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1. 发明授权

US6074289A Apparatus for holding substrate to be polished 失效
标题翻译：用于保持要抛光的基板的装置
公开(公告)号：US6074289A
公开(公告)日：2000-06-13
申请号：US991640
申请日：1997-12-16
申请人： Tomoyasu Murakami , Mikio Nishio , Mitsunari Satake
发明人： Tomoyasu Murakami , Mikio Nishio , Mitsunari Satake
IPC分类号： B24B37/04 , B24B37/30 , B24B41/06 , H01L21/304 , H01L21/306 , H01L21/683 , B24B7/22
CPC分类号： H01L21/6838 , B24B37/30 , B24B41/06 , H01L21/67092 , H01L21/30625
摘要： An apparatus for holding a substrate to be polished comprises: a rotating rotary shaft; a substrate holding head in the form of a disc; a sealing member provided to the back face of the substrate holding head; a guiding member which is provided to the back face of the substrate holding head to be located outside the sealing member; and a fluid flow path which vertically penetrates the inside of the substrate holding head. The fluid flow path allows an air under pressure introduced from the upper end side thereof to flow out through the opening at the lower end thereof to a space. The sealing member is formed with a ventilation body having a large number of successive vent openings in the inside such as nonwoven fabric.
摘要翻译：用于保持待抛光的基板的装置包括：旋转的旋转轴; 盘状的基板保持头; 设置在所述基板保持头的背面的密封构件; 引导构件，其设置在所述基板保持头的背面以位于所述密封构件的外部; 以及垂直地穿过基板保持头内部的流体流路。流体流路允许从其上端侧引入的压力下方的空气通过其下端的开口流出到空间。密封构件形成有在内部具有大量连续排气孔的通风体，例如无纺织物。

2. 发明授权

US6012967A Polishing method and polishing apparatus 失效
标题翻译：抛光方法和抛光装置
公开(公告)号：US6012967A
公开(公告)日：2000-01-11
申请号：US979693
申请日：1997-11-26
申请人： Mitsunari Satake , Mikio Nishio , Tomoyasu Murakami
发明人： Mitsunari Satake , Mikio Nishio , Tomoyasu Murakami
IPC分类号： B24B1/00 , B24B37/015 , H01L21/304
CPC分类号： B24B37/015 , B24B37/107 , B24B37/34 , B24B49/14 , B24B57/02 , H01L21/31053 , H01L21/3212
摘要： A rotatable platen has a polishing pad adhered to the top surface thereof. A carrier for holding a substrate and a slurry supply pipe for supplying an abrasive slurry onto the near-center region of the polishing pad are provided above the polishing pad. Two lamps for partially irradiating the surface of the polishing pad with visible light or infrared light are provided at respective locations above the polishing pad and upstream of the carrier in the direction of rotation of the platen. Of the area of the polishing pad in contact with the substrate, a region closer to the center of rotation of the polishing pad and a region farther away therefrom are heated by the two lamps.
摘要翻译：可旋转压板具有粘附到其顶表面的抛光垫。在抛光垫的上方设置用于保持基板的载体和用于将磨料浆料供给到抛光垫的近中心区域的浆料供给管。用于以可见光或红外光部分地照射抛光垫的表面的两个灯被设置在抛光垫上方的相应位置和载体的上游沿着压板的旋转方向。在与基板接触的抛光垫的区域中，靠近抛光垫的旋转中心的区域和远离抛光垫的区域被两个灯加热。

