号：US13049571
申请日：2011-03-16
申请人： Tomohiro Sanpei , Erika Takenaka
发明人： Tomohiro Sanpei , Erika Takenaka
IPC分类号： H01L33/48 , H01L33/60
CPC分类号： H05K3/284 , F21K9/23 , F21V3/00 , F21V23/002 , F21V29/773 , F21V29/89 , F21Y2105/10 , F21Y2115/10 , H01L33/56 , H01L33/60 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48227 , H01L2224/73265 , H05K1/0274 , H05K1/056 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014 , H01L2924/00
摘要： According to one embodiment, a light-emitting device includes a substrate, a light reflection layer, a plurality of light-emitting elements, and a sealing member. The substrate includes an insulating layer constituted of epoxy resin using an acid anhydride as a hardening agent or one of a polyimide resin, a polyethylene terephthalate resin, and a fluororesin. The light reflection layer is formed on the insulating layer. The light reflection layer includes a metallic light-reflecting surface higher in optical reflectance than the insulating layer. The light-emitting elements are mounted on the light-reflecting surface. The sealing member is constituted of a material having gas permeability and translucency, and is formed on the insulating layer to seal the light reflection layer and the light-emitting elements.
摘要翻译：根据一个实施例，发光器件包括衬底，光反射层，多个发光元件和密封构件。基板包括由使用酸酐作为硬化剂的环氧树脂或聚酰亚胺树脂，聚对苯二甲酸乙二醇酯树脂和氟树脂之一构成的绝缘层。光反射层形成在绝缘层上。光反射层包括比绝缘层高的光反射率的金属光反射表面。发光元件安装在光反射表面上。密封构件由具有透气性和半透明性的材料构成，并且形成在绝缘层上以密封光反射层和发光元件。

10. 发明授权

US08354783B2 Light-emitting device.having a frame member surrounding light-emitting elements and illumination device utilizing light-emitting device 有权
标题翻译：发光装置具有围绕发光元件的框架构件和利用发光装置的照明装置
公开(公告)号：US08354783B2
公开(公告)日：2013-01-15
申请号：US12885005
申请日：2010-09-17
申请人： Erika Takenaka , Tomohiro Sanpei , Takeo Idezuki
发明人： Erika Takenaka , Tomohiro Sanpei , Takeo Idezuki
IPC分类号： H01J5/50
CPC分类号： F21K9/23 , F21Y2115/10 , H01L25/0753 , H01L2224/48091 , H01L2224/48137 , H01L2924/181 , H01L2933/005 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： According to one embodiment, a light-emitting device includes a substrate including power-supply conductors, a frame member, and a sealing member. The power-supply conductors are formed on the substrate. A plurality of light-emitting elements including electrodes are mounted on the substrate. The electrodes of the light-emitting elements adjacent to the power-supply conductors are electrically connected to the power-supply conductors by a plurality of bonding wires. The frame member is made of resin which is coated on the substrate so as to surround the light-emitting elements and the bonding wires. The sealing member is filled in an area surrounded by the frame member and seals the light-emitting elements and the bonding wires.
摘要翻译：根据一个实施例，发光装置包括包括电源导体，框架构件和密封构件的基板。电源导体形成在基板上。包括电极的多个发光元件安装在基板上。与电源导体相邻的发光元件的电极通过多根接合线电连接到电源导体。框架构件由涂覆在基板上以围绕发光元件和接合线的树脂制成。密封构件填充在由框架构件包围的区域中，并且密封发光元件和接合线。

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