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1. 发明专利

JP2001223289A LEAD FRAME, ITS MANUFACTURING METHOD, SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2001223289A
公开(公告)日：2001-08-17
申请号：JP2000029858
申请日：2000-02-08
申请人： SONY CORP , NORTH KK
发明人： OSAWA KENJI , HASEGAWA KIYOSHI , OTA KAZUYA , IIJIMA ASAO
IPC分类号： H01L23/12 , H01L23/50 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To facilitate face bonding through anisotropic conductive adhesive 13 by making thinner a lead frame 11 being laid in layer so that a chip 15 can be placed on a flat face having no irregularities and to make possible to form a metal film 3, for enhancing bonding to the electrode of the chip 15, on the surface of the wiring film 5 of the lead frame 11 by electrolytic plating. SOLUTION: In the lead frame 11 being laid in layer while mounting the semiconductor chip 15, the wiring film 5 is formed on a wiring board 10 in flush with the surface of an insulation layer 6 and a part 7 connected with the wiring film 5 is formed on the other surface of the insulation layer 6. A chip mounting region 12, a region for interconnecting the lead frames 11, 11, and a spacer 9 for keeping an interval between adjacent lead frames 11, 11 are provided on the surface of the wiring board 10 where the wiring film 5 is formed.

2. 发明专利

JPH11238763A MANUFACTURE OF WIRING BOARD FOR MOUNTING SEMICONDUCTOR ELEMENT 失效
公开(公告)号：JPH11238763A
公开(公告)日：1999-08-31
申请号：JP3831698
申请日：1998-02-20
申请人： SONY CORP , NORTH KK
发明人： OSAWA KENJI , IIJIMA ASAO , KUSANO HIDETOSHI
IPC分类号： H01L21/60 , H05K3/20 , H05K3/24 , H05K3/40
摘要： PROBLEM TO BE SOLVED: To provide a manufacture of a wiring board for mounting semiconduc tor elements that eliminates the need for providing roundabout wiring for each wiring by adopting the electrolytic plating method to form bumps. SOLUTION: A negative resist film (a first resist film) 4 to form a wiring film and a negative resist film (a second resist film) 5 to form bumps, or pad are formed on the surface of a metal base 1. A bump material film is electrolytically-plated by using these resist films as masks to form bumps 6. Subsequently, only the second resist film 5 is removed, and then the first resist film 4 is used as mask for electrolytic plating to form a wiring film 7.

3. 发明授权

US3887444A Bright tin-nickel alloy plating electrolyte 失效
标题翻译：明亮的锡镍合金电镀电解液
公开(公告)号：US3887444A
公开(公告)日：1975-06-03
申请号：US46052774
申请日：1974-04-12
申请人： SONY CORP
发明人： FUEKI SHIMETOMO , ABE KAZUMASA , OSAWA KENJI
IPC分类号： C25D3/56 , C25D3/60 , C23B5/38 , C23B5/46
CPC分类号： C25D3/56 , C25D3/60
摘要： A bright tin-nickel alloy plating electrolyte consists essentially of an aqueous main plating liquid containing a stannous salt, a nickel salt and an alkali-metal pyrophosphate, with a brightener additive in such main plating liquid which is a compound having a plurality of amino groups, for example, ethylenediamine, 1,2-propanediamine, 1,3-propanediamine, 1,4butanediamine, pentamethylenediamine, hexamethylenediamine, hydrazine, guanidine, urea or thiourea, and with a further addition of ammonia or an ammonium salt. The electrolyte may further have added thereto a compound having at least one -SX group in this electrolyte (in which X represents hydrogen, sodium or potassium), a peptone and/or protein, or a neutral amino acid which is free of sulphur or a salt thereof.
摘要翻译：明亮的锡镍合金电镀电解质基本上由含有亚锡盐，镍盐和碱金属焦磷酸盐的主要电镀液组成，在主镀液中具有增白剂添加剂，其为具有多个氨基的化合物例如乙二胺，1,2-丙二胺，1,3-丙二胺，1,4-丁二胺，五亚甲基二胺，六亚甲基二胺，肼，胍，脲或硫脲，并进一步加入氨或铵盐。在该电解质（其中X表示氢，钠或钾），蛋白胨和/或蛋白质或不含硫或中性氨基酸的中性氨基酸中，电解质可进一步加入具有至少一个-SX基团的化合物的盐。

4. 发明授权

US3914160A Bath for the electrodeposition of birght tin-cobalt alloy 失效
标题翻译：用于电镀锡 - 钴 - 钴合金的浴
公开(公告)号：US3914160A
公开(公告)日：1975-10-21
申请号：US36054273
申请日：1973-05-15
申请人： SONY CORP
发明人： FUEKI SHIMETOMO , TADA JUNICHI , OSAWA KENJI , SAKAI NAOMI , OGAWA KAZUHIRO
IPC分类号： C25D3/56 , C25D3/60
CPC分类号： C25D3/56 , C25D3/60
摘要： A bright electroplated tin-cobalt alloy is obtained with an aqueous pyrophosphate electroplating bath which contains a brightening agent selected from the group which consists of amino carboxylic acid with sulphur, neutral amino acid, basic amino acid, peptone, protein, organo-sulphur compound, ammonia, ammonium salt, amine, and mixtures thereof.
摘要翻译：使用含有由氨基羧酸与硫，中性氨基酸，碱性氨基酸，蛋白胨，蛋白质，有机硫化合物组成的组中的增白剂的焦磷酸钙电镀浴，得到光亮的电镀锡 - 钴合金，氨，铵盐，胺及其混合物。

