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1. 发明专利

JP2001250560A LITHIUM ION SECONDARY CELL 失效
公开(公告)号：JP2001250560A
公开(公告)日：2001-09-14
申请号：JP2000063626
申请日：2000-03-08
申请人： ENAX INC , NORTH KK
发明人： OZAWA KAZUNORI , IIJIMA ASAO
IPC分类号： H01M4/66 , H01M10/05 , H01M10/0525 , H01M4/02 , H01M10/40
摘要： PROBLEM TO BE SOLVED: To provide a method of avoiding overdischarging, without having to install a protection circuit. SOLUTION: A negative electrode 8 consists of a multi layer foil composed of a copper foil 7 and nickel foils 6. The nickel foils 6 may be aligned on one side (a side for a separator) of the copper foil 7, however, it is better that the nickel foils 6 be aligned to both sides of the copper foil 7. Also as active substance for a positive electrode, a manganese substance, e.g. LiMn2O4 is employed.

2. 发明专利

JPH11273043A Light beam, supporting spring member with magnetic head wiring and its manufacturing method 失效
标题翻译：光束支撑带磁头接头的弹簧及其制造方法
公开(公告)号：JPH11273043A
公开(公告)日：1999-10-08
申请号：JP9225998
申请日：1998-03-23
申请人： Fuchigami Micro:Kk , North Kk , ノース株式会社 , 株式会社渕上ミクロ
发明人： ONO TERUO , UEDA SUSUMU , IIJIMA ASAO
IPC分类号： G11B5/60
摘要： PROBLEM TO BE SOLVED: To economically produce the supporting spring member having a high density wiring by constituting it of the member with a base member, a supporting member and a wiring member, fixing the supporting member made of an insulating material on the base member and constituting the wiring member of the conductive material buried on the surface side of the supporting member.
SOLUTION: The whole shape of the supporting spring member is constituted on a base member 1. A supporting member 2 made of an insulating material is fixed to the member 1 and a wiring member 3 made of a conductive material is buried into the surface side of the member 2 with a prescribed pattern. Various kinds of materials are applicable to member 1 so far as the materials are springy materials. Any kinds of materials are used for the member 2 so far as the materials are molded while keeping a desired insulating characteristic. The member 3 is used to make electrical connections and made of the material having a good conductivity. In general, the member 1 is made of a stainless steel film, the member 2 is made of polyimede and the member 3 is made by copper plating.
COPYRIGHT: (C)1999,JPO
摘要翻译：要解决的问题：为了经济地制造具有高密度布线的支撑弹簧构件，其通过用基座构件，支撑构件和布线构件构成构件，将由绝缘材料制成的支撑构件固定在基座构件上，以及构成埋设在支撑构件的表面侧的导电材料的配线构件。解决方案：支撑弹簧构件的整个形状构成在基座构件1上。由绝缘材料制成的支撑构件2固定到构件1，并且由导电材料制成的布线构件3被埋在成员2具有规定的图案。只要材料是弹性材料，各种材料就适用于构件1。只要在保持所需的绝缘特性的同时模制材料，就可以使用任何种类的材料。构件3用于制造电连接并由具有良好导电性的材料制成。通常，构件1由不锈钢膜制成，构件2由聚酰亚胺构成，构件3通过镀铜制成。

3. 发明专利

JP2001111189A WIRING CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 失效
公开(公告)号：JP2001111189A
公开(公告)日：2001-04-20
申请号：JP28927799
申请日：1999-10-12
申请人： NORTH KK
发明人： IIJIMA ASAO , OSAWA MASAYUKI
IPC分类号： H05K1/11 , H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To avoid bends, folds and dimensional warps of wirings in a manufacturing process, improve the dimensional stability in the manufacturing process to improve the secureness of connections between upper and lower conductor circuits and reduce the cost of upper and lower conductor circuit connection means. SOLUTION: A conductor circuit forming copper foil 23 is formed on a protrusion forming copper layer 21 with an etching barrier layer 22 made of metal other than copper therebetween. The protrusion forming copper layer 21 is selectively etched by an etchant which does not corrode the etching barrier layer 22 to form protrusions 25. The etching barrier layer 22 is removed by an etchant which does not corrode the copper foil 23 of which conductor circuit consists with the protrusions 25 as masks. An interlayer insulating film 27 is formed on the protrusion forming side surface of the copper foil 23, and the protrusions 25 are used as interlayer connection means connected to the conductor circuit.

