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1. 发明专利

JP2010118685A Substrate supporting apparatus and substrate supporting method 有权
标题翻译：基板支持装置和基板支持方法
公开(公告)号：JP2010118685A
公开(公告)日：2010-05-27
申请号：JP2010022270
申请日：2010-02-03
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KATSUOKA SEIJI , SEKIMOTO MASAHIKO , WATANABE TERUYUKI , KATO AKIRA , YOKOYAMA TOSHIO , SUZUKI KENICHI , KOBAYASHI KENICHI
IPC分类号： H01L21/683 , B05B15/12 , B05C3/09 , B05C9/06 , B05C11/10 , B05C13/00 , B05C15/00 , B05D3/12 , B65H1/00 , C23C2/00 , C23C18/16 , C23C18/31 , C25D17/06 , H01L21/00 , H01L21/288 , H01L21/68 , H01L21/768
CPC分类号： H01L21/288 , C23C2/003 , C23C18/1619 , C23C18/163 , C23C18/1642 , H01L21/6708 , H01L21/67742 , H01L21/6838 , H01L21/76849
摘要： PROBLEM TO BE SOLVED: To perform processing by holding a substrate while preventing the separation and the fall of the substrate without need for increasing adsorption to the substrate or mechanical strength. SOLUTION: The substrate supporting apparatus incldues a rotatable supporting head 184 having a ring-like seal for supporting the substrate while sealing the rear side circumferential rim of the substrate. The supporting head 184 includes a restriction mechanism 260 for generating negative pressure to the rear side of the substrate sealed with the ring-like seal accompanied by the rotation of the supporting head 184 while supporting the substrate. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：通过保持基板同时防止基板的分离和下降而不需要增加对基板的吸附或机械强度来进行加工。解决方案：基板支撑装置包括具有环状密封件的可旋转支撑头184，用于支撑基板，同时密封基板的后侧圆周边缘。支撑头184包括限制机构260，用于在支撑基板的同时伴随着支撑头184的旋转而用密封的环状密封件向衬底的后侧产生负压。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2005191368A Substrate retaining device, substrate retaining method, and substrate treatment device 有权
标题翻译：基板保持装置，基板保持方法和基板处理装置
公开(公告)号：JP2005191368A
公开(公告)日：2005-07-14
申请号：JP2003432480
申请日：2003-12-26
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SEKIMOTO MASAHIKO , KATSUOKA SEIJI , DAI NAOKI , WATANABE TERUYUKI , OGAWA TAKAHIRO , SUZUKI KENICHI , KOBAYASHI KENICHI , MOTOJIMA YASUYUKI , KATO AKIRA
IPC分类号： B24B37/30 , H01L21/288 , H01L21/304 , H01L21/677 , H01L21/68 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To reliably suck and retain a substrate by reliably adhering the rear surface periphery of a substrate without a gaps over the entire periphery of a suction seal on the end face of the suction seal. SOLUTION: A substrate retaining device comprises a substrate pressing section 82 for supporting the substrate W while the surface faces down, and a suction head 84 having the suction seal 90 for retaining the substrate by sealing the rear surface periphery of the substrate W supported by the substrate pressing section 82 annularly for suction. A plurality of pressing mechanisms 164 that come into contact with the surface periphery of the substrate W supported by the substrate pressing section 82 and press the substrate W toward the suction head 84 are provided at positions along the circumferential direction at the substrate pressing section 82. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过在吸入密封件的端面上的吸入密封件的整个周边上可靠地粘附基板的后表面周边而不间隙地可靠地吸附和保持基板。解决方案：基板保持装置包括：基板按压部82，用于在表面朝下的同时支撑基板W;吸入头84具有用于通过密封基板W的后表面周边来保持基板的吸入密封件90 由基板按压部82支撑，用于抽吸。与基板按压部82支撑的基板W的表面周边接触并将基板W朝向吸引头84按压的多个按压机构164设置在基板按压部82的周向的位置。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2005191304A Substrate retaining device, substrate retaining method, and substrate treatment device 审中-公开
标题翻译：基板保持装置，基板保持方法和基板处理装置
公开(公告)号：JP2005191304A
公开(公告)日：2005-07-14
申请号：JP2003431346
申请日：2003-12-25
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SEKIMOTO MASAHIKO , KATSUOKA SEIJI , DAI NAOKI , WATANABE TERUYUKI , OGAWA TAKAHIRO , SUZUKI KENICHI , KOBAYASHI KENICHI , MOTOJIMA YASUYUKI , KATO AKIRA
