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1. 发明申请

US20070161342A1 Polishing pad, polishing apparatus and method for polishing wafer 审中-公开
标题翻译：抛光垫，抛光装置和抛光晶圆的方法
公开(公告)号：US20070161342A1
公开(公告)日：2007-07-12
申请号：US11710916
申请日：2007-02-27
申请人： Eigo Shirakashi , Muneyuki Matsumoto , Mitsunari Satake , Kenji Kobayashi
发明人： Eigo Shirakashi , Muneyuki Matsumoto , Mitsunari Satake , Kenji Kobayashi
IPC分类号： B24B21/00 , B24D11/00
CPC分类号： B24B37/24 , B24B37/205 , B24D11/02 , C09K3/1463
摘要： A polishing apparatus includes a belt-type surface plate stretched between two rollers each having a rotation shaft arranged in parallel to that of the other roller, a plurality of sheet-type polishing pads stuck on the surface plate, and a dresser for activating the polishing pads. Part of an upper end portion of each of the polishing pads facing an adjacent one of the polishing pads has an obtuse angle. Thus, the dresser is not caught by the upper end portion of each of the polishing pads, so that the generation of a scratch in the polishing pads. Therefore, a semiconductor wafer can be polished without causing a scratch thereon.
摘要翻译：抛光装置包括在两个辊之间拉伸的带状表面板，每个辊具有平行于另一个辊的旋转轴，粘附在表面板上的多个片状抛光垫和用于激活抛光的修整器垫每个抛光垫的面向相邻的一个抛光垫的上端部分的一部分具有钝角。因此，修整器不被每个抛光垫的上端部分捕获，从而在抛光垫中产生划痕。因此，半导体晶片可以被抛光而不会在其上产生划痕。

2. 发明授权

US06737348B2 Method for forming buried interconnect 有权
标题翻译：掩埋互连的形成方法
公开(公告)号：US06737348B2
公开(公告)日：2004-05-18
申请号：US10120385
申请日：2002-04-12
申请人： Mitsunari Satake , Masashi Hamanaka , Hideaki Yoshida
发明人： Mitsunari Satake , Masashi Hamanaka , Hideaki Yoshida
IPC分类号： H01L21461
CPC分类号： H01L21/7684 , H01L21/31053 , H01L21/3212 , H01L21/76819
摘要： Holes are formed in a first insulating film deposited on a substrate. After depositing a first conducting film over the first insulating film including the holes, the first conducting film is subjected to first CMP, so as to form plugs from the first conducting film. Next, the first insulating film is subjected to second CMP with a polishing rate of the first insulating film higher than a polishing rate of the first conducting film, so as to planarize the first insulating film by eliminating erosion caused in a region of the first insulating film where the plugs are densely formed. After depositing a second insulating film on the planarized first insulating film, interconnect grooves are formed in the second insulating film. After depositing a second conducting film over the second insulating film including the interconnect grooves, the second conducting film is subjected to third CMP, so as to form buried interconnects from the second conducting film.
摘要翻译：在沉积在基板上的第一绝缘膜中形成孔。在包括孔的第一绝缘膜上沉积第一导电膜之后，对第一导电膜进行第一CMP，以形成来自第一导电膜的插塞。接下来，对第一绝缘膜进行第二CMP，其中第一绝缘膜的抛光速率高于第一导电膜的抛光速率，以便通过消除在第一绝缘膜的区域中引起的侵蚀而使第一绝缘膜平坦化胶片密集地形成。在平坦化的第一绝缘膜上沉积第二绝缘膜之后，在第二绝缘膜中形成互连槽。在包括互连槽的第二绝缘膜上沉积第二导电膜之后，对第二导电膜进行第三CMP，以形成来自第二导电膜的掩埋互连。

