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    • 9. 发明申请
    • Non-volatile memory having a reference transistor
    • 具有参考晶体管的非易失性存储器
    • US20050041503A1
    • 2005-02-24
    • US10950855
    • 2004-09-27
    • Gowrishankar ChindaloreRajesh RaoJane Yater
    • Gowrishankar ChindaloreRajesh RaoJane Yater
    • G11C5/00G11C16/28H01L21/28H01L21/336H01L21/8242H01L21/8246H01L27/105H01L29/76
    • H01L27/11568B82Y10/00G11C16/28H01L21/28273H01L21/28282H01L27/105H01L27/11573
    • A non-volatile memory (30) comprises nanocrystal memory cells (50, 51, 53). The program and erase threshold voltage of the memory cell transistors (50, 51, 53) increase as a function of the number of program/erase operations. During a read operation, a reference transistor (46) provides a reference current for comparing with a cell current. The reference transistor (46) is made from a process similar to that used to make the memory cell transistors (50, 51, 53), except that the reference transistor (46) does not include nanocrystals. By using a similar process to make both the reference transistor (46) and the memory cell transistors (50, 51, 53), a threshold voltage of the reference transistor (46) will track the threshold voltage shift of the memory cell transistor (50, 51, 53). A read control circuit (42) is provided to bias the gate of the reference transistor (46). The read control circuit (42) senses a drain current of the reference transistor (46) and adjusts the gate bias voltage to maintain the reference current at a substantially constant value relative to the cell current.
    • 非易失性存储器(30)包括纳米晶体存储单元(50,51,53)。 存储单元晶体管(50,51,53)的编程和擦除阈值电压作为编程/擦除操作的次数增加。 在读取操作期间,参考晶体管(46)提供用于与单元电流进行比较的参考电流。 除了参考晶体管(46)不包括纳米晶体之外,参考晶体管(46)由与制造存储单元晶体管(50,51,53)类似的工艺制成。 通过使用类似的工艺来使参考晶体管(46)和存储单元晶体管(50,51,53)同时工作,参考晶体管(46)的阈值电压将跟踪存储单元晶体管(50)的阈值电压偏移 ,51,53)。 提供读控制电路(42)以偏置参考晶体管(46)的栅极。 读取控制电路(42)感测参考晶体管(46)的漏极电流并调整栅极偏置电压,以使参考电流相对于单元电流保持在基本恒定的值。
    • 10. 发明授权
    • Method of making a non-volatile memory device
    • 制造非易失性存储器件的方法
    • US07557008B2
    • 2009-07-07
    • US11625882
    • 2007-01-23
    • Rajesh RaoRamachandran Muralidhar
    • Rajesh RaoRamachandran Muralidhar
    • H01L21/336
    • H01L21/28273B82Y10/00H01L29/42328H01L29/42332H01L29/66545H01L29/66825H01L29/7881
    • A method forms a nonvolatile memory device using a semiconductor substrate. A charge storage layer is formed overlying the semiconductor substrate and a layer of gate material is formed overlying the charge storage layer to form a control gate electrode. A protective layer overlies the layer of gate material. Dopants are implanted into the semiconductor substrate and are self-aligned to the control gate electrode on at least one side of the control gate electrode to form a source and a drain in the semiconductor substrate on opposing sides of the control gate electrode. The protective layer prevents the dopants from penetrating into the control gate electrode. The protective layer that overlies the layer of gate material is removed. Electrical contact is made to the control gate electrode, the source and the drain. In one form a select gate is also provided in the memory device.
    • 一种方法形成使用半导体衬底的非易失性存储器件。 形成覆盖在半导体衬底上的电荷存储层,并且形成覆盖电荷存储层的栅极材料层以形成控制栅电极。 保护层覆盖栅极材料层。 将掺杂剂注入到半导体衬底中,并且在控制栅电极的至少一侧上与控制栅电极自对准,以在控制栅电极的相对侧上的半导体衬底中形成源极和漏极。 保护层防止掺杂剂渗入控制栅电极。 覆盖栅极材料层的保护层被去除。 与控制栅电极,源极和漏极电接触。 在一种形式中,选择栅极也被提供在存储器件中。