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1. 发明专利

JP2011177842A Polishing apparatus and method 审中-公开
标题翻译：抛光装置和方法
公开(公告)号：JP2011177842A
公开(公告)日：2011-09-15
申请号：JP2010044846
申请日：2010-03-02
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： NAKANISHI MASAYUKI , TOGAWA TETSUJI , ITO KENYA , SEKI MASAYA , IWADE KENJI , KUBOTA TAKEO , NISHIOKA TAKESHI
IPC分类号： B24B21/00 , B24B9/00 , B24B21/18 , B24B53/10
CPC分类号： B24B1/00 , B24B55/00
摘要： PROBLEM TO BE SOLVED: To prevent abrasive particles from falling from a polishing tape as much as possible during polishing; and to prevent the fallen abrasive particles from entering an element forming area or the like in a center of a substrate even if the abrasive particles are fallen from the polishing tape during polishing a surface peripheral part of the substrate. SOLUTION: A polishing apparatus includes: a polishing head 12 that polishes a surface of the substrate W by pressing a surface of the polishing tape 20 to a surface of the substrate W while running the polishing tape 20, which has the abrasive particles fixed on the surface thereof, in one direction; and a conditioning apparatus (cleaning apparatus) 30 that is arranged at an upstream side of the polishing head 12 along the running direction of the polishing tape 20 and that conditions the surface in advance for preventing the abrasive particles from falling during polishing the surface of the polishing tape 20. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了防止磨料颗粒在抛光过程中尽可能多地从研磨带落下; 并且即使在抛光衬底的表面周边部分期间研磨颗粒从研磨带中掉落时，也可防止掉落的磨料颗粒进入衬底中心的元件形成区域等。解决方案：抛光装置包括：抛光头12，其抛光基材W的表面，通过将研磨带20的表面压在基板W的表面上，同时运行具有磨料颗粒的研磨带20 在一个方向上固定在其表面上; 以及沿研磨带20的行进方向配置在研磨头12的上游侧的调理装置（清洗装置）30，并且预先调整表面，以防止研磨颗粒在抛光过程中的表面抛光抛光胶带20.版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2011115893A Method and device for polishing base board ground in reverse surface 有权
标题翻译：用于在反向表面抛光基板接地的方法和装置
公开(公告)号：JP2011115893A
公开(公告)日：2011-06-16
申请号：JP2009275408
申请日：2009-12-03
申请人： Ebara Corp , 株式会社荏原製作所
发明人： NAKANISHI MASAYUKI , ONOZAWA MASUNOBU , SEKI MASAYA
IPC分类号： B24B9/00 , B24B21/00 , B24B21/02 , H01L21/304
CPC分类号： B24B9/065 , B24B21/002
摘要： PROBLEM TO BE SOLVED: To provide a polishing method which quickly polishes a corner part formed of a reverse surface and an outer peripheral surface, without damaging a thin base board ground on a reverse surface. SOLUTION: This method is provided for polishing the base board after grinding the reverse surface. This polishing method polishes the corner part by pushing a polishing tape 23 against the corner part formed of the reverse surface and the outer peripheral surface of the base board W. In polishing, the polishing tape 23 is sent at a predetermined speed. The corner part can also be polished while changing a contact angle between the corner part and the polishing tape. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种快速抛光由反面和外周面形成的角部的抛光方法，而不会损坏在反面上接地的薄基板。
解决方案：该方法用于在研磨反面之后对基板进行抛光。该抛光方法通过将研磨带23推靠在由反面的形成的角部和基板W的外周面上来抛光角部。在研磨中，以预定的速度送出研磨带23。角部也可以在改变角部与研磨带之间的接触角的同时进行抛光。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2010162624A Polishing device and method 审中-公开
标题翻译：抛光装置和方法
公开(公告)号：JP2010162624A
公开(公告)日：2010-07-29
申请号：JP2009005102
申请日：2009-01-13
申请人： Ebara Corp , 株式会社荏原製作所
发明人： NAKANISHI MASAYUKI , ITO KENYA , TAKAHASHI YOSHIMIZU , MIYAMOTO KUMIKO , KODERA KENJI
IPC分类号： B24B9/00 , B24B21/00 , H01L21/304
CPC分类号： B24B9/065 , B24B21/004
摘要： PROBLEM TO BE SOLVED: To provide polishing device and method allowing realizing of a polishing process capable of forming a smooth polished surface at a low cost. SOLUTION: This polishing device includes a substrate holding part 3 for rotating a substrate W with the axial center as a center, first polishing parts 1B and 1D for polishing a peripheral edge part of the rotated substrate W by bringing the peripheral edge part into contact with a polishing layer of a first polishing tool 23A, and second polishing parts 1A and 1C for polishing the peripheral edge part by bringing the peripheral part into contact with a polishing layer of a second polishing tool 23B. The polishing layer of the first polishing tool 23A has hard first abrasive grain, while the polishing layer of the second polishing tool 23B has second abrasive grain softer than the first abrasive grain. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供能够以低成本实现能够形成平滑抛光表面的抛光工艺的抛光装置和方法。解决方案：该抛光装置包括：以轴心为中心旋转基板W的基板保持部3;第一研磨部1B，1D，其通过使旋转基板W的周缘部的周缘部与第一研磨工具23A的研磨层接触，以及第二研磨部1A，1C，其通过使周缘部与第二研磨工具23B的研磨层接触来研磨周缘部。第一研磨工具23A的研磨层具有硬质的第一磨粒，而第二研磨工具23B的研磨层具有比第一磨粒更软的第二磨粒。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2008091951A Substrate treating device 有权
