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1. 发明申请

US20160274629A1 Systems And Methods Of Adaptive Thermal Control For Information Handling Systems 有权
标题翻译：信息处理系统的自适应热控制系统与方法
公开(公告)号：US20160274629A1
公开(公告)日：2016-09-22
申请号：US14664317
申请日：2015-03-20
申请人： Dominick Adam Lovicott , Hasnain Shabbir , Eric Tunks
发明人： Dominick Adam Lovicott , Hasnain Shabbir , Eric Tunks
IPC分类号： G06F1/20 , G01K15/00
CPC分类号： G06F1/206 , G06F1/324 , Y02D10/126 , Y02D10/16
摘要： Systems and methods of adaptive thermal control are provided for information handling system platforms that may be implemented to automate and scale fan control settings by making the fan control settings relative to a reported component thermal control parameter value from a component of an information handling system platform, such as a CPU or other heat generating component. In one example, bounds for system use of vendor or component manufacturer-reported thermal control parameter values may be set for system cooling so as to confine use of these values within information handling system platform limits characterized by a manufacturer of an information handling system platform.
摘要翻译：提供了自适应热控制的系统和方法，用于信息处理系统平台，其可以通过相对于来自信息处理系统平台的组件的所报告的组件热控制参数值使风扇控制设置来自动化和调整风扇控制设置来实现，例如CPU或其他发热组件。在一个示例中，系统使用供应商或组件制造商报告的热控制参数值的界限可以被设置用于系统冷却，以便将这些值的限制在由信息处理系统平台的制造商表征的信息处理系统平台限制内。

2. 发明授权

US09250664B2 IHS component cooling system 有权
标题翻译： IHS部件冷却系统
公开(公告)号：US09250664B2
公开(公告)日：2016-02-02
申请号：US13404761
申请日：2012-02-24
申请人： Paul T. Artman , Dominick Adam Lovicott , Hasnain Shabbir
发明人： Paul T. Artman , Dominick Adam Lovicott , Hasnain Shabbir
IPC分类号： G06F1/20
CPC分类号： G06F1/206 , G06F1/203 , Y02D10/16
摘要： An IHS includes an IHS chassis. A processor is located in the IHS chassis. At least one fan is located in the IHS chassis and in fluid communication with the processor. A temperature sensor is located in the IHS chassis. A fan controller is coupled to the processor, the at least one fan, the temperature sensor, and a storage device that includes a plurality of processor target temperatures that are each associated with a different ambient temperature. The fan controller is operable to receive a first ambient temperature from the temperature sensor, determine a first processor target temperature that is associated with the first ambient temperature, receive a temperature of the processor, and operate the at least one fan in order to reduce the temperature of the processor to the first processor target temperature.
摘要翻译： IHS包括IHS机箱。处理器位于IHS机箱中。至少有一个风扇位于IHS机箱中，与处理器流体连通。温度传感器位于IHS机箱中。风扇控制器耦合到处理器，至少一个风扇，温度传感器和包括多个处理器目标温度的存储设备，每个处理器目标温度各自与不同的环境温度相关联。风扇控制器可操作以从温度传感器接收第一环境温度，确定与第一环境温度相关联的第一处理器目标温度，接收处理器的温度，以及操作至少一个风扇，以便减少处理器的温度达到第一处理器目标温度。

3. 发明申请

US20130226364A1 IHS COMPONENT COOLING SYSTEM 有权
标题翻译： IHS组件冷却系统
公开(公告)号：US20130226364A1
公开(公告)日：2013-08-29
申请号：US13404761
申请日：2012-02-24
申请人： Paul T. Artman , Dominick Adam Lovicott , Hasnain Shabbir
发明人： Paul T. Artman , Dominick Adam Lovicott , Hasnain Shabbir
IPC分类号： G05D23/00
CPC分类号： G06F1/206 , G06F1/203 , Y02D10/16
摘要： An IHS includes an IHS chassis. A processor is located in the IHS chassis. At least one fan is located in the IHS chassis and in fluid communication with the processor. A temperature sensor is located in the IHS chassis. A fan controller is coupled to the processor, the at least one fan, the temperature sensor, and a storage device that includes a plurality of processor target temperatures that are each associated with a different ambient temperature. The fan controller is operable to receive a first ambient temperature from the temperature sensor, determine a first processor target temperature that is associated with the first ambient temperature, receive a temperature of the processor, and operate the at least one fan in order to reduce the temperature of the processor to the first processor target temperature.
摘要翻译： IHS包括IHS机箱。处理器位于IHS机箱中。至少有一个风扇位于IHS机箱中，与处理器流体连通。温度传感器位于IHS机箱中。风扇控制器耦合到处理器，至少一个风扇，温度传感器和包括多个处理器目标温度的存储设备，每个处理器目标温度各自与不同的环境温度相关联。风扇控制器可操作以从温度传感器接收第一环境温度，确定与第一环境温度相关联的第一处理器目标温度，接收处理器的温度，以及操作至少一个风扇，以便减少处理器的温度达到第一处理器目标温度。

