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1. 发明授权

US06552263B2 Method of injection molded flip chip encapsulation 失效
公开(公告)号：US06552263B2
公开(公告)日：2003-04-22
申请号：US10150125
申请日：2002-05-16
申请人： Donald Seton Farquhar , Kostantinos Papathomas
发明人： Donald Seton Farquhar , Kostantinos Papathomas
IPC分类号： H01L2328
CPC分类号： B29C45/34 , H01L21/563 , H01L21/565 , H01L24/29 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83102 , H01L2224/92125 , H01L2924/01006 , H01L2924/01033 , H01L2924/01057 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/351 , Y10T29/49146 , H01L2924/00 , H01L2924/3512
摘要： The electrical interconnections between an integrated circuit chip assembly are encapsulated and reinforced with a high viscosity encapsulant material in a single step molding process wherein a mold is placed over an integrated circuit chip assembly and encapsulant material is dispensed through an opening in the mold and forced around and under the integrated circuit chip by external pressure encapsulating the integrated circuit chip assembly. An integrated circuit chip assembly having a reinforced electrical connection which is more resistant to weakening as a result is stress created by differences in coefficient of thermal expansion between the integrated circuit chip and the substrate to which the integrated circuit chip is attached is produced.

2. 发明授权

US06369449B2 Method and apparatus for injection molded flip chip encapsulation 失效
标题翻译：注塑倒装芯片封装的方法和装置
公开(公告)号：US06369449B2
公开(公告)日：2002-04-09
申请号：US09228601
申请日：1999-01-12
申请人： Donald Seton Farquhar , Michael Joseph Klodowski , Kostantinos Papathomas , James Robert Wilcox
发明人： Donald Seton Farquhar , Michael Joseph Klodowski , Kostantinos Papathomas , James Robert Wilcox
IPC分类号： H01L2348
CPC分类号： H01L23/3128 , H01L21/54 , H01L21/563 , H01L23/3121 , H01L24/29 , H01L24/32 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/83104 , H01L2224/92125 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/15151 , H01L2924/15787 , H01L2924/19107 , H01L2924/351 , H01L2924/00 , H01L2924/3512 , H01L2224/05599
摘要： The electrical connections of an integrated circuit chip assembly comprised of an integrated circuit chip attached to a substrate are encapsulated and reinforced with a high viscosity encapsulant material by dispensing the encapsulant material through an opening in the substrate into the space between the integrated circuit chip and the substrate. An integrated circuit chip assembly having a reinforced electrical interconnection which is more resistant to weakening as a result of stress created by differences in coefficient of thermal expansion between the integrated circuit chip and the substrate to which the integrated circuit chip is attached is produced.
摘要翻译：由附接到基板的集成电路芯片组成的集成电路芯片组件的电气连接通过将密封剂材料通过基板中的开口分配到集成电路芯片与集成电路芯片之间的空间中而被高粘度密封剂材料封装并增强基质。制造具有加强电互连的集成电路芯片组件，其由于集成电路芯片与集成电路芯片所附接的基板之间的热膨胀系数的差异而产生的应力结果，更能抵抗弱化。

3. 发明授权

US08137148B2 Method of manufacturing monolithic parallel interconnect structure 有权
标题翻译：制造单片并联互连结构的方法
公开(公告)号：US08137148B2
公开(公告)日：2012-03-20
申请号：US12570024
申请日：2009-09-30
申请人： Donald Seton Farquhar , Anil Raj Duggal , Michael Scott Herzog , Jeffrey Michael Youmans , Stefan Rakuff , Linda Ann Boyd
发明人： Donald Seton Farquhar , Anil Raj Duggal , Michael Scott Herzog , Jeffrey Michael Youmans , Stefan Rakuff , Linda Ann Boyd
IPC分类号： H01J9/00 , H01J9/24
CPC分类号： H01L51/5203 , H01L51/5212
摘要： An optoelectronic device having a monolithic interconnect structure includes a continuous anode layer, a discontinuous cathode layer, and an electroactive layer sandwiched between the continuous anode layer and the discontinuous cathode layer.
摘要翻译：具有单片互连结构的光电子器件包括连续阳极层，不连续阴极层和夹在连续阳极层和不连续阴极层之间的电活性层。

