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1. 发明授权

US4968780A Polyamide, polyimide, and polyamide-imide polymers of diamino-t-butylbenzene 失效
标题翻译：二氨基 - 叔丁基苯的聚酰胺，聚酰亚胺和聚酰胺 - 酰亚胺聚合物
公开(公告)号：US4968780A
公开(公告)日：1990-11-06
申请号：US514427
申请日：1990-04-25
申请人： David J. Fenoglio , Douglas E. Fjare , John L. Melquist , Edwin F. Morello , Neal R. Nowicki
发明人： David J. Fenoglio , Douglas E. Fjare , John L. Melquist , Edwin F. Morello , Neal R. Nowicki
IPC分类号： C08G69/32 , H05K1/03 , H05K3/00
CPC分类号： C08G69/32 , H05K1/0346 , H05K3/0017
摘要： Resinous condensation polymers of polycarboxylic acid compounds and aromatic diprimary amines comprising diamino-t-butylbenzens are described. In particular, film-forming polyamides, polyimides and polyamide-imides and their copolymers made using diamino-t-butylbenzenes which have amino groups meta or para to each other on a benzene ring are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high glass transition temperature, excellent thermal stability, and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.
摘要翻译：描述了包含二氨基叔丁基苯的聚羧酸化合物和芳族二胺的树脂缩合聚合物。特别地，描述了使用在苯环上彼此具有氨基或氨基的二氨基 - 叔丁基苯制备的成膜聚酰胺，聚酰亚胺和聚酰胺 - 酰亚胺及其共聚物。这些聚合物在有机溶剂如N-甲基吡咯烷酮中具有一定的溶解度，玻璃化转变温度高，热稳定性优异，并且可用于膜，纤维和复合材料，并且在电子工业中可用作电组件衬底，保护涂层，层间电介质和类似。

2. 发明授权

US4973659A Polyamide from diamino-t-butylbenzene 失效
标题翻译：来自二氨基叔丁基苯的聚酰胺
公开(公告)号：US4973659A
公开(公告)日：1990-11-27
申请号：US277756
申请日：1988-11-30
申请人： David J. Fenoglio , Douglas E. Fjare , John L. Melquist , Edwin F. Morello , Neal R. Nowicki
发明人： David J. Fenoglio , Douglas E. Fjare , John L. Melquist , Edwin F. Morello , Neal R. Nowicki
IPC分类号： C08G69/32 , H05K1/03 , H05K3/00
CPC分类号： C08G69/32 , H05K1/0346 , H05K3/0017
摘要： Resinous condensation polymers of polycarboxylic acid compounds and aromatic diprimary amines comprising diamino-t-butylbenzenes are described. In particular, film-forming polyamides, polyimides and polyamide-imides and their copolymers made using diamono-t-butylbenzenes which have amino groups meta or para to each other on a benzene ring are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high glass transition temperature, excellent thermal stability, and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.
摘要翻译：描述了包含二氨基叔丁基苯的聚羧酸化合物和芳族二胺的树脂缩聚物。特别地，描述了使用在苯环上彼此间隔或间隔氨基的二亚氨基叔丁基苯制备的成膜聚酰胺，聚酰亚胺和聚酰胺 - 酰亚胺及其共聚物。这些聚合物在有机溶剂如N-甲基吡咯烷酮中具有一定的溶解度，玻璃化转变温度高，热稳定性优异，并且可用于膜，纤维和复合材料，并且在电子工业中可用作电组件衬底，保护涂层，层间电介质和类似。

3. 发明授权

US4992527A Polyamide, polyimide, and polyamide-imide polymers of diamino-t-butylbenzene 失效
标题翻译：二氨基 - 叔丁基苯的聚酰胺，聚酰亚胺和聚酰胺 - 酰亚胺聚合物
公开(公告)号：US4992527A
公开(公告)日：1991-02-12
申请号：US557185
申请日：1990-07-23
申请人： David J. Fenoglio , Douglas E. Fjare , John L. Melquist , Edwin F. Morello , Neal R. Nowicki
发明人： David J. Fenoglio , Douglas E. Fjare , John L. Melquist , Edwin F. Morello , Neal R. Nowicki
IPC分类号： C08G69/32 , H05K1/03 , H05K3/00
CPC分类号： C08G69/32 , H05K1/0346 , H05K3/0017
摘要： Resinous condensation polymers of polycarboxylic acid compounds and aromatic diprimary amines comprising diamino-t-butylbenzenes are described. In particular, film-forming polyamides, polyimides and polyamide-imides and their copolymers made using diamino-t-butylbenzenes which have amino groups meta or para to each other on a benzene ring are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high glass transition temperature, excellent thermal stability, and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.
摘要翻译：描述了包含二氨基叔丁基苯的聚羧酸化合物和芳族二胺的树脂缩聚物。特别地，描述了使用在苯环上彼此具有氨基或氨基的二氨基 - 叔丁基苯制备的成膜聚酰胺，聚酰亚胺和聚酰胺 - 酰亚胺及其共聚物。这些聚合物在有机溶剂如N-甲基吡咯烷酮中具有一定的溶解度，玻璃化转变温度高，热稳定性优异，并且可用于膜，纤维和复合材料，并且在电子工业中可用作电组件衬底，保护涂层，层间电介质和类似。

