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    • 8. 发明申请
    • ASYNCHRONOUS BRIDGE
    • 异步桥
    • US20130138848A1
    • 2013-05-30
    • US13617734
    • 2012-09-14
    • Bub-Chul JeongJae Geun YunJae Gon LeeSoo Wan Hong
    • Bub-Chul JeongJae Geun YunJae Gon LeeSoo Wan Hong
    • G06F13/38
    • G06F13/405
    • An asynchronous bridge includes a transmission unit and a receiving unit. The transmission unit receives a write valid signal and input data from a master circuit, outputs write addresses increment under control of the write valid signal, sequentially stores the input data in memory cells, as directed by write addresses, and then sequentially outputs the stored input data, as directed by read addresses. The receiving unit receives a read ready signal from a slave circuit, determines whether memory cells are valid, based on the write addresses and the read addresses, and then outputs a read valid signal and the input data, based on the determination.
    • 异步桥包括传输单元和接收单元。 发送单元接收写入有效信号并从主电路输入数据,在写入有效信号的控制下输出写入地址增量,按照写入地址的顺序将输入数据依次存储在存储器单元中,然后顺序输出存储的输入 数据,按读取地址指示。 接收单元基于写入地址和读取地址接收来自从属电路的准备就绪信号,确定存储器单元是否有效,然后基于该确定输出读取有效信号和输入数据。
    • 10. 发明申请
    • FinFET with novel body contact for multiple Vt applications
    • FinFET具有新的身体接触,适用于多种Vt应用
    • US20120007180A1
    • 2012-01-12
    • US12803776
    • 2010-07-06
    • Chunshan YinKian Ming TanJae Gon Lee
    • Chunshan YinKian Ming TanJae Gon Lee
    • H01L27/12H01L21/84
    • H01L29/785H01L29/66795
    • FinFET devices are formed with body contact structures enabling the fabrication of such devices having different gate threshold voltages (Vt). A body contact layer is formed to contact the gate electrode (contact) enabling a forward body bias and a reduction in Vt. Two example methods of fabrication (and resulting structures) are provided. In one method, the gate electrode (silicon-based) and body contact layer (silicon) are connected by growing epitaxy which merges the two structures forming electrical contact. In another method, a via is formed that intersects with the gate electrode (suitable conductive material) and body contact layer and is filled with conductive material to electrically connect the two structures. As a result, various FinFETs with different Vt can be fabricated for different applications.
    • FinFET器件形成有能够制造具有不同栅极阈值电压(Vt)的这种器件的体接触结构。 形成身体接触层以接触栅电极(接触),从而能够实现正向偏置和Vt的减小。提供了两种制造方法(和结果)。 在一种方法中,栅电极(硅基)和体接触层(硅)通过生长的外延连接,该外延合并形成电接触的两个结构。 在另一种方法中,形成与栅电极(合适的导电材料)和体接触层相交的通孔,并且填充有导电材料以电连接两个结构。 因此,可以为不同的应用制造具有不同Vt的各种FinFET。