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1. 发明授权

US06866094B2 Temperature-controlled chuck with recovery of circulating temperature control fluid 失效
标题翻译：温度控制卡盘回收循环温度控制液
公开(公告)号：US06866094B2
公开(公告)日：2005-03-15
申请号：US09858185
申请日：2001-05-15
申请人： Shawn M. Cousineau , Robert D. Kelso , Douglas S. Olsen , David Stura
发明人： Shawn M. Cousineau , Robert D. Kelso , Douglas S. Olsen , David Stura
IPC分类号： F25D17/02 , B23Q11/12 , B23Q11/14 , F25B9/00 , F25B39/02 , F25B41/00 , F25B41/04 , F28F9/22 , F28F27/00 , F28F27/02 , G01R31/28 , H01L21/00 , H01L21/02 , H01L21/66 , H01L21/683 , H01L21/687 , B23Q3/08 , F25B29/00 , H01L21/68
CPC分类号： H01L21/687 , B23Q11/126 , B23Q11/127 , B23Q11/141 , B23Q11/143 , F25B9/002 , F25B39/028 , F25B41/04 , F28D2021/0077 , F28F9/028 , F28F27/00 , G01R31/2831 , G01R31/2865 , G01R31/2874 , G01R31/2891 , H01L21/67103 , H01L21/67248
摘要： A system and method for controlling temperature in a workpiece chuck are described. A fluid circulation system circulates a temperature control fluid, such as an engineered HFE fluid, through te workpiece chuck. A fluid recovery system coupled to the fluid circulation system recovers a portion of the temperature control fluid from the fluid circulation system by circulating a gas through the fluid circulation system including fluid tubes and fluid passages in the chuck. The gas, which can be air, carries a portion of residual or excess fluid through the fluid circulation system as it is circulated. The residual fluid is carried back to a reservoir such that it can continue to be used to control temperature of the chuck. Where gas and temperature control fluid vapors are displaced from the reservoir, they are routed through a suction line heat exchanger which condenses the vapor. The gas and condensed fluid are separated in a fluid separator. The separated fluid is returned to the reservoir, and the separated air can be vented to the atmosphere.
摘要翻译：描述用于控制工件卡盘中的温度的系统和方法。流体循环系统通过工件卡盘将温度控制流体（例如工程HFE流体）循环。连接到流体循环系统的流体回收系统通过使气体循环通过包括流体管和卡盘中的流体通道的流体循环系统来回收来自流体循环系统的温度控制流体的一部分。当气体循环时，可以是空气的气体携带一部分剩余或过剩的液体通过流体循环系统。剩余流体被运送到储存器，使得其可以继续用于控制卡盘的温度。当气体和温度控制流体蒸气从储存器移位时，它们被引导通过冷凝蒸汽的吸入管线热交换器。气体和冷凝流体在流体分离器中分离。分离的流体返回到储存器，并且分离的空气可以排放到大气中。

2. 发明授权

US06545494B1 Apparatus and method for controlling temperature in a wafer using integrated temperature sensitive diode 有权
标题翻译：使用集成温度敏感二极管控制晶片温度的装置和方法
公开(公告)号：US06545494B1
公开(公告)日：2003-04-08
申请号：US09612667
申请日：2000-07-10
申请人： Douglas S. Olsen , David Stura
发明人： Douglas S. Olsen , David Stura
IPC分类号： G01R3102
CPC分类号： G05D23/20 , G01R31/2891 , G05D23/1934
摘要： An apparatus and method for controlling temperature in a wafer on a wafer chuck includes a temperature sensing device, such as a temperature sensitive diode, integrally formed in the wafer. A sensing circuit senses a signal from the diode indicative of temperature of the wafer. The sensing circuit can be part of a testing circuit in a wafer prober being used to test integrated circuits on the wafer. The sensing circuit sends a control signal to a temperature control system used to control the temperature of the chuck. In response to the control signal, the temperature control system controls the temperature of the chuck at a desired temperature to control the temperature of the wafer. The wafer can include multiple integrated circuit die, and each circuit can include its own temperature sensing diode. As a result, extremely accurate and individualized temperature testing can be performed on each integrated circuit on the wafer.
摘要翻译：用于控制晶片卡盘上的晶片温度的装置和方法包括一体地形成在晶片中的诸如温度敏感二极管的温度感测装置。感测电路感测来自二极管的指示晶片温度的信号。感测电路可以是用于测试晶片上的集成电路的晶圆探测器中的测试电路的一部分。感测电路将控制信号发送到用于控制卡盘温度的温度控制系统。响应于控制信号，温度控制系统将卡盘的温度控制在期望的温度以控制晶片的温度。晶片可以包括多个集成电路管芯，并且每个电路可以包括其自己的温度感测二极管。因此，可以对晶片上的每个集成电路进行非常精确和个性化的温度测试。