4. 发明申请

US20110090087A1 System and Method for Safe Handling of Information Handling Resources 有权
标题翻译：信息处理资源安全处理的制度与方法
公开(公告)号：US20110090087A1
公开(公告)日：2011-04-21
申请号：US12581636
申请日：2009-10-19
申请人： Stuart Allen Berke , Dominick Lovicott , Hasnain Shabbir , William Coxe
发明人： Stuart Allen Berke , Dominick Lovicott , Hasnain Shabbir , William Coxe
IPC分类号： G08B17/00
CPC分类号： G08B21/02 , G06F1/206 , G06F11/3051 , G06F11/3058 , G06F11/325
摘要： Systems and methods for safe handling of information handling resources are provided. In some embodiments, a method is provided. The method may include detecting occurrence of a power down sequence and in response to detecting of the power down sequence, controlling operation of a cooling fan coupled to information handling resources based at least on a first criteria of a predetermined policy. The method may include receiving a signal from a sensor, the signal indicating a thermal property of a particular information handling resource coupled to the sensor. The method may include determining if the thermal property satisfies a second criteria of the predetermined policy, the second criteria comprising a safe temperature range for handling the particular information handling resource. If the thermal property meets the second criteria, the method may provide an alert via an indicator to a user indicating the particular information handling resource is safe for handling.
摘要翻译：提供了安全处理信息处理资源的系统和方法。在一些实施例中，提供了一种方法。该方法可以包括检测掉电序列的发生并且响应于功率衰减序列的检测，至少基于预定策略的第一准则来控制耦合到信息处理资源的冷却风扇的操作。该方法可以包括从传感器接收信号，该信号指示耦合到传感器的特定信息处理资源的热性质。该方法可以包括确定热性质是否满足预定策略的第二标准，第二标准包括用于处理特定信息处理资源的安全温度范围。如果热性能满足第二标准，则该方法可以通过指示符向用户提供指示特定信息处理资源对于处理是安全的警报。

5. 发明申请

US20070288191A1 System and Method for Information Handling System Thermal Diagnostics 有权
标题翻译：信息处理系统热诊断系统与方法
公开(公告)号：US20070288191A1
公开(公告)日：2007-12-13
申请号：US11840366
申请日：2007-08-17
申请人： Drew Schulke , Barry Kahr , Vinod Makhija , Adolfo Montero , Hasnain Shabbir
发明人： Drew Schulke , Barry Kahr , Vinod Makhija , Adolfo Montero , Hasnain Shabbir
IPC分类号： G06F11/30
CPC分类号： G06F11/3093 , G06F11/24 , G06F11/3058
摘要： Thermal subsystems of manufactured information handling systems are tested for compliance with desired parameters by running a thermal diagnostics module in firmware during one or more manufacturing activities performed on the information handling system. The thermal diagnostics module monitors and stores one or more thermal parameters detected at the information handling system, such as the maximum temperature zone detected during a manufacturing activity. The stored thermal parameter is read after the manufacturing activity and compared with an expected value to determine the status of the thermal subsystem. For instance, an information handling system maximum operating temperature is detected by firmware running on an embedded controller during imaging of a hard disk drive and fails thermal testing if the detected maximum operating temperature exceeds a predetermined value, such as a value that would not be reached if the thermal subsystem functioning properly.
摘要翻译：通过在信息处理系统执行的一个或多个制造活动期间，通过在固件中运行热诊断模块来测试制造的信息处理系统的热子系统以符合所需参数。热诊断模块监视和存储在信息处理系统处检测到的一个或多个热参数，例如在制造活动期间检测到的最大温度区域。存储的热参数在制造活动后读取，并与预期值进行比较，以确定热子系统的状态。例如，通过在硬盘驱动器成像期间在嵌入式控制器上运行的固件来检测信息处理系统的最大工作温度，并且如果检测到的最大工作温度超过预定值（例如不能达到的值），则不能进行热测试如果散热子系统正常工作。

