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1. 发明申请

US20100043485A1 TEMPERATURE-CONTROLLED ENCLOSURES AND TEMPERATURE CONTROL SYSTEM USING THE SAME 有权
标题翻译：使用温度控制的外壳和温度控制系统
公开(公告)号：US20100043485A1
公开(公告)日：2010-02-25
申请号：US12612028
申请日：2009-11-04
申请人： Kenneth M. Cole, SR. , Michael F. Conroy , Edward Lowerre , James Pelrin
发明人： Kenneth M. Cole, SR. , Michael F. Conroy , Edward Lowerre , James Pelrin
IPC分类号： F25D11/00
CPC分类号： F25D23/061 , B01L1/00 , B01L7/00 , B01L2200/147 , B01L2300/1838 , G01M99/002 , Y10T16/063
摘要： A temperature chamber in which a device is tested is connected to a temperature-controlled air source for controlling temperature of the chamber. The temperature chamber includes thermal insulation formed on side surfaces of the chamber. A universal manifold adaptor for directing the temperature-controlled air directly to a device being tested is connected to the chamber. The temperature chamber also includes an exhaust system. A self-closing cable feed-through module is connected to an outer surface of the chamber. The feed-through module includes a first portion and a second portion, wherein cables are fed through the first and second portions into the chamber in a first position and the first and second portions form a leak tight seal around the cables in a second position.
摘要翻译：将测试装置的温度室连接到温度控制的空气源，以控制室的温度。温度室包括形成在室的侧表面上的绝热。用于将温度控制的空气直接引导到被测试的设备的通用歧管接头连接到腔室。温度室还包括排气系统。自闭式电缆馈通模块连接到腔室的外表面。馈通模块包括第一部分和第二部分，其中电缆在第一位置通过第一和第二部分进入腔室，并且第一和第二部分在第二位置围绕电缆形成泄漏密封。

2. 发明授权

US6019164A Workpiece chuck 失效
公开(公告)号：US6019164A
公开(公告)日：2000-02-01
申请号：US115206
申请日：1998-07-14
申请人： Paul A. Getchel , Kenneth M. Cole, Sr. , Henry A. Lyden , William M. Stone , Robert Lopez , Thomas Schey , Dana G. Butcher
发明人： Paul A. Getchel , Kenneth M. Cole, Sr. , Henry A. Lyden , William M. Stone , Robert Lopez , Thomas Schey , Dana G. Butcher
IPC分类号： H01L21/66 , B25B11/00 , C25D9/02 , F28F7/00 , H01L20060101 , H01L21/68 , H01L21/683 , H01L21/687
CPC分类号： H01L21/68785 , H01L21/67103 , H01L21/68792 , Y10S269/903 , Y10T279/11
摘要： A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects, such that mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated. A plurality of support members including inclined surfaces provided between an upper and lower portion of the chuck maintain the top surface of the chuck and any workpiece mounted thereon at a constant height over temperature.

3. 发明授权

US06700099B2 Wafer chuck having thermal plate with interleaved heating and cooling elements, interchangeable top surface assemblies and hard coated layer surfaces 失效
标题翻译：晶片卡盘具有带有交错加热和冷却元件的热板，可互换的顶表面组件和硬涂层表面
公开(公告)号：US06700099B2
公开(公告)日：2004-03-02
申请号：US09900285
申请日：2001-07-06
申请人： Kenneth M. Cole, Sr. , William M. Stone , Douglas S. Olsen
发明人： Kenneth M. Cole, Sr. , William M. Stone , Douglas S. Olsen
IPC分类号： H01B368
CPC分类号： H01L21/67109 , G01R31/2891 , H01L21/67103 , H01L21/68785
摘要： A workpiece chuck to support a semiconductor wafer during processing includes a thermal plate assembly which includes both heating and cooling capability. The heating element can be a resistive heater in a coiled configuration disposed in a plane. The cooling can be performed via a cooling fluid circulated through cooling tubes which are also disposed in a coiled configuration in a plane. The plane of the heating element and the cooling tubes can be the same plane, and that plane can be a center plane of the thermal plate assembly. The heating element and cooling tubes are coiled in an interleaved fashion to provide uniform heating and cooling while allowing them to simultaneously occupy the same plane. The thermal plate assembly can include a housing made of a cast material such as aluminum. The chuck also provides for interchangeable top surface assemblies used to support the workpiece chuck.
摘要翻译：在加工过程中支撑半导体晶片的工件卡盘包括包括加热和冷却能力的热板组件。加热元件可以是布置在平面中的盘绕构造的电阻加热器。冷却可以通过冷却管循环的冷却流体进行，冷却管也被设置在平面内的盘绕结构中。加热元件和冷却管的平面可以是相同的平面，并且该平面可以是热板组件的中心平面。加热元件和冷却管以交错方式盘绕，以提供均匀的加热和冷却，同时允许它们同时占据同一平面。热板组件可以包括由诸如铝的铸造材料制成的壳体。卡盘还提供用于支撑工件卡盘的可互换的顶面组件。

