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1. 发明专利

JP2006327122A Screen printing plate and method for manufacturing screen printing plate 审中-公开
标题翻译：屏幕打印板和制造屏幕打印板的方法
公开(公告)号：JP2006327122A
公开(公告)日：2006-12-07
申请号：JP2005156749
申请日：2005-05-30
申请人： Fuchigami Micro:Kk , 株式会社渕上ミクロ
发明人： ARAKI MASACHIKA , AKIBA HIDEKI , FUKUNAGA MASAAKI , KAWABATA MASATAKA , SHIMOKOMAKI SHINICHI
IPC分类号： B41N1/24 , B41C1/14 , G03F7/12 , G03F7/26
摘要： PROBLEM TO BE SOLVED: To provide a screen printing plate capable of preventing a part of a coating substance from oozing outward from a printing pattern.
SOLUTION: An opening 3 of the screen printing plate 1 on which a photosensitive emulsion layer 4 is formed is constituted of an introducing opening 3a and a printing opening 3b connected with this introducing opening 3a, and the printing opening 3b is constituted by being protruded outward in a plan view from the introducing opening 3a, and having a shallower depth. It is possible thereby to prevent a part of the coating substance from oozing from a gap between the opening edge of the printing opening 3b and the printing face of a printed matter, and to prevent a part of the coating substance from oozing outward from the printing pattern.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够防止一部分涂层物质从印刷图案向外渗出的丝网印刷板。解决方案：其上形成有感光乳剂层4的丝网印版1的开口3由与该导入开口3a连接的引入开口3a和印刷开口3b构成，印刷开口3b由从导入开口3a以俯视图向外突出，深度较浅。因此，可以防止一部分涂料从印刷开口3b的开口边缘和印刷物的印刷面之间的间隙渗出，并且防止一部分涂层物质从印刷物向外渗出模式。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JPH11273043A Light beam, supporting spring member with magnetic head wiring and its manufacturing method 失效
标题翻译：光束支撑带磁头接头的弹簧及其制造方法
公开(公告)号：JPH11273043A
公开(公告)日：1999-10-08
申请号：JP9225998
申请日：1998-03-23
申请人： Fuchigami Micro:Kk , North Kk , ノース株式会社 , 株式会社渕上ミクロ
发明人： ONO TERUO , UEDA SUSUMU , IIJIMA ASAO
IPC分类号： G11B5/60
摘要： PROBLEM TO BE SOLVED: To economically produce the supporting spring member having a high density wiring by constituting it of the member with a base member, a supporting member and a wiring member, fixing the supporting member made of an insulating material on the base member and constituting the wiring member of the conductive material buried on the surface side of the supporting member.
SOLUTION: The whole shape of the supporting spring member is constituted on a base member 1. A supporting member 2 made of an insulating material is fixed to the member 1 and a wiring member 3 made of a conductive material is buried into the surface side of the member 2 with a prescribed pattern. Various kinds of materials are applicable to member 1 so far as the materials are springy materials. Any kinds of materials are used for the member 2 so far as the materials are molded while keeping a desired insulating characteristic. The member 3 is used to make electrical connections and made of the material having a good conductivity. In general, the member 1 is made of a stainless steel film, the member 2 is made of polyimede and the member 3 is made by copper plating.
COPYRIGHT: (C)1999,JPO
摘要翻译：要解决的问题：为了经济地制造具有高密度布线的支撑弹簧构件，其通过用基座构件，支撑构件和布线构件构成构件，将由绝缘材料制成的支撑构件固定在基座构件上，以及构成埋设在支撑构件的表面侧的导电材料的配线构件。解决方案：支撑弹簧构件的整个形状构成在基座构件1上。由绝缘材料制成的支撑构件2固定到构件1，并且由导电材料制成的布线构件3被埋在成员2具有规定的图案。只要材料是弹性材料，各种材料就适用于构件1。只要在保持所需的绝缘特性的同时模制材料，就可以使用任何种类的材料。构件3用于制造电连接并由具有良好导电性的材料制成。通常，构件1由不锈钢膜制成，构件2由聚酰亚胺构成，构件3通过镀铜制成。

3. 发明专利

JP2009285994A Squeegee 审中-公开
标题翻译： SQUEEGEE
公开(公告)号：JP2009285994A
公开(公告)日：2009-12-10
申请号：JP2008141329
申请日：2008-05-29
申请人： Fuchigami Micro:Kk , Star Hard Kk , スターハード株式会社 , 株式会社渕上ミクロ
发明人： TATEISHI MASANORI
IPC分类号： B41F15/44
摘要： PROBLEM TO BE SOLVED: To provide a squeegee that enables a printing pattern formed by screen printing to have a proper shape and enables the yield to be improved, and that fully satisfies precision required for electronic components or the like manufactured using screen printing.
