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1. 发明授权

US06400565B1 Thermally conductive interface member 有权
标题翻译：导热接口部件
公开(公告)号：US06400565B1
公开(公告)日：2002-06-04
申请号：US09553673
申请日：2000-04-21
申请人： Hasnain Shabbir , Rakesh Bhatia
发明人： Hasnain Shabbir , Rakesh Bhatia
IPC分类号： G06F120
CPC分类号： G06F1/20 , F28D15/0275 , H01L21/4882 , H01L23/3735 , H01L23/3737 , H01L23/4093 , H01L23/427 , H01L23/4275 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： An electronic package including a printed circuit substrate having a semiconductor device mounted thereon. A heat dissipating device is attached to the semiconductor device. A thermal interface member is mounted between the semiconductor device and the heat dissipating device. The thermal interface member includes a thermally conductive elastomeric pad and a layer of thermally conductive phase change material attached to a surface of the elastomeric pad. The elastomeric pad is engaged with a surface of the semiconductor device and the phase change material is engaged with a surface of the heat dissipating device. Heat transfer from the semiconductor device to the heat dissipating device is significantly increased. The heat dissipating device can be detached from the semiconductor device without destroying the thermal transfer member, allowing the thermal interface member to be reused with the heat dissipating device.
摘要翻译：一种电子封装，包括其上安装有半导体器件的印刷电路基板。散热装置安装在半导体装置上。热接口部件安装在半导体器件和散热器件之间。热界面构件包括导热弹性体垫和附着到弹性垫的表面的导热相变材料层。弹性垫与半导体器件的表面接合，并且相变材料与散热装置的表面接合。从半导体器件到散热器件的热传递显着增加。散热装置可以从半导体装置分离，而不破坏热传递部件，允许热接口部件与散热装置重复使用。

2. 发明授权

US06535798B1 Thermal management in a system 有权
标题翻译：系统中的热管理
公开(公告)号：US06535798B1
公开(公告)日：2003-03-18
申请号：US09204530
申请日：1998-12-03
申请人： Rakesh Bhatia , Dennis Reinhardt , Barnes Cooper
发明人： Rakesh Bhatia , Dennis Reinhardt , Barnes Cooper
IPC分类号： G05D2300
CPC分类号： G05D23/1917 , G06F1/206 , G06F1/324 , Y02D10/126 , Y02D10/16
摘要： A system including a component (e.g., a processor) with a clock and a thermal management controller that monitors a temperature in the system. The thermal management controller varies the component between different performance states (e.g., cycles the processor between a high and a low performance state) when an over-temperature condition is detected. The thermal management controller further throttles the clock of the component while in the low performance state until the over-temperature condition is removed.
摘要翻译：包括具有时钟的组件（例如处理器）和监视系统中的温度的热管理控制器的系统。当检测到过温度条件时，热管理控制器改变不同性能状态之间的组件（例如，处理器在高性能和低性能状态之间循环）。热管理控制器在低性能状态下进一步节流部件的时钟，直到超温条件被去除。

3. 发明授权

US06357515B1 Heat exchanger for a portable computing device utilizing active and passive heat dissipation mechanisms 有权
标题翻译：利用主动和被动散热机构的便携式计算设备的热交换器
公开(公告)号：US06357515B1
公开(公告)日：2002-03-19
申请号：US09684139
申请日：2000-10-05
申请人： Rakesh Bhatia
发明人： Rakesh Bhatia
IPC分类号： F28F700
CPC分类号： F28D15/0233 , G06F1/203 , G06F1/206
摘要： A heat exchanger. The heat exchanger includes a first heat dissipation mechanism having a first heat dissipation capacity and a second heat dissipation having a second heat dissipation capacity. At least one heat transfer mechanism thermally couples the first heat dissipation mechanism and the second heat dissipation mechanism to a heat generating component. The heat transfer mechanism has a limited conductivity portion in the thermal path to either the first or the second heat dissipation mechanism.
摘要翻译：一个换热器。热交换器包括具有第一散热能力的第一散热机构和具有第二散热能力的第二散热。至少一个传热机构将第一散热机构和第二散热机构热耦合到发热部件。传热机构在与第一或第二散热机构的热路径中具有有限的导电部分。