4. 发明授权

US4946934A Polyamide from 3,5-diamino-t-butylbenzene 失效
标题翻译：聚酰胺由3,5-二氨基 - 叔丁基苯
公开(公告)号：US4946934A
公开(公告)日：1990-08-07
申请号：US212510
申请日：1988-06-28
申请人： David J. Fenoglio , Douglas E. Fjare , Edwin F. Morello , Neal R. Nowicki
发明人： David J. Fenoglio , Douglas E. Fjare , Edwin F. Morello , Neal R. Nowicki
IPC分类号： C08G69/32 , H05K1/03 , H05K3/00
CPC分类号： C08G69/32 , H05K1/0346 , H05K3/0017
摘要： Soluble, film-forming, polyamides, polyimides, and polyamide-imides and their copolymers made using 3,5-diamino-t-butylbenzene are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high Tg, excellent thermal stability, lower density and lower moisture uptake and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.
摘要翻译：描述了可溶性，成膜，聚酰胺，聚酰亚胺和聚酰胺 - 酰亚胺及其使用3,5-二氨基 - 叔丁基苯制备的共聚物。这些聚合物在诸如N-甲基吡咯烷酮的有机溶剂中具有一定的溶解度，Tg高，热稳定性优异，密度低，吸湿性更低，并且可用于膜，纤维和复合材料，并且在电子工业中用作电子元件基材，保护涂层，层间电介质等。

5. 发明授权

US4876329A Polyimide polymers and copolymers using 3,5-diaminobenzotrifluoride 失效
标题翻译：使用3,5-二氨基三氟甲苯的聚酰亚胺聚合物和共聚物
公开(公告)号：US4876329A
公开(公告)日：1989-10-24
申请号：US212508
申请日：1988-06-28
申请人： Weilong L. Chiang , Douglas E. Fjare , Neal R. Nowicki
发明人： Weilong L. Chiang , Douglas E. Fjare , Neal R. Nowicki
IPC分类号： C08G73/10
CPC分类号： C08G73/1039 , C08G73/1042 , C08G73/1067 , C08G73/1071
摘要： Partially soluble, film-forming polyimides and their copolymers made using 3,5-diaminobenzotrifluoride are described. Thin films and coatings of these materials are relatively colorless and the polymers have a high Tg, excellent thermal stability, lower moisture uptake, and lower dielectric constant. They are useful as films, fibers, molded articles and as protective coatings, interlevel dielectrics, electric circuit substrates and the like for the electronics industry.
摘要翻译：描述了使用3,5-二氨基三氟甲苯制备的部分可溶性成膜聚酰亚胺及其共聚物。这些材料的薄膜和涂层是相对无色的，聚合物具有高Tg，优异的热稳定性，较低的吸湿性和较低的介电常数。它们作为电子工业的薄膜，纤维，模制品以及作为保护涂层，层间电介质，电路基板等是有用的。

6. 发明授权

US5089593A Polyimide containing 4,4'-bis(4-amino-2-trifluoromethylphenoxy)-biphenyl moieties 失效
标题翻译：含有4,4'-双（4-氨基-2-三氟甲基苯氧基） - 联苯部分的聚酰亚胺
公开(公告)号：US5089593A
公开(公告)日：1992-02-18
申请号：US463147
申请日：1989-12-22
申请人： Douglas E. Fjare , Neal R. Nowicki
发明人： Douglas E. Fjare , Neal R. Nowicki
IPC分类号： B32B15/088 , B32B15/08 , B32B27/34 , C08G73/10 , C09D179/08 , H01B3/30 , H05K1/03 , H05K3/28 , H05K3/46
CPC分类号： C08G73/1042 , C08G73/105 , C08G73/1067 , C08G73/1071 , H01B3/306 , H05K1/0346 , Y10T428/31721
摘要： Polyimides useful in multilayer electronic devices containing the 4,4'-bis(4-amino-2-trifluoromethylphenoxy) biphenyl moiety have low dielectric constants, low moisture uptake, high thermal degradation stability, low glass transition temperature.
摘要翻译：可用于含有4,4'-双（4-氨基-2-三氟甲基苯氧基）联苯部分的多层电子器件的聚酰亚胺具有低介电常数，低吸湿性，高热降解稳定性，低玻璃化转变温度。

