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1. 发明授权

US6118654A Heat exchanger for a portable computing device and docking station 失效
公开(公告)号：US6118654A
公开(公告)日：2000-09-12
申请号：US844801
申请日：1997-04-22
申请人： Rakesh Bhatia
发明人： Rakesh Bhatia
IPC分类号： G06F1/16 , G06F1/20 , H05K7/20
CPC分类号： G06F1/203 , G06F1/1632
摘要： A heat exchanger for a computing device and a docking station. The heat exchanger includes a first heat transfer element and a second heat transfer element. The first heat transfer element has a portion thermally coupled to an electronic component. The first and the second heat transfer element conformally engage each other yet are removable from each other.

2. 发明授权

US06111748A Flat fan heat exchanger and use thereof in a computing device 失效
标题翻译：平板式热交换器及其在计算装置中的应用
公开(公告)号：US06111748A
公开(公告)日：2000-08-29
申请号：US857710
申请日：1997-05-15
申请人： Rakesh Bhatia
发明人： Rakesh Bhatia
IPC分类号： G06F1/20 , H01L23/467 , H05K7/20
CPC分类号： H05K7/20172 , F04D17/04 , G06F1/203 , H01L23/467 , H01L2924/0002
摘要： A fan heat exchanger. The heat exchanger includes a fan housing which defines a chamber as well as top and bottom closing surfaces for the chamber. A fan is mounted in the chamber and has a rotational axis substantially perpendicular to the bottom surface.
摘要翻译：风扇换热器。热交换器包括风扇壳体，其限定腔室以及腔室的顶部和底部关闭表面。风扇安装在室中并且具有基本上垂直于底表面的旋转轴线。

3. 发明授权

US6094347A Airflow heat exchanger for a portable electronic device and port replicator, docking station, or mini-docking station 有权
标题翻译：气流换热器，用于便携式电子设备和端口复制器，对接站或迷你扩展坞
公开(公告)号：US6094347A
公开(公告)日：2000-07-25
申请号：US226966
申请日：1999-01-08
申请人： Rakesh Bhatia
发明人： Rakesh Bhatia
IPC分类号： G06F1/16 , G06F1/20 , H05K7/20
CPC分类号： G06F1/203 , G06F1/1632
摘要： An airflow heat exchange apparatus. One embodiment includes a housing configured to removably mate with an electronic device. The housing has a vent on a substantially horizontal surface and a fan positioned to increase airflow through the electronic device when the electronic device is mated with the housing. An electronic connector is positioned to be electronically coupled to signal lines from the electronic device when the electronic device and housing are mated.
摘要翻译：气流热交换装置。一个实施例包括被配置为可移除地与电子设备配合的壳体。壳体在基本水平的表面上具有通风口，并且当电子设备与壳体配合时，定位成增加通过电子设备的气流的风扇。当电子设备和壳体配合时，电子连接器被定位成电子地耦合到来自电子设备的信号线。

4. 发明授权

US5718282A Heat pipe exchanger system for cooling a hinged computing device 失效
标题翻译：用于冷却铰接计算设备的热管交换器系统
公开(公告)号：US5718282A
公开(公告)日：1998-02-17
申请号：US758897
申请日：1996-12-02
申请人： Rakesh Bhatia , Kevin Haley
发明人： Rakesh Bhatia , Kevin Haley
IPC分类号： F28D15/02 , G06F1/16 , G06F1/20 , H05K7/20 , F28F5/00
CPC分类号： G06F1/203 , F28D15/02
摘要： A heat pipe exchanger system for cooling a hinged computing device. The hinged computing device includes a first hinged member having a first edge and second hinged member having a second edge. The first and second hinged members are rotatably attached along the first and second edge. A heat exchange sheath is mounted substantially parallel to the first and second edges and defines a first opening and a second opening. A first heat pipe is thermally coupled to the integrated circuit and has a portion disposed within the first opening. A second heat pipe is coupled to the display housing and has a portion disposed within the second housing. Alternately, the first heat pipe is coupled to the first hinged member and has a first portion substantially parallel to the first edge and the second edge. In this case, the second heat pipe is coupled to the second hinged member and has a first portion substantially perpendicular to the first heat pipe as well as a second portion conformally engaging the first heat pipe.
摘要翻译：一种用于冷却铰接式计算装置的热管交换器系统。铰接式计算装置包括具有第一边缘的第一铰链构件和具有第二边缘的第二铰接构件。第一和第二铰链构件沿着第一和第二边缘可旋转地附接。热交换护套基本上平行于第一和第二边缘安装并限定第一开口和第二开口。第一热管热耦合到集成电路并且具有设置在第一开口内的部分。第二热管连接到显示器壳体并且具有设置在第二壳体内的部分。或者，第一热管联接到第一铰接构件并且具有基本上平行于第一边缘和第二边缘的第一部分。在这种情况下，第二热管联接到第二铰链构件并且具有基本上垂直于第一热管的第一部分以及与第一热管保形接合的第二部分。