SOLUTION: The squeegee 1 includes a base material 2 and a distal end part 3. The base material 2 is formed of a fibrous carbon material. The base material 2 includes a planar base material body part 2a that is installed in one end side (upper end side in Fig.1) of the squeegee 1, and is attached to the squeegee holder of a screen printing machine and a planar base material continuous part 2b that is installed continuously to the base material body part 2a in the center of the other end side (lower end side in Fig.1) of the squeegee 1. The planar distal end part 3 is formed at both ends with the base material continuous part 2b held in-between. The distal end part 3 is composed of urethane, silicone, vinyl chloride, glass, stainless steel, alloys, etc.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够通过丝网印刷形成的印刷图案具有适当形状并且能够提高成品率的刮板，并且完全满足使用丝网印刷制造的电子部件等所需的精度。刮板1包括基材2和远端部3.基材2由纤维状碳材料形成。基材2包括安装在刮板1的一端侧（图1的上端侧）的平面状的基材主体部2a，并且安装在丝网印刷机的刮板保持架和平面基材连续部分2b连续地安装在刮板1的另一端侧（图1的下端侧）的中心的基体主体部分2a上。平面的远端部分3在两端形成有基部材料连续部分2b保持在其间。远端部分3由聚氨酯，硅树脂，氯乙烯，玻璃，不锈钢，合金等组成。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2009266941A Heat pipe, method of manufacturing heat pipe, and electronic substrate 有权
标题翻译：热管，制造热管的方法和电子基板
公开(公告)号：JP2009266941A
公开(公告)日：2009-11-12
申请号：JP2008112564
申请日：2008-04-23
申请人： Fuchigami Micro:Kk , 株式会社渕上ミクロ
发明人： MIZUTA KEI , KOTANI TOSHIAKI , TSURUTA KATSUYA , UEDA TORU
IPC分类号： H05K7/20 , F28D15/02 , H01L23/427
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a heat pipe having electric wiring that electrically connects an electronic component mounted on a surface of the heat pipe to an external electronic circuit and has superior durability and reliability. SOLUTION: The heat pipe 1 has a flat plate type body portion 2 in which a cooling medium is enclosed and a projection portion 3 projecting from a part or the whole of a side surface of the body portion 2. The body portion 2 has a flat plate type upper plate, a flat plate type lower plate opposed to the upper plate, and a single or a plurality of intermediate plates which are stacked between the flat plate type upper plate and flat plate type lower plate and form a vapor diffusion path and a capillary flow passage, and the projection portion 3 is formed by making at least one of the upper plate, lower plate and intermediate plates larger in area than others, and the projection portion 3 has the electronic wiring 4. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有将安装在热管的表面上的电子部件电连接到外部电子电路的电线的热管，并且具有优异的耐久性和可靠性。解决方案：热管1具有封闭冷却介质的平板型主体部分2和从主体部分2的侧表面的一部分或全部突出的突出部分3.主体部分2 具有平板型上板，与上板相对的平板型下板，以及堆叠在平板型上板和平板型下板之间的单个或多个中间板，并形成蒸气扩散路径和毛细管流路，并且突起部3通过使上板，下板和中间板中的至少一个的面积大于其它面积而形成，并且突出部3具有电子布线4。（C）2010，JPO＆INPIT

5. 发明专利

JP2007119178A Horizontal conveyance method and horizontal conveyance device for article to be conveyed 审中-公开
标题翻译：用于输送物品的水平输送方法和水平输送装置
公开(公告)号：JP2007119178A
公开(公告)日：2007-05-17
申请号：JP2005313790
申请日：2005-10-28
申请人： Fuchigami Micro:Kk , 株式会社渕上ミクロ
发明人： SATO TETSURO , FUKUTOME MIKIO , INOUE HIROYOSHI , NODA HIROKO
IPC分类号： B65G13/04 , B08B3/02
摘要： PROBLEM TO BE SOLVED: To provide a horizontal conveyance method and a horizontal conveyance device for an article to be conveyed capable of surely horizontally conveying the article of which lower surface is not flat and has irregularities without stagnating.