IPC分类号： C23C18/18 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To respond to a request for miniaturizing and making compact a device by securing the dipping depth of a substrate into a treatment liquid.
SOLUTION: A substrate retaining device comprises a substrate holder 84 that has a first annular sealing member 92 and retains a substrate W by bringing the periphery of the treatment surface of the substrate W into contact with the first sealing member 92; and a substrate pressing section 85 that goes down relatively to the substrate holder 84, presses the substrate W supported by the substrate holder 84 downward, and pressure-welds the first sealing member 92 to the substrate W. A second annular sealing member 170 that is pressure-welded to the upper surface of an annular retaining section 82 of the substrate holder 84 and seals the outer periphery of the substrate pressing section 85 when the second annular sealing member 170 goes down relatively to the substrate holder 84 is provided at the substrate pressing section 85.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过将基板的浸入深度确保到处理液中来应对小型化和紧凑化装置的要求。解决方案：衬底保持装置包括：衬底保持器84，其具有第一环形密封构件92，并且通过使衬底W的处理表面的周边与第一密封构件92接触来保持衬底W; 以及相对于基板保持件84下降的基板按压部85，将由基板保持件84支撑的基板W向下压，并将第一密封部件92加压焊接到基板W.第二环状密封部件170 在第二环状密封构件170相对于基板保持件84下降时，被压焊到基板保持件84的环状保持部82的上表面，并密封基板按压部85的外周，第85条。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2012253130A Substrate transfer method and substrate transfer apparatus 有权
标题翻译：基板传输方法和基板传输装置
公开(公告)号：JP2012253130A
公开(公告)日：2012-12-20
申请号：JP2011123369
申请日：2011-06-01
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SUZUKI KENICHI , SOTOZAKI HIROSHI
IPC分类号： H01L21/677 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a substrate transfer method and a substrate transfer apparatus which widen the allowable range of the positioning adjustment of the substrate transfer apparatus itself and prevent damage to the substrate, the occurence of particles, and transfer failures of the substrate.SOLUTION: In a substrate transfer method, a peripheral part of the substrate W is supported by a pair of support arms 171 and the support arm 171 and the substrate W are moved by movement mechanisms 162, 165 with a predetermined clearance formed between the support arm 171 and the peripheral part of the substrate W. The substrate W supported by the support arm 171 may be reversed.
摘要翻译：要解决的问题：为了提供一种基板转印方法和基板转印装置，其扩大了基板转印装置本身的定位调整的允许范围，并且防止了对基板的损坏，颗粒的发生和转印失败底物。解决方案：在基板转印方法中，基板W的周边部分由一对支撑臂171和支撑臂171支撑，基板W由移动机构162,165以预定的间隙形成支撑臂171和基板W的周边部分。由支撑臂171支撑的基板W可以相反。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2007119926A Substrate plating apparatus 审中-公开
标题翻译：基板镀膜设备
公开(公告)号：JP2007119926A
公开(公告)日：2007-05-17
申请号：JP2007032714
申请日：2007-02-13
申请人： Ebara Corp , 株式会社荏原製作所
发明人： HONGO AKIHISA , NAGAI MIZUKI , SUZUKI KENICHI , CHONO ATSUSHI
IPC分类号： C25D17/00
摘要： PROBLEM TO BE SOLVED: To provide a substrate plating apparatus in which a primary current distribution between a cathode and an anode can be uniformed and which can be downsized.
SOLUTION: In the substrate plating apparatus, in which a substrate 2 to be plated and an anode electrode 3 are arranged facing each other in a plating tank 1 storing a plating solution, a porous plate to increase the electric resistance between the substrate 2 and the anode electrode 3 is arranged between the substrate 2 and the anode electrode 3. As a result, the interval between the substrate 2 and the anode electrode 3 can be shortened, thereby downsizing the apparatus.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够使阴极和阳极之间的一次电流分布均匀化且能够小型化的基板电镀装置。解决方案：在存储电镀液的电镀槽1中，将要镀覆的基板2和阳极电极3彼此相对配置的基板电镀装置中，增加基板之间的电阻的多孔板并且阳极电极3被布置在基板2和阳极电极3之间。结果，可以缩短基板2和阳极电极3之间的间隔，从而减小装置的尺寸。版权所有（C）2007，JPO＆INPIT