3. 发明授权

US6099390A Polishing pad for semiconductor wafer and method for polishing semiconductor wafer 失效
标题翻译：用于半导体晶片的抛光垫和用于抛光半导体晶片的方法
公开(公告)号：US6099390A
公开(公告)日：2000-08-08
申请号：US285647
申请日：1999-04-05
申请人： Mikio Nishio , Tomoyasu Murakami
发明人： Mikio Nishio , Tomoyasu Murakami
IPC分类号： B24B37/20 , B24B37/24 , B24B37/26 , B24D11/00 , H01L21/304 , B24B1/00
CPC分类号： B24B37/26
摘要： A polishing pad used for polishing a film on a semiconductor wafer and made of a plastic includes a polishing pad body, and a large number of convex portions, which are provided on the surface of the polishing pad body just like so many islands and each have a flat top surface. An average length L of respective sides or diameters of the convex portions on the top surface thereof is in the range from 0.1 mm to 5.0 mm, both inclusive; an average height H of the convex portions is in the range from 0.1 mm to 0.5 mm, both inclusive; and H.ltoreq.L.ltoreq.2S is met, where S is an average space between the convex portions.
摘要翻译：用于在半导体晶片上抛光并由塑料制成的薄膜的抛光垫包括抛光垫体和大量的凸起部分，它们像抛光垫体的表面一样设置在许多岛上并且各自具有平顶面。上表面的凸部的各个侧面或直径的平均长度L在0.1mm〜5.0mm的范围内; 凸部的平均高度H在0.1mm〜0.5mm的范围内; 并且满足H

4. 发明授权

US5866480A Method and apparatus for polishing semiconductor substrate 失效
标题翻译：用于研磨半导体衬底的方法和装置
公开(公告)号：US5866480A
公开(公告)日：1999-02-02
申请号：US697509
申请日：1996-08-26
申请人： Tomoyasu Murakami , Mikio Nishio
发明人： Tomoyasu Murakami , Mikio Nishio
IPC分类号： B24B37/04 , H01L21/304
CPC分类号： B24B37/04 , B24B57/02
摘要： A polishing pad is adhered to the top surface of a flat polishing pad holder of a platen. A substrate holding head for holding and rotating a semiconductor substrate is provided above the platen. The semiconductor substrate is rotated and pressed against the polishing pad on the platen. A slurry is supplied in a prescribed amount from a slurry supply pipe onto the polishing pad. A slat-like slurry pushing member for pushing the slurry to a central portion of the platen is provided slidably over the polishing pad. The slurry pushing member is fixed so that an inner portion thereof in a radial direction of the platen is downstream of an outer portion thereof in the radial direction of the platen in the direction of rotation of the platen during polishing.
摘要翻译：抛光垫粘附到压板的平坦抛光垫保持器的顶表面上。用于保持和旋转半导体衬底的衬底保持头设置在压板上方。将半导体衬底旋转并压靠在压板上的抛光垫上。从浆料供给管将规定量的浆料供给到研磨垫上。用于将浆料推送到压板的中心部分的板条浆料推动构件可滑动地设置在抛光垫上。浆料推动构件被固定，使得其在压板的径向方向上的内部部分在压板的径向方向上在压板的径向方向上在抛光期间在压板的旋转方向上在其下方。

5. 发明授权

US06812493B2 Thin-film semiconductor element and method of producing same 失效
标题翻译：薄膜半导体元件及其制造方法
公开(公告)号：US06812493B2
公开(公告)日：2004-11-02
申请号：US10240648
申请日：2002-10-04
申请人： Mikio Nishio
发明人： Mikio Nishio
IPC分类号： H01L27108
CPC分类号： H01L29/66757 , G02F1/1368 , H01L27/124 , H01L27/3244 , H01L29/78621 , H01L29/78624
摘要： The present invention provides a thin film semiconductor element which is small in area with high on-current enough to be suitable for the power saving, miniaturization, and high definition display of a device. According to the present invention, an outer shape of a semiconductor thin film is processed and regions (a channel region, a source region, and a drain region) in the semiconductor thin film are formed by using, as masks, other element components such as a gate electrode. Specifically, ion-implanted regions are formed by implanting impurity ions into predetermined regions of the semiconductor thin film using, as a mask, the gate electrode overlapped on the thin film via an insulation film. Thereafter, the semiconductor is processed into a predetermined shape by etching using, as masks, previously formed element components such as the gate electrode.
摘要翻译：本发明提供一种薄膜半导体元件，其面积小，具有足够高的导通电流，以适合于器件的省电，小型化和高清晰度显示。根据本发明，对半导体薄膜的外形进行处理，并且通过使用其他元件组件作为掩模来形成半导体薄膜中的区域（沟道区域，源极区域和漏极区域）栅电极。具体地，通过使用绝缘膜将作为掩模的栅电极重叠在薄膜上的杂质离子注入到半导体薄膜的预定区域中，形成离子注入区域。此后，通过使用诸如栅电极的预先形成的元件组件作为掩模，通过蚀刻将半导体处理成预定形状。

