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1. 发明专利

SG11201707991SA POLISHING APPARATUS AND POLISHING METHOD 未知
公开(公告)号：SG11201707991SA
公开(公告)日：2017-10-30
申请号：SG11201707991S
申请日：2017-01-06
申请人： EBARA CORP
发明人： NAKANISHI MASAYUKI , WATANABE TOSHIFUMI , KODERA KENJI
IPC分类号： B24B21/00 , B24B9/00 , B24B49/12 , H01L21/304
摘要： To provide a polishing apparatus capable of polishing bevel portions of varying shape by selecting a suitable polishing recipe, based on a state before polishing. The polishing apparatus 100 comprises: a holding/polishing unit 102 for holding and polishing a workpiece W1; and an identifying unit 104 for identifying data 104a associated with a state of the peripheral portion of the substrate W1 before polishing. The holding/polishing unit 102 comprises: a holder 106 for holding and rotating the substrate W1; and a polisher 108 for polishing the peripheral portion of the substrate W1 by pressing a polishing member against the peripheral portion. A polishing-condition determiner 110 determines a polishing condition, based on data 104a indicating to which type, of a plurality of shape-related types, the shape of a given peripheral portion belongs.

2. 发明专利

JP2014124731A Polishing device and polishing method 有权
标题翻译：抛光装置和抛光方法
公开(公告)号：JP2014124731A
公开(公告)日：2014-07-07
申请号：JP2012284232
申请日：2012-12-27
申请人： Ebara Corp , 株式会社荏原製作所
发明人： NAKANISHI MASAYUKI , KODERA KENJI , YANAKA NOBUHIRO
IPC分类号： B24B55/02 , B24B9/00 , H01L21/304
CPC分类号： H01L21/304 , B24B9/065 , B24B9/08 , B24B37/02 , B24B57/02 , H01L21/02057 , H01L21/02087
摘要： PROBLEM TO BE SOLVED: To provide a polishing device and polishing method capable of preventing particles on a rear surface of a substrate from moving to a front surface of the substrate.SOLUTION: A polishing device 100 comprises a holding stage 4 for holding a central part of a rear surface of a substrate W, a motor M1 for rotating the holding stage 4, a front surface nozzle 36 for supplying a rinse liquid to a front surface of the substrate W in a state that the holding stage 4 is rotated by the motor M1, a rear surface nozzle 37 for supplying the rinse liquid to the rear surface of the substrate W in a state that the holding stage 4 is rotated, a rinse liquid control unit 110 for supplying the rinse liquid from the rear surface nozzle 37 when a predetermined time is elapsed after the rinse liquid is supplied from the front surface nozzle 36, and a polishing head assembly 1A for polishing a peripheral part of the substrate W disposed on the holding stage 4 after the rinse liquid is supplied to the substrate W by the rinse liquid control unit 110.
摘要翻译：要解决的问题：提供一种能够防止基板的后表面上的颗粒移动到基板的前表面的抛光装置和抛光方法。抛光装置100包括：保持台4，用于保持基板的中心部分基板W的后表面，用于旋转保持台4的电动机M1，用于在保持台4由电动机旋转的状态下将冲洗液供给到基板W的前表面的前表面喷嘴36 M1，用于在保持台4旋转的状态下将冲洗液体供给到基板W的后表面的后表面喷嘴37，当用于从后表面喷嘴37提供冲洗液体的冲洗液体控制单元110 在从前表面喷嘴36供给冲洗液之后经过预定时间，以及在冲洗液为su后，在配置在保持台4上的基板W的周边部分进行研磨的研磨头组件1A 通过冲洗液体控制单元110浸入基材W。

3. 发明专利

JP2010141218A Bevel shape of wafer managing method 审中-公开
标题翻译： WAFER管理方法的水平形状
公开(公告)号：JP2010141218A
公开(公告)日：2010-06-24
申请号：JP2008317821
申请日：2008-12-15
申请人： Ebara Corp , 株式会社荏原製作所
发明人： NAKANISHI MASAYUKI , KODERA KENJI
IPC分类号： H01L21/304 , B24B9/00 , B24B21/00
摘要： PROBLEM TO BE SOLVED: To provide a method for controlling the shape of a bevel portion of a wafer, minimizing deformation of a retainer ring during a CMP step. SOLUTION: In the method for controlling the shape of a bevel portion, the bevel portion of a wafer W is polished to form a flat end face B1 before polishing the wafer W using a CMP device. Deformation of a retainer ring of the CMP device by the wafer W is prevented thereby. Here, a width D of the end face B1 is preferred to be within 200-500 μm. As a means for forming the end face B1, a bevel polishing device which uses a polishing tape or the like is employed. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于控制晶片的斜面部分的形状的方法，使CMP步骤期间保持环的变形最小化。解决方案：在用于控制斜面部分形状的方法中，使用CMP装置对晶片W进行研磨之前，抛光晶片W的斜面部分以形成平坦端面B1。因此防止了由晶片W造成的CMP装置的保持环的变形。这里，端面B1的宽度D优选在200〜500μm之间。作为形成端面B1的手段，采用使用研磨带等的斜面研磨装置。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2019091831A 研磨装置および研磨方法审中-公开
公开(公告)号：JP2019091831A
公开(公告)日：2019-06-13
申请号：JP2017220608
申请日：2017-11-16
申请人： EBARA CORP
发明人： YAMAMOTO AKIRA , KODERA KENJI
IPC分类号： H01L21/304 , B24B9/00 , B24B21/00 , B24B37/013 , B24B49/12
摘要：【課題】基板の周縁部の研磨終点を正確に検出することができる研磨装置を提供する。【解決手段】研磨装置は、基板Wを保持する保持面4aを有する保持ステージ4と、研磨テープ41を用いて保持ステージ4上の基板Wの周縁部を研磨する研磨ヘッド60と、研磨テープ41をその長手方向に送るテープ送り機構100と、基板Wの研磨終点を検出する動作制御部11を備える。研磨ヘッド60は、研磨テープ41の研磨面を基板Wの周縁部に押し付ける押圧部材81,82,83と、押圧部材81,82,83の裏側に配置され、研磨テープ41の研磨面の色を数値に変換するカラーセンサ121,122,123を備えている。動作制御部11は、数値に基づいて基板Wの研磨終点を決定する。【選択図】図12

