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    • 3. 发明授权
    • Apparatus and method for controlling temperature in a wafer using integrated temperature sensitive diode
    • 使用集成温度敏感二极管控制晶片温度的装置和方法
    • US06545494B1
    • 2003-04-08
    • US09612667
    • 2000-07-10
    • Douglas S. OlsenDavid Stura
    • Douglas S. OlsenDavid Stura
    • G01R3102
    • G05D23/20G01R31/2891G05D23/1934
    • An apparatus and method for controlling temperature in a wafer on a wafer chuck includes a temperature sensing device, such as a temperature sensitive diode, integrally formed in the wafer. A sensing circuit senses a signal from the diode indicative of temperature of the wafer. The sensing circuit can be part of a testing circuit in a wafer prober being used to test integrated circuits on the wafer. The sensing circuit sends a control signal to a temperature control system used to control the temperature of the chuck. In response to the control signal, the temperature control system controls the temperature of the chuck at a desired temperature to control the temperature of the wafer. The wafer can include multiple integrated circuit die, and each circuit can include its own temperature sensing diode. As a result, extremely accurate and individualized temperature testing can be performed on each integrated circuit on the wafer.
    • 用于控制晶片卡盘上的晶片温度的装置和方法包括一体地形成在晶片中的诸如温度敏感二极管的温度感测装置。 感测电路感测来自二极管的指示晶片温度的信号。 感测电路可以是用于测试晶片上的集成电路的晶圆探测器中的测试电路的一部分。 感测电路将控制信号发送到用于控制卡盘温度的温度控制系统。 响应于控制信号,温度控制系统将卡盘的温度控制在期望的温度以控制晶片的温度。 晶片可以包括多个集成电路管芯,并且每个电路可以包括其自己的温度感测二极管。 因此,可以对晶片上的每个集成电路进行非常精确和个性化的温度测试。