7. 发明授权

US4975521A Polyamide, polyimide, and polyamide-imide polymers and copolymers using 3,5-diamino-t-butylbenzene 失效
标题翻译：使用3,5-二氨基 - 叔丁基苯的聚酰胺，聚酰亚胺和聚酰胺 - 酰亚胺聚合物和共聚物
公开(公告)号：US4975521A
公开(公告)日：1990-12-04
申请号：US509165
申请日：1990-04-16
申请人： Douglas E. Fjare , Neal R. Nowicki
发明人： Douglas E. Fjare , Neal R. Nowicki
IPC分类号： C08G69/32 , H05K1/03 , H05K3/00
CPC分类号： C08G69/32 , H05K1/0346 , H05K3/0017
摘要： Soluble, film-forming, polyamides, polyimides, and polyamide-imides and their copolymers made using 3,5-diamino-t-butylbenzene are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high Tg, excellent thermal stability, lower density and lower moisture uptake and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.
摘要翻译：描述了可溶性，成膜，聚酰胺，聚酰亚胺和聚酰胺 - 酰亚胺及其使用3,5-二氨基 - 叔丁基苯制备的共聚物。这些聚合物在诸如N-甲基吡咯烷酮的有机溶剂中具有一定的溶解度，Tg高，热稳定性优异，密度低，吸湿性更低，并且可用于膜，纤维和复合材料，并且在电子工业中用作电子元件基材，保护涂层，层间电介质等。

8. 发明授权

US5268193A Low dielectric constant, low moisture uptake polyimides and copolyimides for interlevel dielectrics and substrate coatings 失效
标题翻译：低介电常数，低吸湿聚酰亚胺和共聚酰亚胺，用于层间电介质和基底涂层
公开(公告)号：US5268193A
公开(公告)日：1993-12-07
申请号：US947380
申请日：1992-09-18
申请人： Allyson J. Beuhler , Neal R. Nowicki , Douglas E. Fjare
发明人： Allyson J. Beuhler , Neal R. Nowicki , Douglas E. Fjare
IPC分类号： C08G73/10 , H05K1/03 , B05D5/12
CPC分类号： H05K1/0346 , C08G73/105 , C08G73/1071
摘要： A group of polyimides and copolyimides made from 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) or 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride (IPAN) their acid or ester forms and selected aromatic diamines are disclosed which are useful for substrate coatings and interlevel dielectrics in on-chip and multi-chip package applications. In such applications these polymers exhibit lower dielectric constant, lower moisture uptake and reduced dielectric constant variation with temperature and humidity than existing polymers, yet they are both thermally stable at required processing temperatures and can form suitably adherent, pinhole-free coatings on electronic component substrates.
摘要翻译：一组由2,2-双（3,4-二羧基苯基）六氟丙烷二酐（6FDA）或2,2-双（3,4-二羧基苯基）丙烷二酐（IPAN））制成的聚酰亚胺和共聚酰亚胺形成并选择公开了芳族二胺，其可用于片上和多芯片封装应用中的衬底涂层和层间电介质。在这些应用中，这些聚合物表现出比现有聚合物更低的介电常数，更低的吸湿性和降低的温度和湿度的介电常数变化，但它们在所需的加工温度下都是热稳定的，并且可以在电子部件基底上形成适当粘附的无针孔涂层。