6. 发明授权

US5868610A Mehtod and aparatus for polishing semiconductor substrate 失效
公开(公告)号：US5868610A
公开(公告)日：1999-02-09
申请号：US834513
申请日：1997-04-04
申请人： Mikio Nishio
发明人： Mikio Nishio
IPC分类号： B24B37/04 , B24B1/00
CPC分类号： B24B37/042
摘要： An elastic polishing pad is adhered to a surface of a flat substrate holder of a platen. A substrate holding head which holds and rotates a semiconductor substrate is provided above a first region extending from the central portion to peripheral portion of the polishing pad. The semiconductor substrate rotated by the substrate holding head is pressed against the first region of the polishing pad. A slurry is dropped in a prescribed amount from an abrasive supply pipe onto the polishing pad. Pad pressing means for pressing the polishing pad is provided above a second region extending from the central portion to peripheral portion of the platen. The pad pressing means has a disk-shaped pad pressing plate and a rotary shaft for holding the pad pressing plate.

7. 发明授权

US5451261A Metal film deposition apparatus and metal film deposition method 失效
标题翻译：金属膜沉积装置和金属膜沉积方法
公开(公告)号：US5451261A
公开(公告)日：1995-09-19
申请号：US114144
申请日：1993-09-01
申请人： Toyokazu Fujii , Mikio Nishio , Mitsuru Sekiguchi , Kazuhiko Hashimoto
发明人： Toyokazu Fujii , Mikio Nishio , Mitsuru Sekiguchi , Kazuhiko Hashimoto
IPC分类号： C23C14/04 , C23C16/04 , H01L21/00 , H01L21/677 , C23C16/00
CPC分类号： H01L21/67167 , C23C14/042 , C23C16/042 , H01L21/67207 , H01L21/67225 , H01L21/67796 , H01L2223/54473 , H01L2223/5448 , Y10S438/975
摘要： On a semiconductor substrate, chips to be products and alignment chips located at a portion a part thereof is left out from a peripheral part of the semiconductor substrate are formed. Contact holes and alignment marks are formed at the chips to be products and the alignment chips. Covering the alignment chips with alignment mark cover parts of a substrate holder, a material for metal wiring is deposited on the semiconductor substrate to form a metal film on the substrate. A mask pattern is formed on the metal film using the alignment marks of the alignment chips on which the metal film is not formed.
摘要翻译：在半导体基板上，形成从半导体基板的周边部分留出的成为产品的芯片和位于其一部分的对准芯片。在作为产品的芯片和对准芯片上形成接触孔和对准标记。用衬底保持器的对准标记覆盖部分覆盖对准芯片，在半导体衬底上沉积用于金属布线的材料，以在衬底上形成金属膜。使用未形成金属膜的取向芯片的对准标记，在金属膜上形成掩模图案。

8. 发明授权

US5939132A Alignment chips positioned in the peripheral part of the semiconductor substrate and method of manufacturing thereof 失效
标题翻译：定位在半导体衬底的周边部分的对准芯片及其制造方法
公开(公告)号：US5939132A
公开(公告)日：1999-08-17
申请号：US833193
申请日：1997-04-14
申请人： Toyokazu Fujii , Mikio Nishio , Mitsuru Sekiguchi , Kazuhiko Hashimoto
发明人： Toyokazu Fujii , Mikio Nishio , Mitsuru Sekiguchi , Kazuhiko Hashimoto
IPC分类号： C23C14/04 , C23C16/04 , H01L21/00 , H01L21/677 , B05D5/12 , H07L21/301
CPC分类号： H01L21/67167 , C23C14/042 , C23C16/042 , H01L21/67207 , H01L21/67225 , H01L21/67796 , H01L2223/54473 , H01L2223/5448 , Y10S438/975
摘要： On a semiconductor substrate, chips to be products and alignment chips located at a portion a part thereof is left out from a peripheral part of the semiconductor substrate are formed. Contact holes and alignment marks are formed at the chips to be products and the alignment chips. Covering the alignment chips with alignment mark cover parts of a substrate holder, a material for metal wiring is deposited on the semiconductor substrate to form a metal film on the substrate. A mask pattern is formed on the metal film using the alignment marks of the alignment chips on which the metal film is not formed.
摘要翻译：在半导体基板上，形成从半导体基板的周边部分留出的成为产品的芯片和位于其一部分的对准芯片。在作为产品的芯片和对准芯片上形成接触孔和对准标记。用衬底保持器的对准标记覆盖部分覆盖对准芯片，在半导体衬底上沉积用于金属布线的材料，以在衬底上形成金属膜。使用未形成金属膜的取向芯片的对准标记，在金属膜上形成掩模图案。

