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1. 发明专利

JP2010162624A Polishing device and method 审中-公开
标题翻译：抛光装置和方法
公开(公告)号：JP2010162624A
公开(公告)日：2010-07-29
申请号：JP2009005102
申请日：2009-01-13
申请人： Ebara Corp , 株式会社荏原製作所
发明人： NAKANISHI MASAYUKI , ITO KENYA , TAKAHASHI YOSHIMIZU , MIYAMOTO KUMIKO , KODERA KENJI
IPC分类号： B24B9/00 , B24B21/00 , H01L21/304
CPC分类号： B24B9/065 , B24B21/004
摘要： PROBLEM TO BE SOLVED: To provide polishing device and method allowing realizing of a polishing process capable of forming a smooth polished surface at a low cost. SOLUTION: This polishing device includes a substrate holding part 3 for rotating a substrate W with the axial center as a center, first polishing parts 1B and 1D for polishing a peripheral edge part of the rotated substrate W by bringing the peripheral edge part into contact with a polishing layer of a first polishing tool 23A, and second polishing parts 1A and 1C for polishing the peripheral edge part by bringing the peripheral part into contact with a polishing layer of a second polishing tool 23B. The polishing layer of the first polishing tool 23A has hard first abrasive grain, while the polishing layer of the second polishing tool 23B has second abrasive grain softer than the first abrasive grain. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供能够以低成本实现能够形成平滑抛光表面的抛光工艺的抛光装置和方法。解决方案：该抛光装置包括：以轴心为中心旋转基板W的基板保持部3;第一研磨部1B，1D，其通过使旋转基板W的周缘部的周缘部与第一研磨工具23A的研磨层接触，以及第二研磨部1A，1C，其通过使周缘部与第二研磨工具23B的研磨层接触来研磨周缘部。第一研磨工具23A的研磨层具有硬质的第一磨粒，而第二研磨工具23B的研磨层具有比第一磨粒更软的第二磨粒。版权所有（C）2010，JPO＆INPIT

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