3. 发明授权

US06552561B2 Apparatus and method for controlling temperature in a device under test using integrated temperature sensitive diode 有权
公开(公告)号：US06552561B2
公开(公告)日：2003-04-22
申请号：US09839274
申请日：2001-04-20
申请人： Douglas S. Olsen , David Stura
发明人： Douglas S. Olsen , David Stura
IPC分类号： G01R3102
CPC分类号： G05D23/20 , G01R31/2891 , G05D23/1934
摘要： An apparatus and method for controlling temperature in a device under test (DUT) having an integrated circuit chip die includes a temperature sensing device, such as a temperature sensitive diode, integrally formed in the chip die. A sensing circuit senses a signal from the diode indicative of temperature of the chip die. The sensing circuit can be part of a testing circuit in a system being used to test the DUT. The sensing circuit sends a control signal to a temperature control system used to control the temperature of a DUT temperature control medium. The temperature control medium can be, for example, a stream of temperature-controlled air directed onto the package of the DUT. In response to the control signal, the temperature control system controls the temperature of the air at a desired temperature to control the temperature of the DUT.

4. 发明申请

US20080087315A1 Thermoelectric Fan for Radiation-Based Heaters, and Methods Related Thereto 审中-公开
标题翻译：用于辐射加热器的热电风扇及其相关方法
公开(公告)号：US20080087315A1
公开(公告)日：2008-04-17
申请号：US11871926
申请日：2007-10-12
申请人： Glenn I. Deming , Timothy R. Membrino , Roger Wood , Douglas S. Olsen , Kang P. Lee , S. Ronald Wysk
发明人： Glenn I. Deming , Timothy R. Membrino , Roger Wood , Douglas S. Olsen , Kang P. Lee , S. Ronald Wysk
IPC分类号： H01L35/28 , B23P15/26 , F01D5/18 , F25B21/02
CPC分类号： H01L35/00 , F04D25/02 , F04D25/0606 , F24F5/0042 , F24F7/007 , Y10T29/49245
摘要： Disclosed is a thermoelectric fan for use with radiant heaters, particularly catalytic heaters. The thermoelectric fan of the present invention comprises a housing sub-assembly coupled to a thermal plate sub-assembly, the housing sub-assembly comprising a shrouded circulating air moving member, such as a fan blade, powered solely by the conversion of heat from a separate heater into electricity via an integrated thermoelectric module. Also disclosed is a self-powered fan that can safely perform in hazardous atmospheres while converting radiant heat to circulate air. The thermoelectric fan of the present invention ensures that the air within the space to be heated is more effectively distributed and temperature gradients are minimized. Also disclosed are methods for assembling, installing and safe operation of the thermoelectric fan.
摘要翻译：公开了一种用于辐射加热器，特别是催化加热器的热电风扇。本发明的热电风扇包括联接到热板子组件的壳体子组件，该壳体子组件包括被覆盖的循环空气移动构件，例如风扇叶片，其仅通过从通过集成的热电模块将加热器分成电。还公开了一种自动风扇，其可以在将辐射热转化为空气循环的同时在危险环境中安全地执行。本发明的热电风扇确保待加热空间内的空气更有效地分布并使温度梯度最小化。还公开了用于组装，安装和安全运行热电风扇的方法。