5. 发明专利

JP2010162624A Polishing device and method 审中-公开
标题翻译：抛光装置和方法
公开(公告)号：JP2010162624A
公开(公告)日：2010-07-29
申请号：JP2009005102
申请日：2009-01-13
申请人： Ebara Corp , 株式会社荏原製作所
发明人： NAKANISHI MASAYUKI , ITO KENYA , TAKAHASHI YOSHIMIZU , MIYAMOTO KUMIKO , KODERA KENJI
IPC分类号： B24B9/00 , B24B21/00 , H01L21/304
CPC分类号： B24B9/065 , B24B21/004
摘要： PROBLEM TO BE SOLVED: To provide polishing device and method allowing realizing of a polishing process capable of forming a smooth polished surface at a low cost. SOLUTION: This polishing device includes a substrate holding part 3 for rotating a substrate W with the axial center as a center, first polishing parts 1B and 1D for polishing a peripheral edge part of the rotated substrate W by bringing the peripheral edge part into contact with a polishing layer of a first polishing tool 23A, and second polishing parts 1A and 1C for polishing the peripheral edge part by bringing the peripheral part into contact with a polishing layer of a second polishing tool 23B. The polishing layer of the first polishing tool 23A has hard first abrasive grain, while the polishing layer of the second polishing tool 23B has second abrasive grain softer than the first abrasive grain. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供能够以低成本实现能够形成平滑抛光表面的抛光工艺的抛光装置和方法。解决方案：该抛光装置包括：以轴心为中心旋转基板W的基板保持部3;第一研磨部1B，1D，其通过使旋转基板W的周缘部的周缘部与第一研磨工具23A的研磨层接触，以及第二研磨部1A，1C，其通过使周缘部与第二研磨工具23B的研磨层接触来研磨周缘部。第一研磨工具23A的研磨层具有硬质的第一磨粒，而第二研磨工具23B的研磨层具有比第一磨粒更软的第二磨粒。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2019091886A 基板処理装置および基板処理方法审中-公开
公开(公告)号：JP2019091886A
公开(公告)日：2019-06-13
申请号：JP2018188817
申请日：2018-10-04
申请人： EBARA CORP
发明人： KODERA KENJI , NAKANISHI MASAYUKI
IPC分类号： H01L21/304
摘要：【課題】基板の裏面が下を向いた状態で、最外部を含む基板の裏面全体を効率的に処理することができる基板処理装置を提供する。【解決手段】基板処理装置は、基板Wの周縁部を保持する基板保持面11aを有する回転可能な複数のローラー11と、基板Wの下面1にスクラブ具31を押し付けるスクラブヘッド50と、複数のローラー11の軸心と平行に延びる回転軸55と、スクラブヘッド50を回転軸55に連結する連結部材57と、回転軸55を回転させるヘッド回転機構70を備える。スクラブヘッド50は回転軸55の軸心SCから偏心している。【選択図】図1

7. 发明专利

JP2012111012A METHOD OF POLISHING SUBSTRATE USING POLISHING TAPE HAVING FIXED ABRASIVE 审中-公开
公开(公告)号：JP2012111012A
公开(公告)日：2012-06-14
申请号：JP2010263215
申请日：2010-11-26
申请人： EBARA CORP
发明人： NAKANISHI MASAYUKI , SEKI MASAYA , KODERA KENJI
IPC分类号： B24B21/00 , B24B9/00 , B24B37/00 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide an efficient polishing method capable of selectively removing only an upper layer film on a base layer and reducing polished traces without giving damage to a device on the substrate.SOLUTION: The polishing method includes a step of causing sliding contact between a peripheral edge portion of the substrate W and a polishing tape 1, and a step of supplying a polishing liquid onto the polishing tape 1 contacting the peripheral portion of the substrate W. The polishing tape 1 has a base tape and a fixed abrasive formed on the base tape. The polishing liquid is an alkaline polishing liquid containing an additive including molecules that cause steric hindrance and an alkaline chemical.

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