4. 发明申请

US20100148661A1 ENCAPSULATION STRUCTURE AND METHOD OF ORGANIC ELECTROLUMINESCENCE DEVICE 有权
标题翻译：有机电致发光器件的封装结构与方法
公开(公告)号：US20100148661A1
公开(公告)日：2010-06-17
申请号：US12336683
申请日：2008-12-17
申请人： Donald Seton Farquhar , Ahmet Gun Erlat , Christian Maria Anton Heller , Anil Raj Duggal
发明人： Donald Seton Farquhar , Ahmet Gun Erlat , Christian Maria Anton Heller , Anil Raj Duggal
IPC分类号： H01L51/50 , H01L51/56
CPC分类号： H01L51/5259 , H01L51/5203 , H01L51/5243 , H01L51/5246
摘要： An encapsulation structure comprises a first barrier layer, and an electroluminescence device configured to be coupled to the first barrier layer and comprising a substrate and an electroluminescence element both defining a lateral side. The electroluminescence element comprises a first electrode disposed on the substrate, a second electrode, and an organic light-emitting layer disposed between the first and second electrodes. Further, the encapsulation structure comprises a second barrier layer configured to be coupled to the electroluminescence device, and an adhesive configured to locate between and connect the first and second barrier layers, and at least to be coupled to the lateral side of the electroluminescence device to seal the electroluminescence device between the first and second barrier layers. An encapsulation method is also presented.
摘要翻译：封装结构包括第一阻挡层和被配置为耦合到第一阻挡层并且包括限定侧面的基板和电致发光元件的电致发光器件。电致发光元件包括设置在基板上的第一电极，第二电极和设置在第一和第二电极之间的有机发光层。此外，封装结构包括被配置为耦合到电致发光器件的第二阻挡层和被配置为定位在第一和第二阻挡层之间并连接第一和第二势垒层的粘合剂，并且至少要连接到电致发光器件的侧面，密封第一和第二阻挡层之间的电致发光器件。还提出了一种封装方法。

5. 发明授权

US06902869B2 Manufacturing methods for printed circuit boards 失效
标题翻译：印刷电路板的制造方法
公开(公告)号：US06902869B2
公开(公告)日：2005-06-07
申请号：US10664996
申请日：2003-09-17
申请人： Bernd Karl-Heinz Appelt , James Russell Bupp , Donald Seton Farquhar , Ross William Keesler , Michael Joseph Klodowski , Andrew Michael Seman , Gary Lee Schild
发明人： Bernd Karl-Heinz Appelt , James Russell Bupp , Donald Seton Farquhar , Ross William Keesler , Michael Joseph Klodowski , Andrew Michael Seman , Gary Lee Schild
IPC分类号： H05K3/06 , H05K3/20 , H05K3/40 , H05K3/42 , H05K3/46 , H05K3/02 , H05K3/10
CPC分类号： H05K3/4007 , H05K3/06 , H05K3/20 , H05K3/427 , H05K3/4614 , H05K3/4617 , H05K3/4647 , H05K2201/0367 , H05K2201/09563 , H05K2201/09736 , H05K2203/0369 , H05K2203/0733 , H05K2203/1572 , Y10T29/49002 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49146 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A method of forming a plurality of solid conductive bumps for interconnecting two conductive layers of a circuit board with substantially coplanar upper surfaces. The method comprises the steps of applying a continuous homogenous metal layer onto a dielectric substrate, applying a first photoresist and exposing and developing said first photoresist to define a pattern of conductive bumps; etching the metal layer exposed by said development to form said plurality of conductive bumps; removing said first photoresist; applying a second photoresist onto the metal layer; exposing and developing said second photoresist to define a pattern of conductive bumps and circuit lines; etching the metal layer exposed by said development to form a pattern of circuit lines in said metal layer; and removing said second photoresist. The methods of the present invention also provides for fabricating a multilayer circuit board and a metallic border for providing rigidity to a panel.
摘要翻译：一种形成多个固体导电凸块的方法，用于将电路板的两个导电层与基本上共面的上表面互连。该方法包括以下步骤：将连续的均质金属层施加到电介质基底上，施加第一光致抗蚀剂并暴露和显影所述第一光致抗蚀剂以限定导电凸块的图案; 蚀刻由所述显影暴露的金属层以形成所述多个导电凸块; 去除所述第一光致抗蚀剂; 在所述金属层上施加第二光致抗蚀剂; 曝光和显影所述第二光致抗蚀剂以限定导电凸块和电路线的图案; 蚀刻由所述显影曝光的金属层，以在所述金属层中形成电路线图案; 并除去所述第二光致抗蚀剂。本发明的方法还提供制造用于向面板提供刚性的多层电路板和金属边框。

