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1. 发明申请

WO2004107422A2 PLATING APPARATUS AND PLATING METHOD 审中-公开
标题翻译：电镀设备和电镀方法
公开(公告)号：WO2004107422A2
公开(公告)日：2004-12-09
申请号：PCT/JP2004/007437
申请日：2004-05-25
申请人： EBARA CORPORATION , SEKIMOTO, Masahiko , ENDO, Yasuhiko , STRAUSSER, Stephen , TAKEMURA, Takashi , SAITO, Nobutoshi , KURIYAMA, Fumio , YOSHIOKA, Junichiro , HORIE, Kuniaki , MINAMI, Yoshio , KAMODA, Kenji
发明人： SEKIMOTO, Masahiko , ENDO, Yasuhiko , STRAUSSER, Stephen , TAKEMURA, Takashi , SAITO, Nobutoshi , KURIYAMA, Fumio , YOSHIOKA, Junichiro , HORIE, Kuniaki , MINAMI, Yoshio , KAMODA, Kenji
IPC分类号： H01L21/288
CPC分类号： C25D5/022 , C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/67173 , H01L21/6723 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/1147 , H01L2224/13099 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2224/05647 , H01L2924/00014
摘要： A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.
摘要翻译：电镀装置具有灰化单元（300），其被配置为对施加在形成在基板（W）上的籽晶层（500）的表面上的抗蚀剂（502）和预润湿部分（26）进行灰化处理，被配置为在灰化过程之后向基板的表面提供亲水性。电镀装置包括预浸渍部分（28），其被配置为使基材的表面与处理溶液接触以清洁或活化形成在基材上的种子层的表面。电镀装置还包括电镀单元（34），其被配置为在将抗蚀剂用作掩模的同时使基板的表面进入电镀槽中的镀液中，以在该表面上形成镀膜（504）种子层形成在基底上。

2. 发明申请

WO2004107422A3 PLATING APPARATUS AND PLATING METHOD 审中-公开
标题翻译：电镀设备和电镀方法
公开(公告)号：WO2004107422A3
公开(公告)日：2005-06-16
申请号：PCT/JP2004007437
申请日：2004-05-25
申请人： EBARA CORP , SEKIMOTO MASAHIKO , ENDO YASUHIKO , STRAUSSER STEPHEN , TAKEMURA TAKASHI , SAITO NOBUTOSHI , KURIYAMA FUMIO , YOSHIOKA JUNICHIRO , HORIE KUNIAKI , MINAMI YOSHIO , KAMODA KENJI
发明人： SEKIMOTO MASAHIKO , ENDO YASUHIKO , STRAUSSER STEPHEN , TAKEMURA TAKASHI , SAITO NOBUTOSHI , KURIYAMA FUMIO , YOSHIOKA JUNICHIRO , HORIE KUNIAKI , MINAMI YOSHIO , KAMODA KENJI
IPC分类号： C25D5/02 , C25D7/12 , H01L21/00 , H01L21/288 , H01L21/60
CPC分类号： C25D5/022 , C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/67173 , H01L21/6723 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/1147 , H01L2224/13099 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2224/05647 , H01L2924/00014
摘要： A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.
摘要翻译：电镀装置具有灰化单元（300），其被配置为对施加在形成在基板（W）上的种子层（500）的表面上的抗蚀剂（502）和预润湿部分（26）进行灰化处理，被配置为在灰化过程之后向基板的表面提供亲水性。电镀装置包括预浸渍部分（28），其被配置为使基材的表面与处理溶液接触以清洁或活化形成在基材上的种子层的表面。电镀装置还包括电镀单元（34），其被配置为在将抗蚀剂用作掩模的同时使基板的表面进入电镀槽中的镀液中，以在该表面上形成镀膜（504）种子层形成在基底上。

3. 发明专利

JPS51124591A MACHINES FOR AUTOMATIC SWINGING OF FISHING RODS 失效
公开(公告)号：JPS51124591A
公开(公告)日：1976-10-30
申请号：JP4624175
申请日：1975-04-15
申请人： FURUKAWA AKIO , MINAMI YOSHIO
发明人： FURUKAWA AKIO , MINAMI YOSHIO
IPC分类号： A01K97/10

4. 发明专利

JPH09165817A METALLIC DIAGONAL BRACE FOR ASEISMATIC TIMBER STRUCTURE 失效
公开(公告)号：JPH09165817A
公开(公告)日：1997-06-24
申请号：JP35172895
申请日：1995-12-15
申请人： MINAMI YOSHIO
发明人： MINAMI YOSHIO
IPC分类号： E04B2/56 , E04B1/26 , E04H9/02 , F16B7/06
摘要： PROBLEM TO BE SOLVED: To enhance aseismatic performance of a wooden building by strongly towing reinforcements for a turnbuckle held by holding plates of a pair of upper and lower towing members fixed and arranged in the diagonal line direction, by a fastener. SOLUTION: A fixing towing member 1 is composed of horizontal plates 2 and vertical plates 3 which are continuously arranged at a right angle to these horizontal plates 2 and have the same width as these horizontal plates 2, and holding plates 4 are also fixed in the vertical direction in a central part of a width in these right-angled corner parts. After the fixing towing member 1 is respectively fixed to horizontal columns and vertical columns by bolts, reinforcements 7 for a turnbuckle are fixed to the holding plates 4 integrally formed with the fixing towing member 1, and are tensioned in the diagonal line direction of the horizontal columns and the vertical columns to constitute a rectangle, and a turnbuckle is rotated in the towing direction, and the reinforcements 7 for a turnbuckle are strongly towed in the oblique direction.

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