9. 发明授权

US5206091A Low dielectric constant, low moisture uptake polyimides and copolyimides for interlevel dielectrics and substrate coatings 失效
标题翻译：低介电常数，低吸湿聚酰亚胺和共聚酰亚胺，用于层间电介质和基底涂层
公开(公告)号：US5206091A
公开(公告)日：1993-04-27
申请号：US436301
申请日：1989-11-13
申请人： Allyson J. Beuhler , Neal R. Nowicki , Douglas E. Fjare
发明人： Allyson J. Beuhler , Neal R. Nowicki , Douglas E. Fjare
IPC分类号： C08G73/10 , H05K1/03
CPC分类号： C08G73/105 , C08G73/1071 , H05K1/0346 , Y10T428/31681 , Y10T428/31721
摘要： A group of polyimides and copolyimides made from 6FDA, IPAN, or their acid or ester forms, and selected aromatic diamines are disclosed which are useful for substrate coatings and interlevel dielectrics in on-chip and multi-chip package applications. In such applications these polymers exhibit lower dielectric constant, lower moisture uptake and reduced dielectric constant variation with temperature and humidity than existing polymers, yet they are both thermally stable at required processing temperatures and can form suitably adherent, pinhole-free coatings on electronic component substrates.
摘要翻译：公开了一组由6FDA，IPAN或其酸或酯形式制备的聚酰亚胺和共聚酰亚胺，以及选择的芳族二胺，其可用于片上和多芯片封装应用中的底物涂层和层间电介质。在这些应用中，这些聚合物表现出比现有聚合物更低的介电常数，更低的吸湿性和降低的温度和湿度的介电常数变化，但它们在所需的加工温度下都是热稳定的，并且可以在电子部件基底上形成适当粘附的无针孔涂层。

10. 发明授权

US4822527A Process for preparation of anthraquinones and fluorenones 失效
标题翻译：制备蒽醌和芴酮的方法
公开(公告)号：US4822527A
公开(公告)日：1989-04-18
申请号：US134839
申请日：1987-12-14
申请人： David E. James , Neal R. Nowicki
发明人： David E. James , Neal R. Nowicki
IPC分类号： C07C50/18 , C07C45/00
CPC分类号： C07C50/18 , Y02P20/584
摘要： A process is disclosed for producing cyclized aromatic compounds by the liquid-phase air oxidation of 2-methyl-substituted biphenyls and diphenylmethanes in an acetic acid medium in the presence of a cobalt-manganese-bromine catalyst or a zirconium-cobalt-manganese-bromine catalyst wherein the mole ratio of cobalt-to-manganese is about 1.0:0.1 to about 1.0:10.0 and the ratio of zirconium-to-cobalt is about 0.005:1.0 to about 0.20:1.0, and mole ratio of bromine to total metals of said cobalt-manganese-bromine catalyst or zirconium-cobalt-manganese-bromine catalyst is from about 0.2:1.0 to about 20.0:1.0, which process comprises conducting the reaction in a batch process at a temperature of from 75.degree. C. to about 250.degree. C. at a pressure of from 1 to 100 atmospheres, or continuously in two stages comprising a first-stage reaction at a temperature of about 75.degree. C. to about 200.degree. C. and a second-stage reaction at a temperature of about 150.degree. C. to about 250.degree. C. and recycling the cobalt-manganese catalyst or the zircnium-cobalt-manganese catalyst by oxalate precipitation of the catalyst at temperatures of about 110.degree. C. to about 200.degree. C. prior to the separation of mother liquor and using about 0.25 to about 2.5 moles of oxalic acid per mole of cobalt and manganese or mole of zirconium-cobalt-manganese and continuously recycling the recovered catalyst metals to the oxidation stages. The products of this novel process, anthraquinones and fluorenones, are useful for the manufacture of dyestuffs and pharmaceuticals.
摘要翻译：公开了在钴锰溴催化剂或锆 - 钴 - 锰 - 溴存在下，通过在乙酸介质中通过2-甲基取代的联苯和二苯基甲烷的液相空气氧化来生产环化芳族化合物的方法催化剂，其中钴与锰的摩尔比为约1.0:0.1至约1.0:10.0，锆与钴的摩尔比为约0.005:1.0至约0.20:1.0，溴与总金属的摩尔比为所述钴 - 锰 - 溴催化剂或锆 - 钴 - 锰 - 溴催化剂的量为约0.2:1.0至约20.0:1.0，该方法包括在75℃至约250℃的间歇过程中进行反应在1〜100个大气压的压力下，或者在约75℃至约200℃的温度下包括第一阶段反应的两个阶段的连续两个阶段，以及在约 150℃至约250℃并回收钴锰催化剂或锆 - 钴 - 锰催化剂，在母液分离之前，在约110℃至约200℃的温度下草酸盐沉淀催化剂，并使用约0.25至约2.5摩尔的草酸每摩尔钴和锰或摩尔的锆 - 钴 - 锰，并将回收的催化剂金属连续循环到氧化阶段。该新方法的产物，蒽醌和芴酮可用于制造染料和药物。

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