6. 发明授权

US07505870B2 System and method for information handling system thermal diagnostics 有权
标题翻译：信息处理系统热诊断系统和方法
公开(公告)号：US07505870B2
公开(公告)日：2009-03-17
申请号：US11840366
申请日：2007-08-17
申请人： Drew Schulke , Barry Kahr , Vinod Makhija , Adolfo Montero , Hasnain Shabbir
发明人： Drew Schulke , Barry Kahr , Vinod Makhija , Adolfo Montero , Hasnain Shabbir
IPC分类号： G21C17/00
CPC分类号： G06F11/3093 , G06F11/24 , G06F11/3058
摘要： Thermal subsystems of manufactured information handling systems are tested for compliance with desired parameters by running a thermal diagnostics module in firmware during one or more manufacturing activities performed on the information handling system. The thermal diagnostics module monitors and stores one or more thermal parameters detected at the information handling system, such as the maximum temperature zone detected during a manufacturing activity. The stored thermal parameter is read after the manufacturing activity and compared with an expected value to determine the status of the thermal subsystem. For instance, an information handling system maximum operating temperature is detected by firmware running on an embedded controller during imaging of a hard disk drive and fails thermal testing if the detected maximum operating temperature exceeds a predetermined value, such as a value that would not be reached if the thermal subsystem functioning properly.
摘要翻译：通过在信息处理系统执行的一个或多个制造活动期间，通过在固件中运行热诊断模块来测试制造的信息处理系统的热子系统以符合所需参数。热诊断模块监视和存储在信息处理系统处检测到的一个或多个热参数，例如在制造活动期间检测到的最大温度区域。存储的热参数在制造活动后读取，并与预期值进行比较，以确定热子系统的状态。例如，通过在硬盘驱动器成像期间在嵌入式控制器上运行的固件来检测信息处理系统的最大工作温度，并且如果检测到的最大工作温度超过预定值（例如将不会达到的值），则不能进行热测试如果散热子系统正常工作。

7. 发明授权

US09494954B2 Thermal control systems and methods for information handling systems 有权
标题翻译：用于信息处理系统的热控制系统和方法
公开(公告)号：US09494954B2
公开(公告)日：2016-11-15
申请号：US13559031
申请日：2012-07-26
申请人： Paul Artman , Hasnain Shabbir
发明人： Paul Artman , Hasnain Shabbir
IPC分类号： G05D23/19 , G06F1/20 , G06F1/32
CPC分类号： G06F1/206 , G05D23/1928 , G05D23/1931 , G05D23/1932 , G05D23/1934 , G06F1/3206 , G06F9/44505 , H05K7/20136 , Y02D10/16
摘要： Systems and methods are provided for information handling system thermal control that employ configuration-based temperature feedback, e.g., by using configuration-based fan speed control based on real time individual measured component temperatures. In one example, the disclosed systems and methods may be implemented to allow inputs from one or more hardware temperature sensors to set cooling fan speeds and/or power capping levels in a closed loop fashion, rather than relying solely (or at all) on system inlet ambient temperature.
摘要翻译：提供了用于信息处理系统热控制的系统和方法，其采用基于配置的温度反馈，例如通过使用基于实时单独测量的部件温度的基于配置的风扇速度控制。在一个示例中，可以实现所公开的系统和方法，以允许来自一个或多个硬件温度传感器的输入以闭环方式设置冷却风扇速度和/或功率上限电平，而不是仅依赖于系统（或全部）依赖于系统入口环境温度。