5. 发明授权

US06969830B2 Wafer chuck having thermal plate with interleaved heating and cooling elements 失效
标题翻译：晶圆卡盘具有带有交错加热和冷却元件的热板
公开(公告)号：US06969830B2
公开(公告)日：2005-11-29
申请号：US10465716
申请日：2003-06-19
申请人： Kenneth M. Cole, Sr. , William M. Stone , Douglas S. Olsen
发明人： Kenneth M. Cole, Sr. , William M. Stone , Douglas S. Olsen
IPC分类号： H05B3/18 , C23C16/00 , G01R31/28 , H01L21/00 , H01L21/02 , H01L21/66 , H01L21/683 , H01L21/687 , H05B3/70 , H01B3/68 , C27C16/00
CPC分类号： H01L21/67109 , G01R31/2891 , H01L21/67103 , H01L21/68785
摘要： A workpiece chuck includes a thermal plate assembly which includes both heating and cooling capability. The heating element can be a resistive heater in a coiled configuration disposed in a plane. The cooling can be performed via a cooling fluid circulated through cooling tubes which are also disposed in a coiled configuration in a plane. The plane of the heating element and the cooling tubes can be the same plane, and that plane can be a center plane of the thermal plate assembly. By locating the heating and cooling in the same plane, uniform heating and cooling are achieved. Also, by locating the heating element and cooling tubes in the center of the thermal plate, distortions such as doming and dishing in the thermal plate are eliminated such that the wafer can be held extremely flat on the chuck. The heating element and cooling tubes are coiled in an interleaved fashion to provide uniform heating and cooling while allowing them to simultaneously occupy the same plane.
摘要翻译：工件卡盘包括包括加热和冷却能力的热板组件。加热元件可以是布置在平面中的盘绕构造的电阻加热器。冷却可以通过冷却管循环的冷却流体进行，冷却管也被设置在平面内的盘绕结构中。加热元件和冷却管的平面可以是相同的平面，并且该平面可以是热板组件的中心平面。通过将加热和冷却定位在同一平面上，实现均匀的加热和冷却。此外，通过将加热元件和冷却管定位在热板的中心，消除了热板中的翘曲和凹陷等变形，使得晶片能够在卡盘上保持非常平坦。加热元件和冷却管以交错方式盘绕，以提供均匀的加热和冷却，同时允许它们同时占据同一平面。

6. 发明授权

US06700099B2 Wafer chuck having thermal plate with interleaved heating and cooling elements, interchangeable top surface assemblies and hard coated layer surfaces 失效
标题翻译：晶片卡盘具有带有交错加热和冷却元件的热板，可互换的顶表面组件和硬涂层表面
公开(公告)号：US06700099B2
公开(公告)日：2004-03-02
申请号：US09900285
申请日：2001-07-06
申请人： Kenneth M. Cole, Sr. , William M. Stone , Douglas S. Olsen
发明人： Kenneth M. Cole, Sr. , William M. Stone , Douglas S. Olsen
IPC分类号： H01B368
CPC分类号： H01L21/67109 , G01R31/2891 , H01L21/67103 , H01L21/68785
摘要： A workpiece chuck to support a semiconductor wafer during processing includes a thermal plate assembly which includes both heating and cooling capability. The heating element can be a resistive heater in a coiled configuration disposed in a plane. The cooling can be performed via a cooling fluid circulated through cooling tubes which are also disposed in a coiled configuration in a plane. The plane of the heating element and the cooling tubes can be the same plane, and that plane can be a center plane of the thermal plate assembly. The heating element and cooling tubes are coiled in an interleaved fashion to provide uniform heating and cooling while allowing them to simultaneously occupy the same plane. The thermal plate assembly can include a housing made of a cast material such as aluminum. The chuck also provides for interchangeable top surface assemblies used to support the workpiece chuck.
摘要翻译：在加工过程中支撑半导体晶片的工件卡盘包括包括加热和冷却能力的热板组件。加热元件可以是布置在平面中的盘绕构造的电阻加热器。冷却可以通过冷却管循环的冷却流体进行，冷却管也被设置在平面内的盘绕结构中。加热元件和冷却管的平面可以是相同的平面，并且该平面可以是热板组件的中心平面。加热元件和冷却管以交错方式盘绕，以提供均匀的加热和冷却，同时允许它们同时占据同一平面。热板组件可以包括由诸如铝的铸造材料制成的壳体。卡盘还提供用于支撑工件卡盘的可互换的顶面组件。

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