6. 发明申请

WO0003074A8 PLATING DEVICE 审中-公开
标题翻译：电镀装置
公开(公告)号：WO0003074A8
公开(公告)日：2000-05-04
申请号：PCT/JP9903729
申请日：1999-07-09
申请人： EBARA CORP , HONGO AKIHISA , SUZUKI KENICHI , CHONO ATSUSHI , TADA MITSUO , OGATA AKIRA , SENDAI SATOSHI , MISHIMA KOJI
发明人： HONGO AKIHISA , SUZUKI KENICHI , CHONO ATSUSHI , TADA MITSUO , OGATA AKIRA , SENDAI SATOSHI , MISHIMA KOJI
IPC分类号： C25D21/12 , G01R31/02
CPC分类号： C25D21/12 , G01R31/026
摘要： A conduction condition detecting means which can detect a conduction condition (contact condition) of a plurality of feeding contacts in contact with the conduction portion of a substrate to be plated, and a plating device which can form a plating film with a uniform film thickness by uniformizing plating currents flowing through individual feeding contacts. A plating device which plates a substrate to be plated (12), wherein an electrode (13) and a substrate to be plated (12) mounted to a plating jig (11) are arranged opposite to each other in a plating tank (10), the plating jig (11) is provided with a plurality of feeding contact (15) to come into contact with the conduction portion provided on the surface of the substrate to be plated (12), and a specified voltage is applied between the feeding contacts (15) and the electrode (13) to supply a plating current through the feeding contacts (15), the plating device being provided with a conduction condition detecting means (22) for detecting a conduction condition between individual feeding contacts (15) of the plating jig (11) and the conduction portion of the substrate to be plated (12).
摘要翻译：导电条件检测装置，其能够检测与待镀基板的导电部分接触的多个馈电触点的导电状态（接触状况）;以及电镀装置，其能够通过以下步骤形成具有均匀膜厚度的电镀膜：使流过各个馈电触点的电镀电流均匀化。本发明提供一种电镀装置，该电镀装置在镀槽（10）中对置配置电镀基板（12）的电极（13）和被镀基板（12），电镀夹具（11）设置有多个馈电触点（15），以与设置在待电镀基板（12）的表面上的导电部分接触，并且在馈电触点（15）与电极（13）之间的导电状态检测装置（22），用于通过馈电触点（15）提供电镀电流，所述电镀装置设置有用于检测电镀夹具（11）和待镀基板（12）的导电部分。

7. 发明公开

EP1018568A4 PLATING DEVICE 审中-公开
标题翻译： DEVICE电镀
公开(公告)号：EP1018568A4
公开(公告)日：2006-05-31
申请号：EP99929778
申请日：1999-07-09
申请人： EBARA CORP
发明人： HONGO AKIHISA , SUZUKI KENICHI , CHONO ATSUSHI , TADA MITSUO , OGATA AKIRA , SENDAI SATOSHI , MISHIMA KOJI
IPC分类号： C25D21/12 , G01R31/02
CPC分类号： C25D21/12 , G01R31/026
摘要： The present invention is to provide a conduction detection device that can detect electrical conductivity (contact condition) of feeding contacts with the conductive layers of a substrate. The present invention also provides an electroplating apparatus, which is able to produce uniform currents to flow through each of feeding contacts. The apparatus has a plating vessel (10), in which an electrode (13) is disposed opposite to a substrate (12) which is affixed to a plating jig (11) electrically through a plurality of feeding contacts (15) for applying a specific voltage between the electrode (13) and conductive layers provided on a plating surface of the substrate (12). Plating current flows from the plating jig (11) through the feeding contacts (15) to the substrate (12). A conduction detection device (22) is provided to detect electrical conductive states between the plurality of feeding contacts (15) and the conductive layer on the substrate (12).