4. 发明授权

US5982630A Printed circuit board that provides improved thermal dissipation 失效
标题翻译：印刷电路板，提供改善的散热
公开(公告)号：US5982630A
公开(公告)日：1999-11-09
申请号：US965354
申请日：1997-11-06
申请人： Rakesh Bhatia
发明人： Rakesh Bhatia
IPC分类号： H05K1/02 , H05K7/20 , H05K7/10
CPC分类号： H05K1/0207 , H05K1/0206 , H05K2201/09509 , H05K2201/10689 , H05K2201/10734
摘要： A printed circuit board to support an integrated circuit and provide thermal dissipation. A layer of thermally conductive material is disposed between lower and upper dielectric layers. Above this structure is disposed another layer of thermally conductive material to be thermally coupled to an integrated circuit. A thermal via couples the two layers of thermally conductive material to each other.
摘要翻译：支持集成电路并提供散热的印刷电路板。一层导热材料设置在下介电层和上电介质层之间。在该结构之上设置另一层导热材料，以热耦合到集成电路。热通孔将两层导热材料彼此连接。

5. 发明授权

US5898569A Power cable heat exchanger for a computing device 失效
标题翻译：用于计算设备的电力电缆热交换器
公开(公告)号：US5898569A
公开(公告)日：1999-04-27
申请号：US846113
申请日：1997-04-25
申请人： Rakesh Bhatia
发明人： Rakesh Bhatia
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： G06F1/203
摘要： A heat exchange apparatus for a computing device. A heat dissipating cable connector for the computing device includes a heat dissipation mechanism. The heat dissipation mechanism in the heat dissipating cable connector is removably thermally coupled to a heat transfer element which is configured to transfer heat from an electronic component to the heat dissipation mechanism.
摘要翻译：一种用于计算设备的热交换装置。用于计算设备的散热电缆连接器包括散热机构。散热电缆连接器中的散热机构可移除地热耦合到传热元件，传热元件被配置为将热量从电子部件传递到散热机构。

6. 发明授权

US5880929A Heat exchanger system for cooling a hinged computing device 失效
标题翻译：用于冷却铰接式计算设备的热交换器系统
公开(公告)号：US5880929A
公开(公告)日：1999-03-09
申请号：US980704
申请日：1997-12-01
申请人： Rakesh Bhatia
发明人： Rakesh Bhatia
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： G06F1/203
摘要： A heat exchanger system for use in a hinged computing device is provided. The hinged computing device includes a base housing connected to a display housing by one or more hinges. A number of heat generating electronic components are located within the base housing, and a display screen is positioned in the display housing. The heat exchanger system includes a heat pipe located in the base and thermally coupled to both an electronic component and the hinge to allow heat transfer from the electronic component to the hinge. A flat plate heat pipe located in the display housing is mechanically and thermally coupled to the hinge to allow heat transfer from the hinge to the flat plate heat pipe for dissipation through the display housing.
摘要翻译：提供了一种用于铰链式计算装置的热交换器系统。铰接式计算装置包括通过一个或多个铰链连接到显示器壳体的基座壳体。多个发热电子部件位于基座壳体内，显示屏位于显示器壳体内。热交换器系统包括位于基座中并与电子部件和铰链两者热耦合以允许热量从电子部件传递到铰链的热管。位于显示器壳体中的平板热管机械地和热耦合到铰链，以允许从铰链到平板热管的热传递，以便通过显示器壳体消散。

7. 发明授权

US6118654A Heat exchanger for a portable computing device and docking station 失效
公开(公告)号：US6118654A
公开(公告)日：2000-09-12
申请号：US844801
申请日：1997-04-22
申请人： Rakesh Bhatia
发明人： Rakesh Bhatia
IPC分类号： G06F1/16 , G06F1/20 , H05K7/20
CPC分类号： G06F1/203 , G06F1/1632
摘要： A heat exchanger for a computing device and a docking station. The heat exchanger includes a first heat transfer element and a second heat transfer element. The first heat transfer element has a portion thermally coupled to an electronic component. The first and the second heat transfer element conformally engage each other yet are removable from each other.