4. 发明专利

JP2001053189A WIRING BOARD AND MANUFACTURING METHOD THEREOF 失效
公开(公告)号：JP2001053189A
公开(公告)日：2001-02-23
申请号：JP22914099
申请日：1999-08-13
申请人： NORTH KK
发明人： IIJIMA ASAO , OSAWA MASAYUKI , HIRAIDE SHIGEO
IPC分类号： H01L23/12
摘要： PROBLEM TO BE SOLVED: To enable mounting LSI chips on both main surfaces of a wiring board and laminating a plurality of wiring boards on which LSI chips are mounted. SOLUTION: A wiring board is constituted by forming a wiring film 7, on one side of an insulating resin film 5, having an aperture 6 for electric continuity between upper and lower surfaces, and forming on the other side, two kinds of metal protrusions 12, 13 of different height, which are connected with the wiring film 7 through the aperture 6. In this wiring board 14, a solder film 2 is formed selectively on the surface of base metal 1, a metal film 3 is formed on the whole surface, the insulating film 5 having the aperture 6 and the wiring film 7 are formed in the order, and a second solder film 11 is formed on the rear of the base metal 1. By using the solder film 11 as a mask, the base metal 1 is etched, and by using the solder film 2, 11 as masks, the metal film 3 is etched, and the higher metal protrusion 12 and the lower metal protrusion 13 are formed.

5. 发明专利

JPH07267305A WASTE MATTER TREATING DEVICE 失效
公开(公告)号：JPH07267305A
公开(公告)日：1995-10-17
申请号：JP8096594
申请日：1994-03-28
申请人： FUJI MACH KK , NORTH KK
发明人： FUJITA MITSUYUKI , IIJIMA ASAO
IPC分类号： E04F17/10 , B65F5/00
摘要： PURPOSE:To provide a waste matter treating device having a simple structure and furthermore, capable of treating easily and sanitarily waste matters. CONSTITUTION:In a waste matter treating device 10 equipped with a waste matter treating machine in which a waste matter treating case formed in the cup shape of a reverse-conic trapezoid made of paper of synthetic resin is used, the waste matter treating machine retains the waste matter treating cases in the many stacked state and a case supplying part 20 for falling and supplying the lowest case among many stacked cases by releasing it, when needed is provided. Furthermore, a stand-by part 30 which makes the case stand by in its state turned up so that waste matters maycome into the case supplied by the case supplying part, a tightly closing part 40 for closing tightly the case by bush-pressing the upper part of the case storing the waste matter in the inner part thereof and a carrier means 50 for carrying the waste matter treating case among the case supplying part 20, the stand-by part 30 and the tightly closing part 40 is provided. Then, a vacuum device is connected to this waste matter treating machine.

6. 发明专利

JPH04334084A MANUFACTURE OF WIRING BOARD 失效
公开(公告)号：JPH04334084A
公开(公告)日：1992-11-20
申请号：JP10428091
申请日：1991-05-09
申请人： SONY CORP , NORTH KK , ITABASHI SEIKI KK
发明人： TAKAYAMA KINJIRO , ISHIKAWA YUKIKO , IIJIMA ASAO , TADA HIROSHI
IPC分类号： G03F7/26 , H05K3/06 , H05K3/42
摘要： PURPOSE:To realize fine pattern formation by a printing method, and easily realize the cost reduction of wiring board manufacture and the formation of a highly precise wiring pattern. CONSTITUTION:After a through hole is formed at a specified position of a copper-clad board (S1), a copper-plated layer is formed on the whole surface by nonelectrolytic plating process and copper-plating process (S2). After a photoresist film is formed on the whole surface by electrodeposition (S3), an ink mask is formed on the photoresist mask by screen printing (S4). After the photo resist mask exposed via the ion mask is cured by exposing process (S5), a part of the photoresist film which part is not irradiated with light is dissolved and eliminated by development process, and a resist pattern subordinate to a wiring pattern is formed (S6). After the exposed copper-plated layer and a copper foil under said layer are etched and eliminated (S7), the resist pattern is exfoliated, and a desired wiring pattern of the copper plated layer and the copper foil is formed (S).