6. 发明授权

US5847324A High performance electrical cable 失效
标题翻译：高性能电缆
公开(公告)号：US5847324A
公开(公告)日：1998-12-08
申请号：US626732
申请日：1996-04-01
申请人： Donald Seton Farquhar , William Louis Brodsky , Natalie Barbara Feilchenfeld , Lisa Jeanine Jimarez , James Robert Wilcox
发明人： Donald Seton Farquhar , William Louis Brodsky , Natalie Barbara Feilchenfeld , Lisa Jeanine Jimarez , James Robert Wilcox
IPC分类号： H01B7/08 , H05K1/00 , H05K3/28 , H05K3/46
CPC分类号： H05K3/4652 , H01B7/0838 , H01B7/0861 , H05K1/0393 , H05K2201/015 , H05K2201/0154 , H05K3/28 , H05K3/4626 , H05K3/4635 , H05K3/4655 , Y10T29/49124
摘要： A composite cable has a reinforcing layer with conductors disposed on opposed planar surfaces. Dielectric film layers electrically separate the conductors on the planar reinforcing layer from respective layers of additional conductors. The flexible cable is manufactured by laminating a layer of dielectric film and a layer of electrically conductive material onto both sides of a double clad core which provides a strain relief reinforcement for the cable.
摘要翻译：复合电缆具有加强层，导体设置在相对的平面上。介电膜层将平面加强层上的导体与附加导体的相应层电分离。柔性电缆通过将电介质膜和一层导电材料层叠在双包层芯的两侧上来制造，该双层芯提供用于电缆的应变消除加强件。

7. 发明授权

US08344389B2 Optoelectronic device array 有权
标题翻译：光电器件阵列
公开(公告)号：US08344389B2
公开(公告)日：2013-01-01
申请号：US12696510
申请日：2010-01-29
申请人： Donald Seton Farquhar , Michael Scott Herzog
发明人： Donald Seton Farquhar , Michael Scott Herzog
IPC分类号： H01L27/32
CPC分类号： H01L27/3293 , H01L25/048 , H01L27/3297 , H01L51/5203 , H01L51/5237 , H01L51/5246 , H01L2251/5361 , H01L2924/0002 , H01L2924/00
摘要： An optoelectonice device array includes a plurality of packages, each enclosing an optoelectronic device, and positioned in at least one row. Each package overlaps at least one adjacent package, and may be hermetically sealed.
摘要翻译：光电子设备阵列包括多个封装，每个封装封装光电子器件，并且定位在至少一行中。每个包装与至少一个相邻的包装重叠，并且可以被气密密封。

8. 发明授权

US08273980B2 Photovoltaic roof ridge cap and installation method 有权
标题翻译：光伏屋顶盖帽及安装方法
公开(公告)号：US08273980B2
公开(公告)日：2012-09-25
申请号：US11241050
申请日：2005-09-30
申请人： Donald Seton Farquhar , Charles Steven Korman , Neil Anthony Johnson , Ali Esat Iz
发明人： Donald Seton Farquhar , Charles Steven Korman , Neil Anthony Johnson , Ali Esat Iz
IPC分类号： H01L31/048
CPC分类号： H02S20/23 , E04D13/174 , E04D2001/305 , E04D2001/306 , F24S20/67 , H01L31/0547 , Y02B10/12 , Y02B10/20 , Y02E10/44 , Y02E10/52
摘要： A photovoltaic roofing system and a method of installing the photovoltaic ridge cap structure have been provided. The photovoltaic roofing system includes a ridge cap adapted to cover a ridge of a roof structure. The system also includes at least one photovoltaic cell disposed within the ridge cap. The method of installing a photovoltaic ridge cap structure includes mounting the ridge cap over multiple photovoltaic cells along a ridge of a roof structure. The method further includes routing electrical leads from each photovoltaic cell through one or more openings along the ridge of the roof structure.
摘要翻译：已经提供了光伏屋顶系统和安装光伏脊盖结构的方法。光伏屋顶系统包括适于覆盖屋顶结构的脊的脊帽。该系统还包括设置在脊盖内的至少一个光伏电池。安装光伏脊盖结构的方法包括沿着屋顶结构的脊部将脊盖安装在多个光伏电池上。该方法还包括将电引线从每个光伏电池穿过沿着屋顶结构的脊的一个或多个开口。