5. 发明授权

US07589962B1 Apparatus for cooling a heat dissipating device located within a portable computer 失效
标题翻译：用于冷却位于便携式计算机内的散热装置的装置
公开(公告)号：US07589962B1
公开(公告)日：2009-09-15
申请号：US08902371
申请日：1997-07-29
申请人： Rakesh Bhatia
发明人： Rakesh Bhatia
IPC分类号： H05K7/20
CPC分类号： F28D15/0233 , G06F1/203 , G06F1/206 , G06F2200/201
摘要： An apparatus for cooling a heat generating component located within a portable computer system enclosure. In one embodiment a flat heat pipe is attached to the bottom surface of the portable computer keyboard support plate. The flat heat pipe is thermally coupled to one or more heat generating components housed within the computer system enclosure.
摘要翻译：一种用于冷却位于便携式计算机系统外壳内的发热元件的装置。在一个实施例中，扁平热管连接到便携式计算机键盘支撑板的底表面。扁平热管热耦合到容纳在计算机系统外壳内的一个或多个发热部件。

6. 发明授权

US07342787B1 Integrated circuit cooling apparatus and method 有权
标题翻译：集成电路冷却装置及方法
公开(公告)号：US07342787B1
公开(公告)日：2008-03-11
申请号：US10941115
申请日：2004-09-15
申请人： Rakesh Bhatia
发明人： Rakesh Bhatia
IPC分类号： H05K7/20
CPC分类号： G06F1/203 , F28D15/0266 , G06F2200/201 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： In various embodiments, heat from a computer component may be absorbed into a medium, moved to a remote heat dispersal unit and dissipated into the surrounding air. In some embodiments, the heat dispersal unit may include a heat sink. In some embodiments, the medium may include a liquid metal. In various embodiments, a vapor compression system may include an evaporator, a compressor, a condenser, and an expansion valve. In some embodiments a separate heat pipe may be placed between the computer component and the evaporator. In various embodiments, a thermo conductive plate may be used to thermally couple the heat pipe to various components including the computer component, evaporator, condenser, and/or heat sink. In some embodiments, a thermo electric module (TEM) may be coupled to various parts of the system.
摘要翻译：在各种实施例中，来自计算机部件的热可以被吸收到介质中，移动到远程散热单元并消散到周围的空气中。在一些实施例中，散热装置可包括散热器。在一些实施例中，介质可以包括液态金属。在各种实施例中，蒸汽压缩系统可以包括蒸发器，压缩机，冷凝器和膨胀阀。在一些实施例中，单独的热管可以放置在计算机部件和蒸发器之间。在各种实施例中，热导板可用于将热管热耦合到包括计算机部件，蒸发器，冷凝器和/或散热器的各种部件。在一些实施例中，热电模块（TEM）可以耦合到系统的各个部分。

7. 发明申请

US20080041562A1 Airflow bypass and cooling of processors in series 审中-公开
标题翻译：处理器的气流旁路和冷却串联
公开(公告)号：US20080041562A1
公开(公告)日：2008-02-21
申请号：US11506341
申请日：2006-08-18
申请人： Rakesh Bhatia
发明人： Rakesh Bhatia
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , G06F1/20 , G06F2200/201 , H01L2924/0002 , H01L2924/00
摘要： A method for cooling electronic components includes disposing a first cooling structure associated with a first processor in a chassis, disposing a second cooling structure associated with a second processor in the chassis, and configuring the first cooling structure and the second cooling structure such that air propagating through the chassis includes air that passes through the first cooling structure and the second cooling structure, and air that passes only through the second cooling structure.
摘要翻译：一种用于冷却电子部件的方法包括：将与第一处理器相关联的第一冷却结构设置在底盘中，将与第二处理器相关联的第二冷却结构设置在所述底盘中，以及配置所述第一冷却结构和所述第二冷却结构，使得空气传播通过底盘包括通过第一冷却结构和第二冷却结构的空气，以及仅通过第二冷却结构的空气。