SOLUTION: At least one projecting part is formed on the lower surface 12a of the article to be conveyed. Rotatingly driving shafts 5 having conveyance surfaces 10 for horizontally conveying the article 12 by a frictional force by supporting the lower surface 12a of the article 12 with a rigidity are arranged parallel with each other. When the article 12 is stagnated during the horizontal conveyance due to sliding contact between the projecting part and the rotation increasing surface 10a of the conveyance surface 10 by the contact of the projecting part on the lower surface of the article 12 on the rotation increasing surface 10a of the conveyance surface 10 of the rotatingly driving shaft 5 forward of the projecting part, the rotatingly driving shaft 5 engaged related to the sliding contact is passed over by pushing up the projecting part 13B on the lower surface of the article 12 while the rotating shaft 5 is rotated by the engagement action of a cutout part 11 circumferentially formed in the conveyance surface 10 of the rotatingly driving shaft 5 under rotation. As a result, the horizontal conveyance of the article can be re-started.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种水平输送方法和用于待输送物品的水平输送装置，其能够可靠地水平地输送下表面不平坦的物品并且具有不规则性而不停滞。解决方案：至少一个突出部分形成在被输送物品的下表面12a上。具有用于通过以刚性支撑物品12的下表面12a的摩擦力水平地输送物品12的传送表面10的旋转驱动轴5布置成彼此平行。当物品12在水平运送期间由于突出部分和输送表面10的旋转增加表面10a之间的滑动接触而停滞在物品12的旋转增加表面10a上的物品12的下表面上的突出部分旋转驱动轴5的输送面10在突出部的前方，通过将物品12的下表面上的突出部13B向上推，与滑动接触相关地接合的旋转驱动轴5被转动，同时旋转轴 5通过周向形成在旋转驱动轴5的输送面10中的切口部11的接合动作而旋转。结果，可以重新开始制品的水平输送。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2010028055A Heat pipe, electronic apparatus 有权
标题翻译：热管，电子设备
公开(公告)号：JP2010028055A
公开(公告)日：2010-02-04
申请号：JP2008191281
申请日：2008-07-24
申请人： Fuchigami Micro:Kk , 株式会社渕上ミクロ
发明人： MIZUTA KEI , TSURUTA KATSUYA , KOTANI TOSHIAKI , UEDA SUSUMU
IPC分类号： H05K7/20 , F28D15/02 , H01L23/427
CPC分类号： F28D15/0233
摘要： PROBLEM TO BE SOLVED: To provide a heat pipe which can be mounted inside of an electronic apparatus having only a narrow space, and draws heat from a heating element to diffuse, then transfers the diffused heat to a housing of the electronic apparatus efficiently, and radiates the heat from the surface of the housing. SOLUTION: The heat pipe 1 includes a planar body part 2 which a coolant is enclosed into, and an extension plate 20 protruding from a part or all of a side surface of the body part 2. The body part 2 has a planar upper plate 10, a planar lower plate 11 facing the upper plate 10, and a single or a plurality of middle plates 12 which are laminated between the upper plate 10 and the lower plate 11 to form a vapor diffusion channel and a capillary flow path. The extension plate 20 is formed by making at least one of the upper plate 10, the lower plate 11 and the middle plates 12 larger than the other in area, and the extension plate 20 has a first heat radiation surface 22 and a second heat radiation surface 23 formed by bending at a refracting part 21. At least a part of the first heat radiation surface 22 and the second heat radiation surface 23 can be thermally brought into contact with the housing of the electronic apparatus. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种可以安装在仅具有狭窄空间的电子设备内部并从加热元件吸热以扩散的热管，然后将散热传递到电子设备的壳体有效地并且从壳体的表面辐射热量。解决方案：热管1包括冷却剂被包围的平面主体部分2和从主体部分2的侧表面的一部分或全部突出的延伸板20.主体部分2具有平面上板10，面向上板10的平面下板11和层叠在上板10和下板11之间的单个或多个中间板12，以形成蒸气扩散通道和毛细管流路。延伸板20通过使上板10，下板11和中板12中的至少一个大于另一个面积而形成，并且延伸板20具有第一散热面22和第二热辐射表面23通过在折射部分21弯曲而形成。第一散热表面22和第二散热表面23的至少一部分可以与电子设备的壳体热接触。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2010017887A Mesh sheet and method for manufacturing mesh sheet 审中-公开
标题翻译：网格和制造网格的方法
公开(公告)号：JP2010017887A
公开(公告)日：2010-01-28
申请号：JP2008178428
申请日：2008-07-08
申请人： Fuchigami Micro:Kk , Leybold Co Ltd , レイボルド株式会社 , 株式会社渕上ミクロ
发明人： OSAWA KENJI , MIZUGUCHI YOSHIFUMI , SHIMOKOMAKI SHINICHI , UEDA SUSUMU , KAMEYAMA TAKEOMI , SASAKURA TAKAHITO , YONEZAKI TOSHIHIKO
IPC分类号： B41N1/24 , B41C1/14
摘要： PROBLEM TO BE SOLVED: To provide a mesh sheet which enables good ink drain when used for a screen printing plate, and to provide a method for manufacturing a mesh sheet with which a sufficient thickness to ensure strength and stiffness is easily obtained.