9. 发明授权

US08102119B2 Encapsulated optoelectronic device and method for making the same 有权
标题翻译：封装光电器件及其制造方法
公开(公告)号：US08102119B2
公开(公告)日：2012-01-24
申请号：US12510463
申请日：2009-07-28
申请人： Donald Seton Farquhar , Michael Scott Herzog , Christian Maria Anton Heller
发明人： Donald Seton Farquhar , Michael Scott Herzog , Christian Maria Anton Heller
IPC分类号： H01L51/50
CPC分类号： H01L51/5246 , H01L27/3202 , H01L27/3204 , H01L51/0097 , H01L51/5203 , H01L51/524 , H01L51/5243
摘要： An encapsulated optoelectronic device includes: a first barrier layer; an electroluminescence device coupled to the first barrier layer, and comprising a substrate and an electroluminescence element both defining a lateral side, and the electroluminescence element comprising a first electrode disposed on the substrate, a second electrode, and an optoelectronically active layer between the first and second electrodes; a second barrier layer coupled to the electroluminescence device; and an adhesive located between and connecting the first and second barrier layers, and at least coupled to the lateral side of the electroluminescence device to seal the electroluminescence device; a first conductive area electrically coupled to the first electrode and electrically insulated from the second electrode and a second conductive area; the second conductive area electrically coupled to the second electrode and electrically insulated from the first electrode and the first conductive area. A method for making the encapsulated optoelectronic device is presented.
摘要翻译：封装的光电器件包括：第一阻挡层; 耦合到所述第一阻挡层的电致发光器件，并且包括限定侧面的衬底和电致发光元件，并且所述电致发光元件包括设置在所述衬底上的第一电极，第二电极和所述第一和第二电极之间的光电活性层，第二电极; 耦合到所述电致发光器件的第二阻挡层; 以及粘合剂，位于并连接第一和第二阻挡层之间，并且至少耦合到电致发光器件的侧面以密封电致发光器件; 电耦合到第一电极并与第二电极电绝缘的第一导电区域和第二导电区域; 所述第二导电区域电耦合到所述第二电极并且与所述第一电极和所述第一导电区域电绝缘。提出了一种制造封装光电器件的方法。

10. 发明申请

US20110025196A1 HERMETIC PACKAGE WITH GETTER MATERIALS 审中-公开
标题翻译：含药材的包装材料
公开(公告)号：US20110025196A1
公开(公告)日：2011-02-03
申请号：US12533090
申请日：2009-07-31
申请人： Stefan Rakuff , Donald Seton Farquhar , Christian Maria Anton Heller , Ahmet Gun Erlat
发明人： Stefan Rakuff , Donald Seton Farquhar , Christian Maria Anton Heller , Ahmet Gun Erlat
IPC分类号： H01J1/62
CPC分类号： H01L51/5268 , H01L51/5246 , H01L51/5259
摘要： Organic light emitting devices include a transparent substrate, a first transparent electrode disposed on the transparent substrate, a second electrode, an electroluminescent layer sandwiched between the electrodes, and a getter layer disposed on a light emitting surface of the substrate opposite the first transparent electrode, and comprising a metal selected from beryllium, magnesium, calcium, strontium, barium, radium and titanium.
摘要翻译：有机发光器件包括透明衬底，设置在透明衬底上的第一透明电极，第二电极，夹在电极之间的电致发光层，以及设置在与第一透明电极相对的衬底的发光表面上的吸气剂层，并且包含选自铍，镁，钙，锶，钡，镭和钛的金属。

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