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    • 2. 发明授权
    • Method of making self-aligned, high-enegry implanted photodiode for solid-state image sensors
    • 制造用于固态图像传感器的自对准高掺杂光电二极管的方法
    • US06306676B1
    • 2001-10-23
    • US08628063
    • 1996-04-04
    • Eric G. StevensStephen L. KosmanDavid L. LoseeJames P. Lavine
    • Eric G. StevensStephen L. KosmanDavid L. LoseeJames P. Lavine
    • H01L2100
    • H01L27/14812H01L27/14683H01L27/14843
    • A method and apparatus of making high energy implanted photodiode that is self aligned with the transfer gate, the high energy implant is defined by providing a substrate, or well, of a first conductivity type, defining a charge coupled device within the substrate, or well, such that gate electrode layers are allowed to exist over areas to contain photodiodes during construction of the charge coupled device, patterning a masking layer to block high energy implants such that openings in the masking layer are formed over the areas of the photodiodes, anisotropically etching down through the gate electrode over the photodiodes to the gate dielectric material, implanting photodiodes with high-energy ions of a second conductivity type opposite the first conductivity type and creating a pinned photodiode by employing a shallow implant of the first conductivity type. The apparatus made by this method yields a photodiode employing high energy ions to form the P/N junction that is self aligned with the transfer gate.
    • 一种制造与传输栅极自对准的高能量注入光电二极管的方法和装置,高能量注入是通过提供第一导电类型的衬底或阱来限定的,该衬底或阱限定衬底或阱内的电荷耦合器件 ,使得栅极电极层在电荷耦合器件的构造期间允许存在于包含光电二极管的区域上,构图掩模层以阻挡高能量注入,使得掩模层中的开口形成在光电二极管的区域上,各向异性蚀刻 向下通过光电二极管上的栅电极到栅介电材料,用与第一导电类型相反的第二导电类型的高能离子注入光电二极管,并通过采用第一导电类型的浅埋入物产生钉扎光电二极管。 通过该方法制造的装置产生使用高能离子的光电二极管,以形成与传输门自对准的P / N结。
    • 4. 发明授权
    • Transfer gate for photodiode to CCD image sensor
    • 光电二极管传输门到CCD图像传感器
    • US5070380A
    • 1991-12-03
    • US566934
    • 1990-08-13
    • Herbert J. ErhardtEdward T. NelsonEric G. Stevens
    • Herbert J. ErhardtEdward T. NelsonEric G. Stevens
    • H01L27/148H01L29/768H04N5/363H04N5/372H04N5/378
    • H01L29/76833H01L27/14831
    • An image sensor formed on a P-type substrate includes a plurality of pinned diode photodiodes, a CCD shift register and a separate buried transfer gate located between each of the photodiodes and the CCD shift register. The photodetectors are arranged in at least one line. The CCD shift register extends along the line of photodetectors. Each of the pinned diode photodetectors includes a first region of N-type conductivity in the substrate and a second region of P+ type conductivity in the first region and along the substrate surface. The CCD shift register includes a channel region of N-type conductivity in the substrate surface and two sets of conductive gates along the channel region and insulated from the substrate surface. Each transfer gate includes a transfer channel region of N-type conductivity in the substrate and extending along the substrate surface from the shift register channel region to the first region of its respective photodetector. Each gate of one of the sets of shift register gates may have a portion which extends over the transfer gate channel region.
    • 形成在P型基板上的图像传感器包括多个固定二极管光电二极管,CCD移位寄存器和位于每个光电二极管和CCD移位寄存器之间的单独的掩埋传输门。 光电探测器布置在至少一条线上。 CCD移位寄存器沿着光电检测器的线延伸。 每个钉扎二极管光电探测器包括衬底中的N型导电性的第一区域和第一区域中的沿着衬底表面的P +型导电性的第二区域。 CCD移位寄存器包括衬底表面中N型导电的沟道区和沿着沟道区的两组导电栅,并与衬底表面绝缘。 每个转移栅极包括在衬底中的N型导电性的转移沟道区,并且沿衬底表面从移位寄存器沟道区延伸到其各自的光电检测器的第一区。 移位寄存器门组中的一个的每个栅极可以具有在传输栅极沟道区域上延伸的部分。
    • 6. 发明申请
    • PHOTODETECTOR ISOLATION IN IMAGE SENSORS
    • 图像传感器中的光电隔离
    • US20120080731A1
    • 2012-04-05
    • US12894262
    • 2010-09-30
    • Hung Q. DoanEric G. StevensRobert M. Guidash
    • Hung Q. DoanEric G. StevensRobert M. Guidash
    • H01L27/146
    • H01L27/1463H01L27/14607H01L27/1461H01L27/14645H01L27/14689
    • A first shallow trench isolation region is disposed in the silicon semiconductor layer laterally adjacent to a photodetector while a second shallow trench isolation region is disposed in the silicon semiconductor layer laterally adjacent to other electrical components in a pixel. The first and second shallow trench isolation regions each include a trench disposed in the silicon semiconductor layer that is filled with a dielectric material. An isolation layer having the second conductivity is disposed only along a portion of a bottom and only along a sidewall of the trench immediately adjacent to the photodetector. The isolation layer is not disposed along the other portion of the bottom and along the other sidewall of the trench adjacent the photodetector. The isolation layer is not disposed along the bottom and sidewalls of the trench adjacent to the other electrical components.
    • 第一浅沟槽隔离区域设置在与半导体器件的光电探测器侧向相邻的硅半导体层中,而第二浅沟槽隔离区域设置在与半导体层中的像素中的其它电气元件横向相邻的硅半导体层中。 第一和第二浅沟槽隔离区域各自包括设置在硅半导体层中的填充有电介质材料的沟槽。 具有第二导电性的隔离层仅沿着底部的一部分并且仅沿着与光电检测器紧邻的沟槽的侧壁设置。 隔离层不沿着底部的另一部分并且沿着邻近光电检测器的沟槽的另一个侧壁设置。 绝缘层不沿着与其它电气部件相邻的沟槽的底部和侧壁设置。
    • 7. 发明申请
    • TRENCH ISOLATION REGIONS IN IMAGE SENSORS
    • 图像传感器中的分离区域
    • US20100148230A1
    • 2010-06-17
    • US12332407
    • 2008-12-11
    • Eric G. StevensHung Q. Doan
    • Eric G. StevensHung Q. Doan
    • H01L21/762H01L31/112
    • H01L27/14689H01L21/76224H01L27/1463
    • Trenches are formed in a substrate or layer and a solid source doped with one or more dopants is deposited over the image sensor such that the solid source fills the one or more trenches and is disposed on the surface of the substrate. The surface of the image sensor is then planarized so that the solid source remains only in the trenches. A thermal drive operation is performed to cause at least a portion of the one or more dopants in the solid source to diffuse into the portions of the substrate or layer that are immediately adjacent to and surround the sidewall and bottom surfaces of the trenches. The diffused dopant or dopants form passivation regions that passivate the interface between the substrate or layer and the sidewall and bottom surfaces of the trenches.
    • 沟槽形成在衬底或层中,并且掺杂有一种或多种掺杂剂的固体源沉积在图像传感器上,使得固体源填充一个或多个沟槽并且设置在衬底的表面上。 然后将图像传感器的表面平坦化,使得固体源仅保留在沟槽中。 执行热驱动操作以使固体源中的一种或多种掺杂剂的至少一部分扩散到紧邻和围绕沟槽的侧壁和底表面的衬底或层的部分。 扩散掺杂剂或掺杂剂形成钝化区域,其钝化衬底或层与沟槽的侧壁和底表面之间的界面。