4. 发明授权

US06375176B1 Workpiece chuck with guard layer having vacuum distribution pattern 失效
标题翻译：工件卡盘，带保护层，具有真空分布图案
公开(公告)号：US06375176B1
公开(公告)日：2002-04-23
申请号：US09464998
申请日：1999-12-16
申请人： Paul A. Getchel , Kenneth M. Cole, Sr. , Henry A. Lyden , William M. Stone , Robert Lopez , Thomas Schey , Dana G. Butcher
发明人： Paul A. Getchel , Kenneth M. Cole, Sr. , Henry A. Lyden , William M. Stone , Robert Lopez , Thomas Schey , Dana G. Butcher
IPC分类号： B25B1100
CPC分类号： H01L21/68785 , H01L21/67103 , H01L21/68792 , Y10S269/903 , Y10T279/11
摘要： A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects, such that mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated. A plurality of support members including inclined surfaces provided between an upper and lower portion of the chuck maintain the top surface of the chuck and any workpiece mounted thereon at a constant height over temperature.
摘要翻译：工件卡盘包括上部组件，其上可以安装诸如半导体晶片的平坦工件。下部组件可安装到支撑卡盘的基座上。施加到卡盘上的非限制性附接装置例如真空，弹簧或弹性垫圈将上部组件固定到下部组件，下部组件固定到基部并且可以将晶片保持在上部组件的顶部表面。通过非约束装置将卡盘夹在一起，卡盘层可以在由温度效应引起的膨胀力下彼此连续移动，从而基本上消除了卡盘上的机械应力以及卡盘和工件在温度下的变形。包括设置在卡盘的上部和下部之间的倾斜表面的多个支撑构件保持卡盘的顶表面和安装在其上的任何工件，其温度恒定高度。

5. 发明授权

US08408020B2 Temperature-controlled enclosures and temperature control system using the same 有权
标题翻译：温控柜和温控系统采用相同的
公开(公告)号：US08408020B2
公开(公告)日：2013-04-02
申请号：US12612028
申请日：2009-11-04
申请人： Kenneth M. Cole, Sr. , Michael F. Conroy , Edward Lowerre , James Pelrin
发明人： Kenneth M. Cole, Sr. , Michael F. Conroy , Edward Lowerre , James Pelrin
IPC分类号： F25D23/12 , F25D11/00 , F25D17/04 , F25D17/08 , H05K7/20 , G01N15/00 , G01K1/00 , F16L5/02 , F16L17/06
CPC分类号： F25D23/061 , B01L1/00 , B01L7/00 , B01L2200/147 , B01L2300/1838 , G01M99/002 , Y10T16/063
摘要： A temperature chamber in which a device is tested is connected to a temperature-controlled air source for controlling temperature of the chamber. The temperature chamber includes thermal insulation formed on side surfaces of the chamber. A universal manifold adaptor for directing the temperature-controlled air directly to a device being tested is connected to the chamber. The temperature chamber also includes an exhaust system. A self-closing cable feed-through module is connected to an outer surface of the chamber. The feed-through module includes a first portion and a second portion, wherein cables are fed through the first and second portions into the chamber in a first position and the first and second portions form a leak tight seal around the cables in a second position.
摘要翻译：将测试装置的温度室连接到温度控制的空气源，以控制室的温度。温度室包括形成在室的侧表面上的绝热。用于将温度控制的空气直接引导到被测试的设备的通用歧管接头连接到腔室。温度室还包括排气系统。自闭式电缆馈通模块连接到腔室的外表面。馈通模块包括第一部分和第二部分，其中电缆在第一位置通过第一和第二部分进入腔室，并且第一和第二部分在第二位置围绕电缆形成泄漏密封。