SOLUTION: A crosspiece member 3 of the mesh sheet 1 has an approximate oval cross-section, including a first metal layer 6 in an approximate half oval shape and also a second metal layer 7 in an approximate half oval shape. The method for manufacturing the mesh sheet 1 includes: a film deposition process wherein a photoresist film 5 is deposited on a base material 4; a mesh pattern forming process wherein a mesh pattern is printed onto the photoresist film 5; a first plating process wherein the first metal layer 6 is formed by conducting plating on the surface of the base material 4 with the photoresist film 5 deposited; a base material removing process wherein the base material 4 is removed; and a photoresist film removing process wherein the photoresist film 5 is removed.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种当用于丝网印刷板时能够实现良好的排墨的网片，并且提供一种制造足够厚度以确保容易获得强度和刚度的网片的方法。解决方案：网片1的横档构件3具有大致椭圆形的横截面，包括大致半椭圆形的第一金属层6和大致半椭圆形的第二金属层7。网眼片1的制造方法包括：在基材4上淀积光致抗蚀剂膜5的成膜方法; 网状图案形成工序，其中将网格图案印刷到光致抗蚀剂膜5上; 第一电镀工艺，其中通过在沉积有光致抗蚀剂膜5的基材4的表面上进行电镀而形成第一金属层6; 去除基材4的基材去除工艺; 以及去除光致抗蚀剂膜5的光致抗蚀剂膜去除工艺。版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2009288140A Method for manufacturing thin film sheet with bump 审中-公开
标题翻译：制造薄膜薄膜的方法
公开(公告)号：JP2009288140A
公开(公告)日：2009-12-10
申请号：JP2008142464
申请日：2008-05-30
申请人： Fuchigami Micro:Kk , Shinozaki Seisakusho:Kk , 株式会社渕上ミクロ , 株式会社篠崎製作所
发明人： KUSANO HIROSHI , HARA YASUTO
IPC分类号： G01R1/073 , G01R31/26 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a thin film sheet with a bump capable of keeping high position accuracy of the bump or an electrode part formed on the thin film.
SOLUTION: This method for manufacturing the thin film sheet 62 with the bump has processes for: forming a plurality of bumps 38 whose tip parts are projected from one surface of the thin film 10, and whose rear ends are allowed to penetrate the thin film 10 and led out to the other surface side, relative to the thin film 10, and a plurality of electrode parts 43 connected to each rear end of the bumps 38; humidifying and swelling the thin film 10; placing the thin film 10 on a glass substrate 46 on which a plurality of marked patterns 50 are displayed; enlarging the thin film 10 as much as a necessary amount in a necessary direction on reference to an enlarged image of an optional spot of the thin film 10, and performing alignment between the electrode part 43 and the marked pattern 50; bonding a ceramic ring 56 onto the surface of the thin film 10; and drying the thin film 10.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种制造具有凸块的薄膜片的方法，所述凸块能够保持凸起的高位置精度或形成在薄膜上的电极部分。解决方案：用于制造具有凸块的薄膜片62的方法具有以下处理：形成多个凸起38，其顶端部分从薄膜10的一个表面突出，并且其后端被允许穿透薄膜10相对于薄膜10引出到另一个表面侧，以及连接到凸块38的每个后端的多个电极部43; 加湿和膨胀薄膜10; 将薄膜10放置在其上显示有多个标记图案50的玻璃基板46上; 参照薄膜10的任意点的放大图像，在必要方向上将薄膜10放大至必要量，并且在电极部43和标记图案50之间进行对准; 将陶瓷环56粘合到薄膜10的表面上; 并干燥薄膜10.版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2009244084A Apparatus and method for measuring thermal conductivity of thermally joined material 有权
标题翻译：用于测量热接合材料热导率的装置和方法
公开(公告)号：JP2009244084A
公开(公告)日：2009-10-22
申请号：JP2008090672
申请日：2008-03-31
申请人： Fuchigami Micro:Kk , Kagoshima Univ , Tokai Rubber Ind Ltd , 国立大学法人鹿児島大学 , 東海ゴム工業株式会社 , 株式会社渕上ミクロ
发明人： MIZUTA KEI , BESSHO HISAMI , KANBE YUMI , TSURUTA KATSUYA , KOTANI TOSHIAKI , OSAWA KENJI
IPC分类号： G01N25/18
摘要： PROBLEM TO BE SOLVED: To provide a measuring apparatus and a measuring method, capable of accurately measuring thermal conductivity of a thermally joined material by use of a small and inexpensive device.