8. 发明授权

US08604933B2 System and method for safe handling of information handling resources by monitoring thermal properties of resources 有权
标题翻译：通过监测资源的热物性来安全处理信息处理资源的系统和方法
公开(公告)号：US08604933B2
公开(公告)日：2013-12-10
申请号：US13734276
申请日：2013-01-04
申请人： Stuart Allen Berke , Dominick A. Lovicott , Hasnain Shabbir , William K. Coxe, III
发明人： Stuart Allen Berke , Dominick A. Lovicott , Hasnain Shabbir , William K. Coxe, III
IPC分类号： G08B21/00
CPC分类号： G08B21/02 , G06F1/206 , G06F11/3051 , G06F11/3058 , G06F11/325
摘要： Systems and methods for safe handling of information handling resources are provided. In some embodiments, a method is provided. The method may include detecting occurrence of a power down sequence and in response to detecting of the power down sequence, controlling operation of a cooling fan coupled to information handling resources based at least on a first criteria of a predetermined policy. The method may include receiving a signal from a sensor, the signal indicating a thermal property of a particular information handling resource coupled to the sensor. The method may include determining if the thermal property satisfies a second criteria of the predetermined policy, the second criteria comprising a safe temperature range for handling the particular information handling resource. If the thermal property meets the second criteria, the method may provide an alert via an indicator to a user indicating the particular information handling resource is safe for handling.
摘要翻译：提供了安全处理信息处理资源的系统和方法。在一些实施例中，提供了一种方法。该方法可以包括检测掉电序列的发生并且响应于功率衰减序列的检测，至少基于预定策略的第一准则来控制耦合到信息处理资源的冷却风扇的操作。该方法可以包括从传感器接收信号，该信号指示耦合到传感器的特定信息处理资源的热性质。该方法可以包括确定热性质是否满足预定策略的第二标准，第二标准包括用于处理特定信息处理资源的安全温度范围。如果热性能满足第二标准，则该方法可以通过指示符向用户提供指示特定信息处理资源对于处理是安全的警报。

9. 发明申请

US20100122792A1 Universal Blank for Air Flow Management 有权
标题翻译：空气流量管理通用空白
公开(公告)号：US20100122792A1
公开(公告)日：2010-05-20
申请号：US12272237
申请日：2008-11-17
申请人： Hasnain Shabbir , Bernard D. Strmiska
发明人： Hasnain Shabbir , Bernard D. Strmiska
IPC分类号： F28D21/00 , H05K5/00
CPC分类号： H05K7/20727
摘要： A system for managing air flow through a body of an information handling system is disclosed. The disclosure provides a blank including a blank base plate and a blank ridge extending from the blank base plate. The blank base plate may be configured to match an architecture of both a processor socket and a bank of memory chip sockets. The blank may be configured to provide an impedance to air flow substantially similar to a total impedance provided by a processor and associated heat sink disposed in the processor socket and a bank of memory chips disposed in the bank of memory chip sockets.
摘要翻译：公开了一种用于管理通过信息处理系统的主体的空气流的系统。本公开提供了一种坯料，其包括从坯料基板延伸的坯料基板和坯料脊。空白基板可以被配置为匹配处理器插座和一组存储器芯片插座的架构。空白可以被配置为向空气流提供阻抗，其基本上类似于由设置在处理器插座中的处理器和相关联的散热器提供的总阻抗以及设置在存储器芯片插槽组中的一组存储器芯片。

10. 发明授权

US06400565B1 Thermally conductive interface member 有权
标题翻译：导热接口部件
公开(公告)号：US06400565B1
公开(公告)日：2002-06-04
申请号：US09553673
申请日：2000-04-21
申请人： Hasnain Shabbir , Rakesh Bhatia
发明人： Hasnain Shabbir , Rakesh Bhatia
IPC分类号： G06F120
CPC分类号： G06F1/20 , F28D15/0275 , H01L21/4882 , H01L23/3735 , H01L23/3737 , H01L23/4093 , H01L23/427 , H01L23/4275 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： An electronic package including a printed circuit substrate having a semiconductor device mounted thereon. A heat dissipating device is attached to the semiconductor device. A thermal interface member is mounted between the semiconductor device and the heat dissipating device. The thermal interface member includes a thermally conductive elastomeric pad and a layer of thermally conductive phase change material attached to a surface of the elastomeric pad. The elastomeric pad is engaged with a surface of the semiconductor device and the phase change material is engaged with a surface of the heat dissipating device. Heat transfer from the semiconductor device to the heat dissipating device is significantly increased. The heat dissipating device can be detached from the semiconductor device without destroying the thermal transfer member, allowing the thermal interface member to be reused with the heat dissipating device.
摘要翻译：一种电子封装，包括其上安装有半导体器件的印刷电路基板。散热装置安装在半导体装置上。热接口部件安装在半导体器件和散热器件之间。热界面构件包括导热弹性体垫和附着到弹性垫的表面的导热相变材料层。弹性垫与半导体器件的表面接合，并且相变材料与散热装置的表面接合。从半导体器件到散热器件的热传递显着增加。散热装置可以从半导体装置分离，而不破坏热传递部件，允许热接口部件与散热装置重复使用。

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