6. 发明授权

US07629533B2 Temperature-controlled enclosures and temperature control system using the same 有权
标题翻译：温控柜和温控系统采用相同的
公开(公告)号：US07629533B2
公开(公告)日：2009-12-08
申请号：US11717432
申请日：2007-03-13
申请人： Kenneth M. Cole, Sr. , Michael F. Conroy , Edward Lowerre , James Pelrin
发明人： Kenneth M. Cole, Sr. , Michael F. Conroy , Edward Lowerre , James Pelrin
IPC分类号： H05K5/06
CPC分类号： F25D23/061 , B01L1/00 , B01L7/00 , B01L2200/147 , B01L2300/1838 , G01M99/002 , Y10T16/063
摘要： A self-closing cable feed-through module is connected to an outer surface of the chamber. The feed-through module includes a first portion and a second portion, wherein cables are fed through the first and second portions into the chamber in a first position and the first and second portions form a leak tight seal around the cables in a second position.
摘要翻译：自闭式电缆馈通模块连接到腔室的外表面。馈通模块包括第一部分和第二部分，其中电缆在第一位置通过第一和第二部分进入腔室，并且第一和第二部分在第二位置围绕电缆形成泄漏密封。

7. 发明授权

US06969830B2 Wafer chuck having thermal plate with interleaved heating and cooling elements 失效
标题翻译：晶圆卡盘具有带有交错加热和冷却元件的热板
公开(公告)号：US06969830B2
公开(公告)日：2005-11-29
申请号：US10465716
申请日：2003-06-19
申请人： Kenneth M. Cole, Sr. , William M. Stone , Douglas S. Olsen
发明人： Kenneth M. Cole, Sr. , William M. Stone , Douglas S. Olsen
IPC分类号： H05B3/18 , C23C16/00 , G01R31/28 , H01L21/00 , H01L21/02 , H01L21/66 , H01L21/683 , H01L21/687 , H05B3/70 , H01B3/68 , C27C16/00
CPC分类号： H01L21/67109 , G01R31/2891 , H01L21/67103 , H01L21/68785
摘要： A workpiece chuck includes a thermal plate assembly which includes both heating and cooling capability. The heating element can be a resistive heater in a coiled configuration disposed in a plane. The cooling can be performed via a cooling fluid circulated through cooling tubes which are also disposed in a coiled configuration in a plane. The plane of the heating element and the cooling tubes can be the same plane, and that plane can be a center plane of the thermal plate assembly. By locating the heating and cooling in the same plane, uniform heating and cooling are achieved. Also, by locating the heating element and cooling tubes in the center of the thermal plate, distortions such as doming and dishing in the thermal plate are eliminated such that the wafer can be held extremely flat on the chuck. The heating element and cooling tubes are coiled in an interleaved fashion to provide uniform heating and cooling while allowing them to simultaneously occupy the same plane.
摘要翻译：工件卡盘包括包括加热和冷却能力的热板组件。加热元件可以是布置在平面中的盘绕构造的电阻加热器。冷却可以通过冷却管循环的冷却流体进行，冷却管也被设置在平面内的盘绕结构中。加热元件和冷却管的平面可以是相同的平面，并且该平面可以是热板组件的中心平面。通过将加热和冷却定位在同一平面上，实现均匀的加热和冷却。此外，通过将加热元件和冷却管定位在热板的中心，消除了热板中的翘曲和凹陷等变形，使得晶片能够在卡盘上保持非常平坦。加热元件和冷却管以交错方式盘绕，以提供均匀的加热和冷却，同时允许它们同时占据同一平面。