3. 发明授权

US06746962B2 Method for fabricating a semi-conductor device having a tungsten film-filled via hole 有权
标题翻译：用于制造具有填充有钨膜的通孔的半导体器件的方法
公开(公告)号：US06746962B2
公开(公告)日：2004-06-08
申请号：US09978723
申请日：2001-10-18
申请人： Takenobu Kishida , Takeshi Harada , Toru Hinomura , Hiromitsu Abe , Mitsunari Satake , Kenichi Kunimitsu
发明人： Takenobu Kishida , Takeshi Harada , Toru Hinomura , Hiromitsu Abe , Mitsunari Satake , Kenichi Kunimitsu
IPC分类号： H01L21302
CPC分类号： H01L21/76843 , H01L21/7684 , H01L21/76846 , H01L21/7685 , H01L21/76862 , H01L21/76876 , H01L21/76877
摘要： A first metal film is deposited on a bottom and a wall of a recess formed in an insulating film on a semiconductor substrate. A second metal film is filled in the recess on the first metal film. The second metal film is formed from a polycrystalline tungsten film having a crystal plane of a (110) orientation.
摘要翻译：第一金属膜沉积在形成在半导体衬底上的绝缘膜中的凹部的底部和壁上。第二金属膜被填充在第一金属膜上的凹部中。第二金属膜由具有（110）取向晶体面的多晶钨膜形成。

4. 发明授权

US6074289A Apparatus for holding substrate to be polished 失效
标题翻译：用于保持要抛光的基板的装置
公开(公告)号：US6074289A
公开(公告)日：2000-06-13
申请号：US991640
申请日：1997-12-16
申请人： Tomoyasu Murakami , Mikio Nishio , Mitsunari Satake
发明人： Tomoyasu Murakami , Mikio Nishio , Mitsunari Satake
IPC分类号： B24B37/04 , B24B37/30 , B24B41/06 , H01L21/304 , H01L21/306 , H01L21/683 , B24B7/22
CPC分类号： H01L21/6838 , B24B37/30 , B24B41/06 , H01L21/67092 , H01L21/30625
摘要： An apparatus for holding a substrate to be polished comprises: a rotating rotary shaft; a substrate holding head in the form of a disc; a sealing member provided to the back face of the substrate holding head; a guiding member which is provided to the back face of the substrate holding head to be located outside the sealing member; and a fluid flow path which vertically penetrates the inside of the substrate holding head. The fluid flow path allows an air under pressure introduced from the upper end side thereof to flow out through the opening at the lower end thereof to a space. The sealing member is formed with a ventilation body having a large number of successive vent openings in the inside such as nonwoven fabric.
摘要翻译：用于保持待抛光的基板的装置包括：旋转的旋转轴; 盘状的基板保持头; 设置在所述基板保持头的背面的密封构件; 引导构件，其设置在所述基板保持头的背面以位于所述密封构件的外部; 以及垂直地穿过基板保持头内部的流体流路。流体流路允许从其上端侧引入的压力下方的空气通过其下端的开口流出到空间。密封构件形成有在内部具有大量连续排气孔的通风体，例如无纺织物。

5. 发明授权

US6012967A Polishing method and polishing apparatus 失效
标题翻译：抛光方法和抛光装置
公开(公告)号：US6012967A
公开(公告)日：2000-01-11
申请号：US979693
申请日：1997-11-26
申请人： Mitsunari Satake , Mikio Nishio , Tomoyasu Murakami
发明人： Mitsunari Satake , Mikio Nishio , Tomoyasu Murakami
IPC分类号： B24B1/00 , B24B37/015 , H01L21/304
CPC分类号： B24B37/015 , B24B37/107 , B24B37/34 , B24B49/14 , B24B57/02 , H01L21/31053 , H01L21/3212
摘要： A rotatable platen has a polishing pad adhered to the top surface thereof. A carrier for holding a substrate and a slurry supply pipe for supplying an abrasive slurry onto the near-center region of the polishing pad are provided above the polishing pad. Two lamps for partially irradiating the surface of the polishing pad with visible light or infrared light are provided at respective locations above the polishing pad and upstream of the carrier in the direction of rotation of the platen. Of the area of the polishing pad in contact with the substrate, a region closer to the center of rotation of the polishing pad and a region farther away therefrom are heated by the two lamps.
摘要翻译：可旋转压板具有粘附到其顶表面的抛光垫。在抛光垫的上方设置用于保持基板的载体和用于将磨料浆料供给到抛光垫的近中心区域的浆料供给管。用于以可见光或红外光部分地照射抛光垫的表面的两个灯被设置在抛光垫上方的相应位置和载体的上游沿着压板的旋转方向。在与基板接触的抛光垫的区域中，靠近抛光垫的旋转中心的区域和远离抛光垫的区域被两个灯加热。

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