标题翻译：基板处理设备
公开(公告)号：JP2008091951A
公开(公告)日：2008-04-17
申请号：JP2007332170
申请日：2007-12-25
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： NAKANISHI MASAYUKI , ISHII YU , NAKAMURA KENRO
IPC分类号： H01L21/304 , B24B9/00 , B24B21/00 , B24B49/12
摘要： PROBLEM TO BE SOLVED: To provide a substrate treating device capable of effectively removing surface roughness occurring on a periphery of the substrate and the like and films attached to the periphery of the substrate and the like that can be contamination sources, in a semiconductor device manufacturing process and the like. SOLUTION: The substrate treating device is provided with a polishing tape 21, a mechanism that rotates the substrate W, and a polishing head 41 that presses the tape 21 against a bevel section of the rotating substrate. The head 41 is provided with a support section 42 having two protrusions 42a, 42b, an elastic member 43 that supports the tape 21 extended between the ends of the protrusions 42a, 42b, and an air cylinder 45 that moves the head 41 in the radial direction of the substrate. The supporting section 42 of the head 41 is moved in the radial direction of the substrate by the cylinder 45 to extend the elastic member 43 to generate a tension in it, and this tension allows the tape 21 to be pressed against the bevel section of the substrate by a certain force to polish the bevel section. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够有效地去除在基板等的周边上发生的表面粗糙度的基板处理装置以及附着到可能是污染源的基板等的外围的膜，半导体器件制造工艺等。解决方案：基板处理装置设置有研磨带21，使基板W旋转的机构，以及将带21压靠旋转基板的斜切部的研磨头41。头部41设置有具有两个突起42a，42b的支撑部分42，弹性部件43，其支撑在突起42a，42b的端部之间延伸的带21和使头部41径向移动的气缸45 基板的方向。头部41的支撑部42通过圆筒45在基板的径向方向上移动，以使弹性构件43延伸以在其中产生张力，并且该张力允许带21压靠在基座的斜面部分基板通过一定的力量抛光斜面部分。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2008018502A Substrate polishing device, substrate polishing method, and substrate treating device 审中-公开
标题翻译：基板抛光装置，基板抛光方法和基板处理装置
公开(公告)号：JP2008018502A
公开(公告)日：2008-01-31
申请号：JP2006193339
申请日：2006-07-13
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SEKI MASAYA , TAKAHASHI YOSHIMIZU , ITO KENYA , NAKANISHI MASAYUKI
IPC分类号： B24B9/00 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a substrate polishing device capable of polishing the end surface of a substrate (bevel surface or notch surface) evenly with a high degree of accuracy all the time with a simple structure, and to provide a substrate polishing method and a substrate treating device using the substrate polishing device. SOLUTION: This substrate polishing device is provided with a suction stage 10 sucking and holding the substrate 12, and a spindle 20 mounting a grinding wheel 22. In this device, the grinding wheel 22 rotating while being mounted to the spindle 20 is abutted on the end surface of the substrate 12 rotated or stopped while being sucked and held on the adsorption stage 10, thereby polishing the end surface of the substrate 12. The spindle 20 is mounted in a linear motion guide 23 moving on a straight line in parallel with a straight line connecting the center of the grinding wheel 22 and that of the substrate 12 so as to be moved on the parallel straight line by the linear motion guide 23. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够以简单的结构一直以高精度均匀地抛光基板的端面（斜面或切口面）的基板研磨装置，并提供基板抛光方法和使用该基板研磨装置的基板处理装置。解决方案：该基板研磨装置设置有抽吸并保持基板12的吸附台10和安装砂轮22的主轴20.在该装置中，在安装到主轴20的同时旋转的砂轮22是在被吸附并保持在吸附台10上的基板12的端面上被旋转或停止，从而研磨基板12的端面。主轴20安装在直线运动导向件23中，平行于连接砂轮22的中心和基板12的中心的直线，以便通过直线运动引导件23在平行的直线上移动。（C）2008年，JPO和INPIT

