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    • 1. 发明授权
    • Thin film capacitor and method of manufacturing the same
    • 薄膜电容器及其制造方法
    • US5406445A
    • 1995-04-11
    • US216966
    • 1994-03-24
    • Eiji FujiiAtsushi TomozawaHideo ToriiMasumi HattoriRyoichi TakayamaSatoru Fujii
    • Eiji FujiiAtsushi TomozawaHideo ToriiMasumi HattoriRyoichi TakayamaSatoru Fujii
    • H01G4/20H01L29/04H01L23/48
    • H01G4/20H01L2224/4918H01L2924/181
    • A NaCl oxide thin layer oriented to (100) face or a spinel oxide thin layer oriented to (100) face, a perovskite dielectric thin layer oriented to (100) face and a metal electrode are sequentially laminated on a metal electrode, thus providing a thin film capacitor. Or alternatively, a thin film capacitor is manufactured by sequentially laminating a NaCl oxide thin layer oriented to (100) face or a spinel oxide thin layer oriented to (100) face, a platinum thin layer as a lower electrode oriented to (100) face, a perovskite dielectric thin layer oriented to (100) face and a metal thin layer as an upper electrode on a substrate. A plasma-enhanced CVD method is applied to form a NaCl oxide thin layer, a spinel oxide thin layer and a perovskite dielectric thin layer while a vacuum deposition method, a sputtering method, a CVD method or a plasma-enhanced CVD method is applied for the formation of a metal electrode.
    • 将取向为(100)面的NaCl氧化物薄层或取向为(100)面的尖晶石氧化物薄层,朝向(100)面的钙钛矿电介质薄层和金属电极依次层压在金属电极上,从而提供 薄膜电容器。 或者,通过依次层叠取向于(100)面的氧化锌薄膜或取向为(100)面的尖晶石氧化物薄层,将铂薄层作为朝向(100)面的下部电极而制造薄膜电容器 取向为(100)面的钙钛矿电介质薄层和在基板上作为上部电极的金属薄层。 当采用真空沉积法,溅射法,CVD法或等离子体增强CVD法应用等离子体增强CVD法形成NaCl氧化物薄层,尖晶石氧化物薄层和钙钛矿电介质薄层 形成金属电极。