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    • 2. 发明申请
    • DELIVERY DEVICE FOR DEPOSITION
    • 递送装置用于沉积
    • WO2009042145A3
    • 2009-08-20
    • PCT/US2008011063
    • 2008-09-24
    • EASTMAN KODAK COKERR ROGER STANLEYLEVY DAVID HOWARDMURRAY JAMES T
    • KERR ROGER STANLEYLEVY DAVID HOWARDMURRAY JAMES T
    • C23C16/455
    • B05B1/005C23C16/45551C23C16/45574Y10T29/494Y10T29/49432Y10T29/49826Y10T137/0318Y10T137/87249
    • A delivery device for thin-film material deposition has at least first, second, and third inlet ports for receiving a common supply for a first, a second and a third gaseous material, respectively. Each of the first, second, and third elongated emissive channels allow gaseous fluid communication with one of corresponding first, second, and third inlet ports. The delivery device can be formed from apertured plates (220. 230), superposed to define a network of interconnecting supply chambers and directing channels for routing each of the gaseous materials from its corresponding inlet port to a corresponding plurality of elongated emissive channels. The delivery device comprises a diffusing channel formed by a relief pattern between facing plates. Also disclosed is a process for thin film deposition. Finally, more generally, a flow diffuser and a corresponding method of diffusing flow is disclosed.
    • 用于薄膜材料沉积的递送装置具有至少第一,第二和第三入口端口,用于分别接收第一,第二和第三气态材料的共同供应。 第一,第二和第三细长发射通道中的每一个允许与对应的第一,第二和第三入口端口之一的气态流体连通。 输送装置可以由多孔板(220,230)形成,叠加以限定互连供应室的网络并且引导通道,用于将每个气态材料从其相应的入口端口路由到相应的多个细长的发射通道。 输送装置包括由相对板之间的浮雕图案形成的扩散通道。 还公开了一种用于薄膜沉积的方法。 最后,更一般地,公开了一种流扩散器和相应的扩散流的方法。
    • 6. 发明申请
    • PROCESS FOR ATOMIC LAYER DEPOSITION
    • 原子层沉积过程
    • WO2007126585A3
    • 2008-04-24
    • PCT/US2007006415
    • 2007-03-14
    • EASTMAN KODAK COLEVY DAVID HOWARD
    • LEVY DAVID HOWARD
    • C23C16/455
    • C23C16/545B33Y80/00C23C16/403C23C16/407C23C16/45504C23C16/45519C23C16/45551C23C16/45591
    • The present invention relates to a deposition process for thin film deposition onto a substrate comprising providing a plurality of gaseous materials comprising at least first, second, and third gaseous materials, wherein the first and second gaseous materials are reactive with each other such that when one of the first or second gaseous materials are on the surface of the substrate the other of the first or second gaseous materials will react to deposit a layer of material on the substrate and wherein the third gaseous material is inert with respect to reacting with the first or second gaseous materials. The process comprises flowing the gaseous materials along the length direction of a plurality of elongated channels across the surface of the substrate surface in close proximity thereto.
    • 本发明涉及一种用于薄膜沉积到衬底上的沉积工艺,包括提供至少包括第一,第二和第三气态材料的多种气态材料,其中第一和第二气态材料彼此反应,使得当一个 第一或第二气体材料的第一或第二气体材料在基材的表面上,另一个第一或第二气态材料将反应以在基材上沉积一层材料,并且其中第三气态材料相对于与第一或第二气态材料反应 第二种气态物质。 该方法包括使气态材料沿多个细长通道的长度方向流过基板表面的紧邻其表面。
    • 10. 发明申请
    • APPARATUS FOR ATOMIC LAYER DEPOSITION
    • 用于原子层沉积的装置
    • WO2007126582A3
    • 2007-12-21
    • PCT/US2007006390
    • 2007-03-14
    • EASTMAN KODAK COLEVY DAVID HOWARD
    • LEVY DAVID HOWARD
    • C23C16/54C23C16/455
    • H01L29/76C23C16/45525C23C16/45551C23C16/45563C23C16/45574C23C16/45595C23C16/545
    • The present invention provides a distribution manifold (10) for thin-film material deposition onto a substrate (20) comprising a plurality of inlet ports (18) for a sequence of gaseous materials, an output face comprising a plurality of open elongated output channels (12), each channel extending in a length direction substantially in parallel. The distribution manifold (10) can be employed in a deposition system for thin film deposition, further comprising a plurality of sources for a plurality of gaseous materials and a support for positioning a substrate in pre-designed close proximity to the output face of the distribution manifold (10). During operation of the system, relative movement between the output face and the substrate support is accomplished.
    • 本发明提供了一种用于薄膜材料沉积到基底(20)上的分配歧管(10),其包括用于一系列气态材料的多个入口(18),输出面包括多个开放的细长输出通道 12),每个通道在长度方向上基本平行地延伸。 分配歧管(10)可以用于薄膜沉积的沉积系统中,还包括用于多种气态材料的多个源和用于将预定设计的基板定位成靠近分布的输出面的支撑件 歧管(10)。 在系统操作期间,完成输出面和基板支撑件之间的相对运动。