SOLUTION: The apparatus for measuring thermal conductivity of a thermally joined material 1 includes: a first plate 2 having a thermally joined material 4 applied to an application surface thereof; a second plate 3 opposed to the application surface to hold the thermally joined material 4 with the first plate 2; a heating part 10 set in a predetermined position of the first plate 2; a cooling part 11 set in a predetermined position of the second plate 3, the position being different from the opposed position of the heating part 10; and a temperature measurement part 7 which measures temperatures of a first position and a second position on at least one surface of the first plate 2 and the second plate 3. The temperature measurement part 7 measures a temperature difference between the first position and the second position.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够通过使用小型廉价的装置精确地测量热连接材料的导热性的测量装置和测量方法。解决方案：用于测量热接合材料1的热导率的装置包括：第一板2，其具有施加到其施加表面上的热连接材料4; 与施加表面相对的第二板3，用于将热连接材料4保持在第一板2上; 设置在第一板2的预定位置的加热部10; 设置在第二板3的预定位置的冷却部11，该位置与加热部10的相对位置不同; 和测量第一板2和第二板3的至少一个表面上的第一位置和第二位置的温度的温度测量部件7.温度测量部件7测量第一位置和第二位置之间的温度差。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2005311191A Multilayer interconnection board 审中-公开
标题翻译：多层互连板
公开(公告)号：JP2005311191A
公开(公告)日：2005-11-04
申请号：JP2004128656
申请日：2004-04-23
申请人： Fuchigami Micro:Kk , 株式会社渕上ミクロ
发明人： TSURUGASAKI MASATO , HAZEKAWA HIROYUKI
IPC分类号： H05K1/09 , H05K1/14 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide the configuration of a multilayer interconnection board having a connection layer for setting a base metal as entire or partial materials rather than base metals, such as gold and silver. SOLUTION: In the multilayer interconnection board 3, at least two layers of conductive layers are laminated via a bump 2. The bump 2 and a metal pattern 2 in the conductive layer are connected by a connection layer 1, in a state of alloy with one or both of tin 11, tin and gold, and silver, especially the tin 11 being plated to one of the bump 2 and the metal pattern 2, one or both 12 of gold and silver being plated to the other; and the bump 2 and the metal pattern 2 are subjected to thermocompression bonding for forming the connection layer 1 in a state of alloy, or plating is made by the alloy of one or both of tin and gold, and silver to both of the bump 2 and the metal pattern 2, and the bump 2 and the metal pattern 2 are subjected to thermocompression bonding for improved advantages in the manufacturing costs. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供具有用于将贱金属设置为全部或部分材料而不是诸如金和银的贱金属的连接层的多层互连板的构造。解决方案：在多层互连板3中，通过凸块2层压至少两层导电层。导电层中的凸块2和金属图案2通过连接层1以合金与锡11，锡和金中的一种或两种，以及银，特别是电镀在凸块2和金属图案2之一中的锡11，金和银的一个或两个被镀在另一个上; 并且凸块2和金属图案2经受用于形成合金状态的连接层1的热压接合，或者通过锡和金中的一种或两种的合金电镀镀银，并且将银镀在两个凸起2 并且金属图案2，凸块2和金属图案2经受热压接，从而提高制造成本的优点。版权所有（C）2006，JPO＆NCIPI

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