5. 发明专利

SG60099A1 Semiconductor package and manufacturing method of lead frame 未知
公开(公告)号：SG60099A1
公开(公告)日：1999-02-22
申请号：SG1997002878
申请日：1997-08-08
申请人： SONY CORP
发明人： OSAWA KENJI , SATO KAZUHIRO , ITO MAKOTO
IPC分类号： H01L23/24 , H01L23/495 , H01L23/12 , H01L21/60 , H01L23/50 , H01L23/28
摘要： A method of manufacturing a semiconductor chip that has electrode pads on the chip front surface and disposed inside a conductive outer ring. A film circuit is disposed on the chip front surface side. External connection thermals are formed on the film circuit so as to project there from. First leads electrically connect part of the electrode pads to part of the external connection terminals. A second lead electrically connects a grounding or power supply electrode pad to the outer ring, and a third lead electrically connects a grounding or power supply external connection terminal to the outer ring.

6. 发明专利

SG60102A1 Lead frame semiconductor package having the same and method for manufacturing the same 未知
公开(公告)号：SG60102A1
公开(公告)日：1999-02-22
申请号：SG1997002893
申请日：1997-08-11
申请人： SONY CORP
发明人： SHIGETA HIROYUKI , OSAWA KENJI , SATO KAZUHIRO , MAKINO HARUHIKO , ITO MAKOTO
IPC分类号： H01L23/31 , H01L21/60 , H01L23/04 , H01L23/50

7. 发明专利

CA1045075A BRIGHT TIN-NICKEL ALLOY PLATING ELECTROLYTE 未知
公开(公告)号：CA1045075A
公开(公告)日：1978-12-26
申请号：CA197770
申请日：1974-04-18
申请人： SONY CORP
发明人： FUEKI SHIMETOMO , ABE KAZUMASA , OSAWA KENJI
IPC分类号： C25D3/56 , C25D3/60 , C25D3/36
摘要： BRIGHT TIN-NICKEL ALLOY PLATING ELECTROLYTE A bright tin-nickel alloy plating electrolyte consists essentially of an aqueous main plating liquid containing a stannous salt, a nickel salt and an alkali-metal pyrophosphate, with a brightener additive in such main plating liquid which is a compound having a plurality of amino groups as its only functional groups, for example, ethylenediamine, 1,2-propanediamine, 1,3-propanediamine, 1,4-butanediamine, pentamethylenediamine, hexamethylenediame, hydrazine, quanidine, urea or thiourea. The bright tin-nickel alloy plating electrolyte may further contain ammonia or an ammonium salt, and the electrolyte, with or without the addition of the ammonia or ammonium salt,may further have added thereto a compound containing an -SX group (in which X represents hydrogen, sodium or potassium), a peptone and/or protein, or a neutral amino acid which is free of sulphur or a salt thereof.

8. 发明专利

CA1281389C LAMINATED-PRINT COIL STRUCTURE 未知
公开(公告)号：CA1281389C
公开(公告)日：1991-03-12
申请号：CA529064
申请日：1987-02-05
申请人： SONY CORP
发明人： OSAWA KENJI , MURAMOTO SHIYOUICHI , WATANABE YOSHIO , KAWAHARA TAKANORI , KOIZUMI TAKAAKI
IPC分类号： H01F5/00 , H02K3/26 , H02K3/50 , H02K5/22 , H05K1/14
摘要： A laminated printed coil structure comprising a wiring board having an insulating substrate, lead terminals and connecting pad portions connected to the lead terminals and formed on one surface of the insulating substrate, and a plurality of printed coil elements each having an insulating layer, coil patterns, a pair of terminals for the coil patterns and a connecting pad electricallky isolated from the terminals formed on the insulating layer. The printed coil elements are piled up and laminated on the wiring board such that the connecting pad portions of the wiring board, the terminals of the coil patterns on one of the printed coil elements and the connecting pad on another printed coil element are placed in alignment, and that each one terminal for the coil pattern on each of the printed coil elements to a respective lead terminal is connected, and that each coil pattern is from thence led out to the lead terminals of the wiring board.

9. 发明专利

CA1023687A BATH FOR THE ELECTRODEPOSITION OF BRIGHT TIN-COBALT ALLOY 未知
公开(公告)号：CA1023687A
公开(公告)日：1978-01-03
申请号：CA171547
申请日：1973-05-16
申请人： SONY CORP
发明人： FUEKI SHIMETOMO , TADA JUNICHI , OSAWA KENJI , SAKAI NAOMI , OGAWA KAZUHIRO
IPC分类号： C25D3/56 , C25D3/60
摘要： Bright tin-cobalt alloy produced by electrodeposition from an aqueous pyrophosphate electroplating bath that contains a stannous salt, a cobalt salt and a brightener additive which is a combination of at least one water-soluble peptide and at least one of the group of ammonia, ammonium salts and amine compounds.

10. 发明专利

DE2632214A1 未知
公开(公告)号：DE2632214A1
公开(公告)日：1977-02-03
申请号：DE2632214
申请日：1976-07-16
申请人： SONY CORP
发明人： TAMURA TOSHIO , OUCHI SHIGEO , OSAWA KENJI , FUEKI SHIMETOMO , TAKAHASI MAKOTO , ITO MAKOTO
IPC分类号： C25D3/14 , C25D15/02 , C25D15/00 , C25D3/12

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