9. 发明授权

US5921853A Apparatus for polishing substrate using resin film or multilayer polishing pad 失效
标题翻译：用于使用树脂膜或多层抛光垫研磨衬底的装置
公开(公告)号：US5921853A
公开(公告)日：1999-07-13
申请号：US811355
申请日：1997-03-04
申请人： Mikio Nishio
发明人： Mikio Nishio
IPC分类号： B24B37/04 , B24B57/02 , B24B29/02 , B24B49/12 , B24D11/00
CPC分类号： B24B37/30 , B24B37/04 , B24B57/02
摘要： An elastic polishing pad is adhered to the top face of a rotatable table. Above the table is provided a substrate holding apparatus for holding a substrate. The substrate holding apparatus comprises a rotary shaft, a substrate holding head in the form of a disc which is provided integrally with the lower edge of the rotary shaft, a sealing member in the form of a ring which is made of an elastic material and fastened to the peripheral portion of the lower face of the substrate holding head, and a guiding member in the form of a ring which is fastened to the back face of the substrate holding head to be located outside the sealing member. A fluid under pressure is introduced into a fluid flow path formed in the rotary shaft from one end thereof and supplied to a space from the other end of the fluid flow path so as to press the substrate against the polishing pad.
摘要翻译：弹性抛光垫粘附在可旋转工作台的顶面上。在桌子上方设置有用于保持基板的基板保持装置。基板保持装置包括旋转轴，与旋转轴的下边缘一体设置的盘形的基板保持头，环形形式的密封构件，该密封构件由弹性材料制成并紧固到基板保持头的下表面的周边部分，以及环形形式的引导构件，其被紧固到基板保持头的背面以位于密封构件外部。在压力下的流体从其一端被引入形成在旋转轴中的流体流路中，并从流体流路的另一端供给到空间，以将基板压靠在抛光垫上。

10. 发明授权

US5791973A Apparatus for holding substrate to be polished and apparatus and method for polishing substrate 失效
标题翻译：用于保持待抛光基板的设备和用于抛光基板的设备和方法
公开(公告)号：US5791973A
公开(公告)日：1998-08-11
申请号：US629691
申请日：1996-04-09
申请人： Mikio Nishio
发明人： Mikio Nishio
IPC分类号： B24B37/04 , B24B57/02 , B24B5/02 , B24B1/00 , B24B29/04
CPC分类号： B24B37/30 , B24B37/04 , B24B57/02
摘要： An elastic polishing pad is adhered to the top face of a rotatable table. Above the table is provided a substrate holding apparatus for holding a substrate. The substrate holding apparatus comprises a rotary shaft, a substrate holding head in the form of a disc which is provided integrally with the lower edge of the rotary shaft, a sealing member in the form of a ring which is made of an elastic material and fastened to the peripheral portion of the lower face of the substrate holding head, and a guiding member in the form of a ring which is fastened to the back face of the substrate holding head to be located outside the sealing member. A fluid under pressure is introduced into a fluid flow path formed in the rotary shaft from one end thereof and supplied to a space from the other end of the fluid flow path so as to press the substrate against the polishing pad.
摘要翻译：弹性抛光垫粘附在可旋转工作台的顶面上。在桌子上方设置有用于保持基板的基板保持装置。基板保持装置包括旋转轴，与旋转轴的下边缘一体设置的盘形的基板保持头，环形形式的密封构件，该密封构件由弹性材料制成并紧固到基板保持头的下表面的周边部分，以及环形形式的引导构件，其被紧固到基板保持头的背面以位于密封构件外部。在压力下的流体从其一端被引入形成在旋转轴中的流体流路中，并从流体流路的另一端供给到空间，以将基板压靠在抛光垫上。

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