8. 发明授权

US06472742B1 Thermal gap control 失效
标题翻译：热隙控制
公开(公告)号：US06472742B1
公开(公告)日：2002-10-29
申请号：US09409951
申请日：1999-09-30
申请人： Rakesh Bhatia , Gregory A. James
发明人： Rakesh Bhatia , Gregory A. James
IPC分类号： H01L2348
CPC分类号： H01L23/40 , H01L23/4093 , H01L2023/4068 , H01L2023/4087 , H01L2224/16 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311
摘要： A heat dissipating element (e.g., a heat sink) is held in an initial position closer to a heat generating structure (e.g., a microprocessor) and in a subsequent position farther from the microprocessor. A thermal interface material (e.g., a thermal grease) spans the gap, but is not held under compression, between the heat sink and the microprocessor.
摘要翻译：散热元件（例如，散热器）被保持在更靠近发热结构（例如微处理器）的初始位置，并且在远离微处理器的后续位置中。散热器和微处理器之间的热界面材料（例如，导热油脂）跨过间隙而不被压缩。

9. 发明授权

US06459576B1 Fan based heat exchanger 失效
公开(公告)号：US06459576B1
公开(公告)日：2002-10-01
申请号：US09984138
申请日：2001-10-29
申请人： Rakesh Bhatia , Karen Regis
发明人： Rakesh Bhatia , Karen Regis
IPC分类号： G06F120
CPC分类号： G06F1/203
摘要： A heat generating component such as a microprocessor, in a small form factor, low profile electronic device such as a laptop computer is cooled by using an elongated hollow heat exchanger with a fan at one end of the heat exchanger. A heat pipe, having two ends, has one end thermally coupled to the heat exchanger and the other end thermally coupled to the heat generating component. A heat sink thermally coupled to the other end of the heat pipe, in thermal contact with the heat producing component may be used. In a laptop computer having a four vertically extending side walls including a front wall a back wall and two side walls where the heat generating component is a microprocessor, the heat exchanger can extends in a direction adjacent and parallel to one of the side walls, with an air outlet formed in one of said front and rear walls and an air inlet in the other of said front or rear walls or the side wall to which the heat exchanger is adjacent.

10. 发明授权

US06365076B1 Graphite-fiber enhanced molded plastic for electronic enclosures 失效
标题翻译：用于电子外壳的石墨纤维增强模制塑料
公开(公告)号：US06365076B1
公开(公告)日：2002-04-02
申请号：US09587684
申请日：2000-06-05
申请人： Rakesh Bhatia
发明人： Rakesh Bhatia
IPC分类号： B29C7062
CPC分类号： H05K9/009 , Y10T428/24355 , Y10T428/24372 , Y10T428/24413
摘要： A technique for fabricating an improved electronic enclosure. The electronic enclosure is made of graphite fibers dispersed directionally (non-homogeneous) in an absolac/polycarbonate (ABS/PC) resin mix, which the composition is molded to form the plastic enclosure. The graphite concentration is highest along the interior surface of the enclosure to provide improved heat transfer, as well as adequate EMI/RFI shielding. However, the graphite concentration decrease along the thickness, wherein at the outer surface, the graphite concentration level is zero. The directional variation in the graphite loading allows high graphite loading at the interior surface of the enclosure, but retains lower loading at other regions along the thickness so that rigidity and impact resistance are retained for the enclosure.
摘要翻译：一种用于制造改进的电子外壳的技术。电子外壳由绝对/聚碳酸酯（ABS / PC）树脂混合物中定向（非均匀）分散的石墨纤维制成，该组合物被模制以形成塑料外壳。石墨浓度沿着外壳的内表面最高，以提供改进的热传递以及足够的EMI / RFI屏蔽。然而，石墨浓度沿着厚度减小，其中在外表面处，石墨浓度水平为零。石墨负载中的方向变化允许在外壳的内表面具有高的石墨负载，但是沿着厚度在其它区域保持较低的负载，从而保持外壳的刚度和抗冲击性。

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