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    • 9. 发明授权
    • Photoresist compositions containing polyamides polybenzoxa from
bis((aminohydroxyphenyl)hexafluoroisopropyl)diphenyl ethers
    • 含有二((氨基羟基苯基)六氟异丙基)二苯基醚的聚酰胺聚苯并恶唑的光致抗蚀剂组合物
    • US5011753A
    • 1991-04-30
    • US476332
    • 1990-02-07
    • Werner H. MuellerDinesh N. Khanna
    • Werner H. MuellerDinesh N. Khanna
    • C08G69/26C08G69/32C08G73/22G02F1/1337G03F7/023G03F7/037H01B3/30
    • H01B3/303C08G69/26C08G69/32C08G73/22G02F1/133723G03F7/0233G03F7/037
    • Heat resistant, shapable, hydroxy and/or alkoxy-substituted polyamides derived from at least one diamine selected from unsubstituted and substituted 4,4'-bis[2-(4-amino-3-hydroxyphenyl)hexafluoroisopropyl)]diphenyl ether 4,4'-bis-[2-(3-amino-4-hydroxyphenyl)hexafluoroisopropyl]diphenyl ether and a dicarboxylic acid or a derivative thereof e.g. its acid halo or ester. The polyamides of the invention may be thermally cured to form polybenzoxazoles of higher heat resistance which are stable to hydrolytic, chemical and radiation attack.The polyamides of the invention may be formed into shaped articles by molding, extrusion and solvent casting processes preferably in the presence of a solvent or diluent and then optionally converted into heat resistant, insoluble polybenzoxazoles. These shaped articles are useful in aircraft, electronic and other commercial applications where heat, chemical and radiation resistance are desired in conjunction with good mechanical and electrical properties.
    • 衍生自至少一种选自未取代的和取代的4,4'-双[2-(4-氨基-3-羟基苯基)六氟异丙基)]二苯基醚4,4'-二胺的二胺的耐热,可成形的羟基和/或烷氧基取代的聚酰胺 ' - 双 - [2-(3-氨基-4-羟基苯基)六氟异丙基]二苯醚和二羧酸或其衍生物例如 其酸卤素或酯。 本发明的聚酰胺可以被热固化以形成对于水解,化学和辐射攻击是稳定的较高耐热性的聚苯并恶唑。 本发明的聚酰胺可以通过模制,挤出和溶剂浇铸方法形成成型制品,优选在溶剂或稀释剂的存在下,然后任选地转化成耐热不溶性聚苯并恶唑。 这些成型制品在飞机,电子和其他商业应用中是有用的,其中需要耐热,耐化学性和耐辐射性以及良好的机械和电学性能。
    • 10. 发明授权
    • Polyamide-polyamide-polyimide and polybenzoxazole-polyamide-polyimide
polymer having at least one fluorine-containing linking group
    • 具有至少一个含氟连接基团的聚酰胺 - 聚酰胺 - 聚酰亚胺和聚苯并恶唑 - 聚酰胺 - 聚酰亚胺聚合物
    • US4978733A
    • 1990-12-18
    • US321024
    • 1989-03-09
    • Dinesh N. Khanna
    • Dinesh N. Khanna
    • C08G73/14C08G73/22C08J3/09
    • C08J3/091C08G73/14C08G73/22C08J2379/08
    • The present invention provides polyamide-polyamide-polyimide and polybenzoxazole-polyamide-polyimide polymers derived therefrom with improved processing and film characteristics having incorporated into the polymeric backbone the polymeric condensation residuum of novel aromatic diamino compounds having the formula: ##STR1## wherein A is selected from the group consisting of SO.sub.2, O, S, CO, C.sub.1 to C.sub.6 alkylene, perfluoroalkylene or perfluoroarylalkylene having from 1 to 10 carbon atoms and a bond directly linking the two aromatic groups, and R is selected from the group consisting of hydrogen, hydroxy and C.sub.1 to C.sub.4 alkoxy.The PA-PA-PI polymers of this invention are prepared by reacting compounds of the above formula alone or admixed with other aromatic diamines, with carboxyphenyl trimellitimide or the acid halide or ester derivatives thereof, alone or admixed with one or more aromatic diacid chlorides and/or one or more aromatic tetracarboxylic acids or anhydrides thereof. Polybenzoxazole-polyamide-polyimide derivatives of such polymers are prepared utilizing compounds of the above formula wherein R is hydroxy or C.sub.1 to C.sub.4 alkoxy, and by subjecting the resulting alkoxy or hydroxy-substituted polyamide-polyamide-polyimide to a dehydrating and cyclizing reaction to form the oxazole linkage which gives rise to polybenzoxazole-polyamide-polyimide polymers.