8. 发明授权

US06111748A Flat fan heat exchanger and use thereof in a computing device 失效
标题翻译：平板式热交换器及其在计算装置中的应用
公开(公告)号：US06111748A
公开(公告)日：2000-08-29
申请号：US857710
申请日：1997-05-15
申请人： Rakesh Bhatia
发明人： Rakesh Bhatia
IPC分类号： G06F1/20 , H01L23/467 , H05K7/20
CPC分类号： H05K7/20172 , F04D17/04 , G06F1/203 , H01L23/467 , H01L2924/0002
摘要： A fan heat exchanger. The heat exchanger includes a fan housing which defines a chamber as well as top and bottom closing surfaces for the chamber. A fan is mounted in the chamber and has a rotational axis substantially perpendicular to the bottom surface.
摘要翻译：风扇换热器。热交换器包括风扇壳体，其限定腔室以及腔室的顶部和底部关闭表面。风扇安装在室中并且具有基本上垂直于底表面的旋转轴线。

9. 发明授权

US6094347A Airflow heat exchanger for a portable electronic device and port replicator, docking station, or mini-docking station 有权
标题翻译：气流换热器，用于便携式电子设备和端口复制器，对接站或迷你扩展坞
公开(公告)号：US6094347A
公开(公告)日：2000-07-25
申请号：US226966
申请日：1999-01-08
申请人： Rakesh Bhatia
发明人： Rakesh Bhatia
IPC分类号： G06F1/16 , G06F1/20 , H05K7/20
CPC分类号： G06F1/203 , G06F1/1632
摘要： An airflow heat exchange apparatus. One embodiment includes a housing configured to removably mate with an electronic device. The housing has a vent on a substantially horizontal surface and a fan positioned to increase airflow through the electronic device when the electronic device is mated with the housing. An electronic connector is positioned to be electronically coupled to signal lines from the electronic device when the electronic device and housing are mated.
摘要翻译：气流热交换装置。一个实施例包括被配置为可移除地与电子设备配合的壳体。壳体在基本水平的表面上具有通风口，并且当电子设备与壳体配合时，定位成增加通过电子设备的气流的风扇。当电子设备和壳体配合时，电子连接器被定位成电子地耦合到来自电子设备的信号线。

10. 发明授权

US5718282A Heat pipe exchanger system for cooling a hinged computing device 失效
标题翻译：用于冷却铰接计算设备的热管交换器系统
公开(公告)号：US5718282A
公开(公告)日：1998-02-17
申请号：US758897
申请日：1996-12-02
申请人： Rakesh Bhatia , Kevin Haley
发明人： Rakesh Bhatia , Kevin Haley
IPC分类号： F28D15/02 , G06F1/16 , G06F1/20 , H05K7/20 , F28F5/00
CPC分类号： G06F1/203 , F28D15/02
摘要： A heat pipe exchanger system for cooling a hinged computing device. The hinged computing device includes a first hinged member having a first edge and second hinged member having a second edge. The first and second hinged members are rotatably attached along the first and second edge. A heat exchange sheath is mounted substantially parallel to the first and second edges and defines a first opening and a second opening. A first heat pipe is thermally coupled to the integrated circuit and has a portion disposed within the first opening. A second heat pipe is coupled to the display housing and has a portion disposed within the second housing. Alternately, the first heat pipe is coupled to the first hinged member and has a first portion substantially parallel to the first edge and the second edge. In this case, the second heat pipe is coupled to the second hinged member and has a first portion substantially perpendicular to the first heat pipe as well as a second portion conformally engaging the first heat pipe.
摘要翻译：一种用于冷却铰接式计算装置的热管交换器系统。铰接式计算装置包括具有第一边缘的第一铰链构件和具有第二边缘的第二铰接构件。第一和第二铰链构件沿着第一和第二边缘可旋转地附接。热交换护套基本上平行于第一和第二边缘安装并限定第一开口和第二开口。第一热管热耦合到集成电路并且具有设置在第一开口内的部分。第二热管连接到显示器壳体并且具有设置在第二壳体内的部分。或者，第一热管联接到第一铰接构件并且具有基本上平行于第一边缘和第二边缘的第一部分。在这种情况下，第二热管联接到第二铰链构件并且具有基本上垂直于第一热管的第一部分以及与第一热管保形接合的第二部分。

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