专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06552561B2 Apparatus and method for controlling temperature in a device under test using integrated temperature sensitive diode 有权
公开(公告)号：US06552561B2
公开(公告)日：2003-04-22
申请号：US09839274
申请日：2001-04-20
申请人： Douglas S. Olsen , David Stura
发明人： Douglas S. Olsen , David Stura
IPC分类号： G01R3102
CPC分类号： G05D23/20 , G01R31/2891 , G05D23/1934
摘要： An apparatus and method for controlling temperature in a device under test (DUT) having an integrated circuit chip die includes a temperature sensing device, such as a temperature sensitive diode, integrally formed in the chip die. A sensing circuit senses a signal from the diode indicative of temperature of the chip die. The sensing circuit can be part of a testing circuit in a system being used to test the DUT. The sensing circuit sends a control signal to a temperature control system used to control the temperature of a DUT temperature control medium. The temperature control medium can be, for example, a stream of temperature-controlled air directed onto the package of the DUT. In response to the control signal, the temperature control system controls the temperature of the air at a desired temperature to control the temperature of the DUT.

2. 发明申请

US20050057676A1 System, method, and product for scanning of biological materials 有权
标题翻译：用于生物材料扫描的系统，方法和产品
公开(公告)号：US20050057676A1
公开(公告)日：2005-03-17
申请号：US10975788
申请日：2004-10-27
申请人： Nathan Weiner , Patrick Odoy , Eric Schultz , Mark Jones , James Overbeck , Herman Deweerd , David Stura , Albert Bukys , Tim Woolaver , Thomas Regan , David Bradbury , Eric McKenzie , Roger DiPaolo , Christopher Miles , Joel Katz , Ksenia Oleink-Ovod
发明人： Nathan Weiner , Patrick Odoy , Eric Schultz , Mark Jones , James Overbeck , Herman Deweerd , David Stura , Albert Bukys , Tim Woolaver , Thomas Regan , David Bradbury , Eric McKenzie , Roger DiPaolo , Christopher Miles , Joel Katz , Ksenia Oleink-Ovod
IPC分类号： G01N21/64 , G01N21/25 , G01N33/483 , G01N33/53 , G01N37/00 , G01J3/30
CPC分类号： G01N21/6428 , G01N21/253 , G01N21/6452 , G01N2021/6471
摘要： An embodiment of a scanning system is described including optical elements that direct an excitation beam at a probe array, detectors that receive reflected intensity data responsive to the excitation beam, where the reflected intensity data is responsive to a focusing distance between an optical element and the probe array, a transport frame that adjusts the focusing distance in a direction with respect to the probe array, an auto-focuser that determines a best plane of focus based upon characteristics of the reflected intensity data of at least two focusing distances where the detectors further receive pixel intensity values based upon detected emissions from a plurality of probe features disposed on the probe array at the best plane of focus, and an image generator that associates each of the pixel intensity values with at least one image pixel position of a probe array based upon one or more position correction values.
摘要翻译：描述了扫描系统的实施例，其包括将激发光束引导到探针阵列的光学元件，响应于激发光束接收反射光强数据的检测器，其中反射光强度数据响应于光学元件和探针阵列，调整相对于探针阵列的方向上的聚焦距离的传输框架，基于至少两个聚焦距离的反射强度数据的特性确定最佳聚焦距离的自动对焦器，其中检测器进一步基于在最佳焦点平面上设置在探针阵列上的多个探针特征的检测到的发射来接收像素强度值，以及图像生成器，其将每个像素强度值与探针阵列的至少一个图像像素位置相关联一个或多个位置校正值。