6. 发明专利

JP2004241434A Substrate processing device 有权
标题翻译：基板处理装置
公开(公告)号：JP2004241434A
公开(公告)日：2004-08-26
申请号：JP2003026367
申请日：2003-02-03
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： NAKANISHI MASAYUKI , ISHII YU , NAKAMURA KENRO
IPC分类号： H01L21/304 , B24B9/06 , B24B21/00
CPC分类号： B24B9/065 , B24B21/002
摘要： PROBLEM TO BE SOLVED: To provide a substrate processing device which is capable of effectively removing surface roughness in the periphery of a substrate or a film which adheres to the periphery or the like of the substrate to become a pollution source in a process of manufacturing a semiconductor device. SOLUTION: The substrate processing device performs a process of pressing a polishing tape 21 on the prescribed spot of the substrate W and polishing the substrate W by sliding the tape 21 on the substrate W. The substrate processing device is equipped with a polishing unit 10 which is provided with an edge polishing unit 20 that polishes the edge E of the substrate W pressing the polishing tape 21 against the edge E, and a beveled part polishing unit 40 that polishes the beveled part B of the substrate W pressing the polishing tape 21 against the beveled part B. COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：提供一种基板处理装置，该基板处理装置能够有效地去除基板周围的表面粗糙度或附着在基板的周围等的膜，从而成为过程中的污染源制造半导体器件。＆lt; P＆gt;解决方案：基板处理装置执行将基板W的规定点上的研磨带21按压的处理，并通过滑动基板W上的带21来研磨基板W.基板处理装置配备有抛光单元10设置有边缘抛光单元20，该边缘抛光单元20抛光将抛光带21压靠边缘E的基板W的边缘E;以及倾斜部分抛光单元40，其对基板W的倾斜部分B进行抛光，带21对着斜面部分B.版权所有（C）2004，JPO＆NCIPI

7. 发明专利

JP2014124731A Polishing device and polishing method 有权
标题翻译：抛光装置和抛光方法
公开(公告)号：JP2014124731A
公开(公告)日：2014-07-07
申请号：JP2012284232
申请日：2012-12-27
申请人： Ebara Corp , 株式会社荏原製作所
发明人： NAKANISHI MASAYUKI , KODERA KENJI , YANAKA NOBUHIRO
IPC分类号： B24B55/02 , B24B9/00 , H01L21/304
CPC分类号： H01L21/304 , B24B9/065 , B24B9/08 , B24B37/02 , B24B57/02 , H01L21/02057 , H01L21/02087
摘要： PROBLEM TO BE SOLVED: To provide a polishing device and polishing method capable of preventing particles on a rear surface of a substrate from moving to a front surface of the substrate.SOLUTION: A polishing device 100 comprises a holding stage 4 for holding a central part of a rear surface of a substrate W, a motor M1 for rotating the holding stage 4, a front surface nozzle 36 for supplying a rinse liquid to a front surface of the substrate W in a state that the holding stage 4 is rotated by the motor M1, a rear surface nozzle 37 for supplying the rinse liquid to the rear surface of the substrate W in a state that the holding stage 4 is rotated, a rinse liquid control unit 110 for supplying the rinse liquid from the rear surface nozzle 37 when a predetermined time is elapsed after the rinse liquid is supplied from the front surface nozzle 36, and a polishing head assembly 1A for polishing a peripheral part of the substrate W disposed on the holding stage 4 after the rinse liquid is supplied to the substrate W by the rinse liquid control unit 110.
摘要翻译：要解决的问题：提供一种能够防止基板的后表面上的颗粒移动到基板的前表面的抛光装置和抛光方法。抛光装置100包括：保持台4，用于保持基板的中心部分基板W的后表面，用于旋转保持台4的电动机M1，用于在保持台4由电动机旋转的状态下将冲洗液供给到基板W的前表面的前表面喷嘴36 M1，用于在保持台4旋转的状态下将冲洗液体供给到基板W的后表面的后表面喷嘴37，当用于从后表面喷嘴37提供冲洗液体的冲洗液体控制单元110 在从前表面喷嘴36供给冲洗液之后经过预定时间，以及在冲洗液为su后，在配置在保持台4上的基板W的周边部分进行研磨的研磨头组件1A 通过冲洗液体控制单元110浸入基材W。