7. 发明专利

JP2001326459A WIRING CIRCUIT BOARD AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2001326459A
公开(公告)日：2001-11-22
申请号：JP2000142658
申请日：2000-05-16
申请人： NORTH KK
发明人： IIJIMA ASAO , OSAWA MASAYUKI
IPC分类号： H05K1/11 , H01L23/12 , H05K1/02 , H05K3/06 , H05K3/38 , H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To raise connection reliability between upper and lower conductor circuits and realize reduction in a cost of a connection means between upper and lower conductor circuits by raising dimensional stability in a manufacturing process, by preventing generation of bending, snapping and wrong sizes in a manufacturing process. SOLUTION: A conductor circuit formation copper foil 23 is formed on a projection formation copper layer 21 via an etching barrier layer 22 formed of another metal, projections 25 are formed by selectively etching the projection formation copper layer 21 by means of etchant which does not attack the etching barrier layer 22, the etching barrier layer 22 is removed by etchant which does not attack the copper foil 23 forming a conductor circuit by using the projections 25 as masks, and a layer insulation film 27 is formed on the surface on the projection formation side of the copper foil 23 as an interlayer connection means where the projections 25 are connected to a conductor circuit.

8. 发明专利

JP2001189561A MULTILAYER WIRING BOARD AND MANUFACTURING METHOD THEREFOR 失效
公开(公告)号：JP2001189561A
公开(公告)日：2001-07-10
申请号：JP37446299
申请日：1999-12-28
申请人： NORTH KK
发明人： IIJIMA ASAO
IPC分类号： H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multilayer wiring board which is free from the risk of producing a recess on the forming parts of through holes in wiring layers on both main faces of the board, a trouble is not caused in the connection and mounting of an LSI chip and a solder ball, a different wiring film is laminated on a wiring film, more multiple layers can easily be formed and the multilayer wiring films have necessary thickness by fine patterns. SOLUTION: The wiring films 3 are formed on both faces of the insulating film 2 and the through holes 4 of a base sheet 1 where the through holes 4 connecting the wiring films 3 and 3 on both faces are filled with conductive materials 5. A laminating sheet 6 having metallic protrusions 8 protruded to one side in positions corresponding to the through holes 4 and having the wiring films 7 on the other side is laminated on the main face of one side of the base sheet 1 or the main faces of both sides so that the metallic protrusions 8 are brought into contact with the conductive materials 5 buried in the through holes 4.

9. 发明专利

JPH11238763A MANUFACTURE OF WIRING BOARD FOR MOUNTING SEMICONDUCTOR ELEMENT 失效
公开(公告)号：JPH11238763A
公开(公告)日：1999-08-31
申请号：JP3831698
申请日：1998-02-20
申请人： SONY CORP , NORTH KK
发明人： OSAWA KENJI , IIJIMA ASAO , KUSANO HIDETOSHI
IPC分类号： H01L21/60 , H05K3/20 , H05K3/24 , H05K3/40
摘要： PROBLEM TO BE SOLVED: To provide a manufacture of a wiring board for mounting semiconduc tor elements that eliminates the need for providing roundabout wiring for each wiring by adopting the electrolytic plating method to form bumps. SOLUTION: A negative resist film (a first resist film) 4 to form a wiring film and a negative resist film (a second resist film) 5 to form bumps, or pad are formed on the surface of a metal base 1. A bump material film is electrolytically-plated by using these resist films as masks to form bumps 6. Subsequently, only the second resist film 5 is removed, and then the first resist film 4 is used as mask for electrolytic plating to form a wiring film 7.

10. 发明专利

JP2002026479A WIRING CIRCUIT BOARD 失效
公开(公告)号：JP2002026479A
公开(公告)日：2002-01-25
申请号：JP2000207635
申请日：2000-07-10
申请人： NORTH KK
发明人： IIJIMA ASAO , OSAWA MASAYUKI
IPC分类号： H05K1/11 , H01L23/12 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To improve the stability and the strength of connections on a wiring circuit board 1 having interlayer connecting means for connecting, by the thermocompression bonding, copper bumps 5 at their top faces 5a to a copper wiring film 3 on a board 2 surface, thereby connecting the wiring film 3 to a separate copper wiring film 6. SOLUTION: Copper bump connections 31 of a copper wiring film 3 each have a shape having a top end edge reaching a copper bump top face 5a or traversing across this face 5a. The bump connection 31 is formed e.g. like a mesh (see Fig. 31a). The copper bump 5 is preferably formed by roughing its top face or a surface including the top face to improve the connection performance.

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