3. 发明授权

US06545494B1 Apparatus and method for controlling temperature in a wafer using integrated temperature sensitive diode 有权
标题翻译：使用集成温度敏感二极管控制晶片温度的装置和方法
公开(公告)号：US06545494B1
公开(公告)日：2003-04-08
申请号：US09612667
申请日：2000-07-10
申请人： Douglas S. Olsen , David Stura
发明人： Douglas S. Olsen , David Stura
IPC分类号： G01R3102
CPC分类号： G05D23/20 , G01R31/2891 , G05D23/1934
摘要： An apparatus and method for controlling temperature in a wafer on a wafer chuck includes a temperature sensing device, such as a temperature sensitive diode, integrally formed in the wafer. A sensing circuit senses a signal from the diode indicative of temperature of the wafer. The sensing circuit can be part of a testing circuit in a wafer prober being used to test integrated circuits on the wafer. The sensing circuit sends a control signal to a temperature control system used to control the temperature of the chuck. In response to the control signal, the temperature control system controls the temperature of the chuck at a desired temperature to control the temperature of the wafer. The wafer can include multiple integrated circuit die, and each circuit can include its own temperature sensing diode. As a result, extremely accurate and individualized temperature testing can be performed on each integrated circuit on the wafer.
摘要翻译：用于控制晶片卡盘上的晶片温度的装置和方法包括一体地形成在晶片中的诸如温度敏感二极管的温度感测装置。感测电路感测来自二极管的指示晶片温度的信号。感测电路可以是用于测试晶片上的集成电路的晶圆探测器中的测试电路的一部分。感测电路将控制信号发送到用于控制卡盘温度的温度控制系统。响应于控制信号，温度控制系统将卡盘的温度控制在期望的温度以控制晶片的温度。晶片可以包括多个集成电路管芯，并且每个电路可以包括其自己的温度感测二极管。因此，可以对晶片上的每个集成电路进行非常精确和个性化的温度测试。

4. 发明授权

US06866094B2 Temperature-controlled chuck with recovery of circulating temperature control fluid 失效
标题翻译：温度控制卡盘回收循环温度控制液
公开(公告)号：US06866094B2
公开(公告)日：2005-03-15
申请号：US09858185
申请日：2001-05-15
申请人： Shawn M. Cousineau , Robert D. Kelso , Douglas S. Olsen , David Stura
发明人： Shawn M. Cousineau , Robert D. Kelso , Douglas S. Olsen , David Stura
IPC分类号： F25D17/02 , B23Q11/12 , B23Q11/14 , F25B9/00 , F25B39/02 , F25B41/00 , F25B41/04 , F28F9/22 , F28F27/00 , F28F27/02 , G01R31/28 , H01L21/00 , H01L21/02 , H01L21/66 , H01L21/683 , H01L21/687 , B23Q3/08 , F25B29/00 , H01L21/68
CPC分类号： H01L21/687 , B23Q11/126 , B23Q11/127 , B23Q11/141 , B23Q11/143 , F25B9/002 , F25B39/028 , F25B41/04 , F28D2021/0077 , F28F9/028 , F28F27/00 , G01R31/2831 , G01R31/2865 , G01R31/2874 , G01R31/2891 , H01L21/67103 , H01L21/67248
摘要： A system and method for controlling temperature in a workpiece chuck are described. A fluid circulation system circulates a temperature control fluid, such as an engineered HFE fluid, through te workpiece chuck. A fluid recovery system coupled to the fluid circulation system recovers a portion of the temperature control fluid from the fluid circulation system by circulating a gas through the fluid circulation system including fluid tubes and fluid passages in the chuck. The gas, which can be air, carries a portion of residual or excess fluid through the fluid circulation system as it is circulated. The residual fluid is carried back to a reservoir such that it can continue to be used to control temperature of the chuck. Where gas and temperature control fluid vapors are displaced from the reservoir, they are routed through a suction line heat exchanger which condenses the vapor. The gas and condensed fluid are separated in a fluid separator. The separated fluid is returned to the reservoir, and the separated air can be vented to the atmosphere.
摘要翻译：描述用于控制工件卡盘中的温度的系统和方法。流体循环系统通过工件卡盘将温度控制流体（例如工程HFE流体）循环。连接到流体循环系统的流体回收系统通过使气体循环通过包括流体管和卡盘中的流体通道的流体循环系统来回收来自流体循环系统的温度控制流体的一部分。当气体循环时，可以是空气的气体携带一部分剩余或过剩的液体通过流体循环系统。剩余流体被运送到储存器，使得其可以继续用于控制卡盘的温度。当气体和温度控制流体蒸气从储存器移位时，它们被引导通过冷凝蒸汽的吸入管线热交换器。气体和冷凝流体在流体分离器中分离。分离的流体返回到储存器，并且分离的空气可以排放到大气中。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式