8. 发明专利

JP2010141218A Bevel shape of wafer managing method 审中-公开
标题翻译： WAFER管理方法的水平形状
公开(公告)号：JP2010141218A
公开(公告)日：2010-06-24
申请号：JP2008317821
申请日：2008-12-15
申请人： Ebara Corp , 株式会社荏原製作所
发明人： NAKANISHI MASAYUKI , KODERA KENJI
IPC分类号： H01L21/304 , B24B9/00 , B24B21/00
摘要： PROBLEM TO BE SOLVED: To provide a method for controlling the shape of a bevel portion of a wafer, minimizing deformation of a retainer ring during a CMP step. SOLUTION: In the method for controlling the shape of a bevel portion, the bevel portion of a wafer W is polished to form a flat end face B1 before polishing the wafer W using a CMP device. Deformation of a retainer ring of the CMP device by the wafer W is prevented thereby. Here, a width D of the end face B1 is preferred to be within 200-500 μm. As a means for forming the end face B1, a bevel polishing device which uses a polishing tape or the like is employed. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于控制晶片的斜面部分的形状的方法，使CMP步骤期间保持环的变形最小化。解决方案：在用于控制斜面部分形状的方法中，使用CMP装置对晶片W进行研磨之前，抛光晶片W的斜面部分以形成平坦端面B1。因此防止了由晶片W造成的CMP装置的保持环的变形。这里，端面B1的宽度D优选在200〜500μm之间。作为形成端面B1的手段，采用使用研磨带等的斜面研磨装置。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2008042220A Method and apparatus for processing substrate 审中-公开
标题翻译：用于处理基板的方法和装置
公开(公告)号：JP2008042220A
公开(公告)日：2008-02-21
申请号：JP2007246720
申请日：2007-09-25
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： ISHII YU , NAKANISHI MASAYUKI , NAKAMURA KENRO
IPC分类号： H01L21/304 , B24B21/02 , B24B49/12
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for processing a substrate to effectively remove surface coarseness generated around a circumferential part or the like of the substrate and a film adhering to the circumferential part or the like of the substrate and becoming a source of contaminant, in a manufacturing step of a semiconductor apparatus or the like. SOLUTION: A bevel part and an edge part of the substrate are polished with a polishing film 22 after a CMP step. Projections and depressions of the bevel part are measured by applying set shape and set intensity of light from a normal direction to a device forming surface of the substrate onto a part of the substrate bevel part where a polishing head is not positioned and by measuring dispersed light, thus a finishing point of the polishing is detected based on the measurement. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于处理基板的方法和装置，以有效地去除基板周围部分等周围产生的表面粗糙度和附着到基板的圆周部分等的膜，以及在半导体装置等的制造工序中成为污染源。解决方案：在CMP步骤之后，用抛光膜22抛光衬底的斜面部分和边缘部分。通过将设定的形状和从正常方向的光强度设置到基板的装置形成表面的设备的形状和抛光头未被定位的基板斜面部分的一部分上，并且通过测量分散的光来测量斜面部分的突出和凹陷因此基于测量来检测抛光的最终点。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2012213849A Polishing device and polishing method 有权
标题翻译：抛光装置和抛光方法
公开(公告)号：JP2012213849A
公开(公告)日：2012-11-08
申请号：JP2011247228
申请日：2011-11-11
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SEKI MASAYA , TOGAWA TETSUJI , NAKANISHI MASAYUKI , MATSUDA NAOKI , YOSHIDA ATSUSHI
IPC分类号： B24B21/00 , B24B9/00 , H01L21/304
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/006 , B24B21/008 , B24B21/20
摘要： PROBLEM TO BE SOLVED: To provide a polishing device that can form a perpendicular cross section by polishing the periphery of a substrate.SOLUTION: A polishing unit 25 comprises: a polishing head 50 having a pressing member which presses a polishing tape 38 to the periphery of the substrate W from above; a tape supply collection mechanism 70 which supplies the polishing tape 38 to the polishing head 50 and collects the polishing tape 38 from the polishing head; first moving mechanisms 42A, 43A and 40A which move the polishing head 50 to the radial direction of the substrate W; and second moving mechanisms 42B, 43B and 40B which moves the tape supply collection mechanism 70 to the radial direction of the substrate W. Guide rollers 84D, 84E are arranged so that the polishing tape 38 extends in parallel with the tangent direction of the substrate W and the polishing face of the polishing tape 38 is parallel with the surface of the substrate W.
摘要翻译：要解决的问题：提供通过抛光衬底的周边可以形成垂直横截面的抛光装置。抛光单元25包括：抛光头50，具有从上方将研磨带38按压到基板W周边的按压部件; 磁带供给收集机构70，其将研磨带38供给到研磨头50，并从抛光头收集研磨带38; 将抛光头50移动到基板W的径向的第一移动机构42A，43A和40A; 以及使带供给收集机构70向基板W的径向移动的第二移动机构42B，43B，40B。引导辊84D，84E配置成使抛光带38与基板W的切线方向平行地延伸抛光带38的研磨面与基板W的表面平行。（C）2013，JPO＆INPIT

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