8. 发明公开

EP1029954A4 SUBSTRATE PLATING DEVICE 审中-公开
标题翻译： SUBSTRATBESCHICHTUNGSVORRICHTUNG
公开(公告)号：EP1029954A4
公开(公告)日：2006-07-12
申请号：EP99943206
申请日：1999-09-08
申请人： EBARA CORP
发明人： HONGO AKIHISA , OGURE NAOAKI , UEYAMA HIROYUKI , YAMAKAWA JUNITSU , NAGAI MIZUKI , SUZUKI KENICHI , CHONO ATSUSHI , SENDAI SATOSHI , MISHIMA KOJI
IPC分类号： C25D7/12 , C25D17/00 , C25D21/14
CPC分类号： C25D21/14 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/02
摘要： A substrate plating device capable of using an insoluble anode and replenishing metal ions automatically; a substrate plating device capable of making uniform a primary current distribution between a cathode and an anode and downsizing the device itself; and a plating device with which black film turned into a particle form does not contaminate a substrate to be plated even when a soluble anode is used. A substrate plating device, wherein a substrate to be metal-plated and an insoluble anode are disposed opposite to each other in a plating tank containing a plating solution, wherein soluble anode and cathode are disposed opposite to each other in a circulation tank or a dummy tank provided separately from the plating tank and an anion exchange membrane or a cation selective exchange membrane are disposed between the anode and the cathode. Current is allowed to run between the separately disposed anode and cathode to thereby generate metal ions continuously for replenishing into the plating tank. In addition, an ion exchange membrane or a porous neutral barrier membrane is disposed between a substrate to be plated and an anode to provide a substrate-to-be-plated side area and an anode side area separated from each other.
摘要翻译：本发明的目的是提供一种使用不溶性阳极的基板电镀装置，特别是能够容易且自动地供给金属离子的基板电镀装置。本发明的另一个目的是提供一种能够在阴极和阳极之间提供均匀的初级电流分布并且有助于减小电镀装置的尺寸的基板电镀装置。本发明的另一个目的是提供一种能够防止基板被黑色膜产生的颗粒污染的电镀装置，即使使用可溶性阳极也是如此。本发明涉及一种用于在含有电镀液的电镀液中电镀基板的基板电镀装置，在与基板相对的电镀槽中设置不溶性阳极，所述基板电镀装置包括：循环容器或虚拟容器，与电镀浴，可溶性阳极和阴极设置在循环容器或虚拟容器中，阴离子交换膜或选择性阳离子交换膜设置在阳极和阴极之间并将其隔离; 其中通过在可溶性阳极和阴极之间流动电流而在循环容器或虚拟容器中产生金属离子，并将所产生的金属离子供应到镀浴。基板电镀装置包括在电镀槽中设置在基板和阳极之间的离子交换膜或中性多孔隔膜; 其中所述离子交换膜或中性多孔隔膜将所述镀浴分为衬底区域和阳极区域。

9. 发明公开

EP1052311A4 PLATING MACHINE 审中-公开
标题翻译：电镀
公开(公告)号：EP1052311A4
公开(公告)日：2006-06-21
申请号：EP99973080
申请日：1999-11-26
申请人： EBARA CORP
发明人： KURIYAMA FUMIO , UEYAMA HIROYUKI , YAMAKAWA JUNITSU , SUZUKI KENICHI , CHONO ATSUSHI
IPC分类号： C25D7/12 , C25D21/14 , C25D21/16 , C25D21/18 , C25D19/00
CPC分类号： C25D21/14 , C25D17/001 , C25D21/16 , C25D21/18
摘要： A plating machine comprising a plating unit and a control unit which are installed in separate rooms so that works which are the dirty polluting ones of maintenance are conducted in the room where the control unit is installed as much as possible, and thereby works for maintenance of the plating unit are reduced to a minimum not to cause any problem of pollution from the plating unit. The plating machine has the plating unit for plating and the control unit for, e.g., adjusting a plating solution is characterized in that the plating unit contains the plating solution and includes a plating bath for plating where an anode electrode faces an object to be plated, serving as a cathode, the control unit includes an adjusting bath for adjusting the components and/or concentration of the plating solution and a solution supplying mechanism for adding a replenisher solution to the plating solution in the adjusting bath, the plating machine further has a solution circulating mechanism for circulating the plating solution through the adjusting bath of the control unit and the plating bath of the plating unit, the plating unit is installed in a first room, and the control unit is installed in a second room.

10. 发明公开

EP1048755A4 PLATING DEVICE AND METHOD OF CONFIRMING CURRENT FEED 审中-公开
标题翻译：电镀和勾引确认所有电源
公开(公告)号：EP1048755A4
公开(公告)日：2006-05-31
申请号：EP98961353
申请日：1998-12-16
申请人： EBARA CORP
发明人： YOSHIOKA JUNICHIRO , SENDAI SATOSHI , CHONO ATSUSHI , TADA MITSUO , HONGO AKIHISA , MUKAIYAMA YOSHITAKA , TOMIOKA KENYA , OGATA AKIRA , SUZUKI KENICHI , OZAWA NAOMITSU
IPC分类号： C25D21/12 , G01R31/02 , C25D17/08 , C25D5/08 , G01R27/02
CPC分类号： G01R31/026 , C25D21/12
摘要： The present invention provides a conductivity sensing device capable of detecting the conductivity (contact state) of the plurality of feeder contacts contacting the conductive area of the substrate, and a plating apparatus capable of forming a plating film of uniform thickness by supplying a uniform plating current through a plurality of feeder contacts. In the plating apparatus, an anode 13 is disposed in a plating bath; a substrate 12 is mounted in a jig and disposed in the plating bath opposite the anode 13; and a plurality of feeder contacts 15 is contacting the conductive region formed on the surface of the substrate 12. A predetermined voltage is applied between the anode 13 and feeder contacts 15 to supply a plating current through the feeder contacts 15 for plating the substrate 12. The plating apparatus also includes a conductivity sensor 22 for detecting the state of conductivity between each of the feeder contacts 15 and the conductive region on the substrate 12.

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