8. 发明授权

US06540014B2 Workpiece chuck 失效
公开(公告)号：US06540014B2
公开(公告)日：2003-04-01
申请号：US09516000
申请日：2000-02-29
申请人： Paul A. Getchel , Kenneth M. Cole, Sr. , Henry A. Lyden
发明人： Paul A. Getchel , Kenneth M. Cole, Sr. , Henry A. Lyden
IPC分类号： F28F700
CPC分类号： H01L21/67103 , G01R1/0491 , H01L21/6838 , H01L21/68785 , Y10S269/903 , Y10T279/11
摘要： A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. A heater and a heat sink can be included in the bottom assembly to allow for temperature cycle testing of the wafer. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects. Mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated.

9. 发明授权

US06802368B2 Temperature control system for a workpiece chuck 失效
标题翻译：工件卡盘温度控制系统
公开(公告)号：US06802368B2
公开(公告)日：2004-10-12
申请号：US10052861
申请日：2002-01-16
申请人： Paul A. Getchel , Kenneth M. Cole, Sr. , Henry A. Lyden
发明人： Paul A. Getchel , Kenneth M. Cole, Sr. , Henry A. Lyden
IPC分类号： F25B2900
CPC分类号： G01R31/2874 , B23Q11/126 , B23Q11/141 , B23Q11/143 , F25B41/04 , F25B41/043 , G01R31/2831 , G01R31/2865 , G01R31/2891 , H01L21/67103 , H01L21/67248
摘要： A system for and method of controlling the temperature of a flat workpiece such as a semiconductor wafer are disclosed. The workpiece is mounted on a workpiece chuck which is mounted over a base between the chuck and a host machine such as a wafer prober used to test integrated circuits on a wafer. The chuck includes an upper portion on which the workpiece is mounted. The temperature of the upper portion of the chuck is controlled to control the temperature of the workpiece. The temperature of the base is controlled to reduce the amount of heat flow between the chuck and the host machine. A power and control system includes a switching power supply which provides power to system components including heaters in the chuck used to heat the workpiece. A series of filters removes electrical noise generated by the switching power supply such that low-noise operation is realized.
摘要翻译：公开了一种用于控制诸如半导体晶片的平坦工件的温度的系统和方法。工件安装在工件卡盘上，工件卡盘安装在卡盘和主机之间的基座上，例如用于测试晶片上的集成电路的晶片探测器。卡盘包括其上安装工件的上部。控制卡盘上部的温度来控制工件的温度。控制基座的温度以减少卡盘和主机之间的热流量。电力和控制系统包括向包括用于加热工件的卡盘中的加热器的系统部件提供电力的开关电源。一系列滤波器消除开关电源产生的电噪声，从而实现低噪声运行。

10. 发明授权

US06415858B1 Temperature control system for a workpiece chuck 失效
公开(公告)号：US06415858B1
公开(公告)日：2002-07-09
申请号：US09001887
申请日：1997-12-31
申请人： Paul A. Getchel , Kenneth M. Cole, Sr. , Henry A. Lyden
发明人： Paul A. Getchel , Kenneth M. Cole, Sr. , Henry A. Lyden
IPC分类号： F25B2900
CPC分类号： G01R31/2874 , B23Q11/126 , B23Q11/141 , B23Q11/143 , F25B41/04 , F25B41/043 , G01R31/2831 , G01R31/2865 , G01R31/2891 , H01L21/67103 , H01L21/67248
摘要： A system for and method of controlling the temperature of a flat workpiece such as a semiconductor wafer are disclosed. The workpiece is mounted on a workpiece chuck which is mounted over a base between the chuck and a host machine such as a wafer prober used to test integrated circuits on a wafer. The chuck includes an upper portion on which the workpiece is mounted. The temperature of the upper portion of the chuck is controlled to control the temperature of the workpiece. The temperature of the base is controlled to reduce the amount of heat flow between the chuck and the host machine. A power and control system includes a switching power supply which provides power to system components including heaters in the chuck used to heat the workpiece. A series of filters removes electrical noise generated by the switching power supply such that low-noise operation is realized.

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