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1. 发明授权

US4973659A Polyamide from diamino-t-butylbenzene 失效
标题翻译：来自二氨基叔丁基苯的聚酰胺
公开(公告)号：US4973659A
公开(公告)日：1990-11-27
申请号：US277756
申请日：1988-11-30
申请人： David J. Fenoglio , Douglas E. Fjare , John L. Melquist , Edwin F. Morello , Neal R. Nowicki
发明人： David J. Fenoglio , Douglas E. Fjare , John L. Melquist , Edwin F. Morello , Neal R. Nowicki
IPC分类号： C08G69/32 , H05K1/03 , H05K3/00
CPC分类号： C08G69/32 , H05K1/0346 , H05K3/0017
摘要： Resinous condensation polymers of polycarboxylic acid compounds and aromatic diprimary amines comprising diamino-t-butylbenzenes are described. In particular, film-forming polyamides, polyimides and polyamide-imides and their copolymers made using diamono-t-butylbenzenes which have amino groups meta or para to each other on a benzene ring are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high glass transition temperature, excellent thermal stability, and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.
摘要翻译：描述了包含二氨基叔丁基苯的聚羧酸化合物和芳族二胺的树脂缩聚物。特别地，描述了使用在苯环上彼此间隔或间隔氨基的二亚氨基叔丁基苯制备的成膜聚酰胺，聚酰亚胺和聚酰胺 - 酰亚胺及其共聚物。这些聚合物在有机溶剂如N-甲基吡咯烷酮中具有一定的溶解度，玻璃化转变温度高，热稳定性优异，并且可用于膜，纤维和复合材料，并且在电子工业中可用作电组件衬底，保护涂层，层间电介质和类似。

2. 发明授权

US4968780A Polyamide, polyimide, and polyamide-imide polymers of diamino-t-butylbenzene 失效
标题翻译：二氨基 - 叔丁基苯的聚酰胺，聚酰亚胺和聚酰胺 - 酰亚胺聚合物
公开(公告)号：US4968780A
公开(公告)日：1990-11-06
申请号：US514427
申请日：1990-04-25
申请人： David J. Fenoglio , Douglas E. Fjare , John L. Melquist , Edwin F. Morello , Neal R. Nowicki
发明人： David J. Fenoglio , Douglas E. Fjare , John L. Melquist , Edwin F. Morello , Neal R. Nowicki
IPC分类号： C08G69/32 , H05K1/03 , H05K3/00
CPC分类号： C08G69/32 , H05K1/0346 , H05K3/0017
摘要： Resinous condensation polymers of polycarboxylic acid compounds and aromatic diprimary amines comprising diamino-t-butylbenzens are described. In particular, film-forming polyamides, polyimides and polyamide-imides and their copolymers made using diamino-t-butylbenzenes which have amino groups meta or para to each other on a benzene ring are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high glass transition temperature, excellent thermal stability, and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.
摘要翻译：描述了包含二氨基叔丁基苯的聚羧酸化合物和芳族二胺的树脂缩合聚合物。特别地，描述了使用在苯环上彼此具有氨基或氨基的二氨基 - 叔丁基苯制备的成膜聚酰胺，聚酰亚胺和聚酰胺 - 酰亚胺及其共聚物。这些聚合物在有机溶剂如N-甲基吡咯烷酮中具有一定的溶解度，玻璃化转变温度高，热稳定性优异，并且可用于膜，纤维和复合材料，并且在电子工业中可用作电组件衬底，保护涂层，层间电介质和类似。

3. 发明授权

US4992527A Polyamide, polyimide, and polyamide-imide polymers of diamino-t-butylbenzene 失效
标题翻译：二氨基 - 叔丁基苯的聚酰胺，聚酰亚胺和聚酰胺 - 酰亚胺聚合物
公开(公告)号：US4992527A
公开(公告)日：1991-02-12
申请号：US557185
申请日：1990-07-23
申请人： David J. Fenoglio , Douglas E. Fjare , John L. Melquist , Edwin F. Morello , Neal R. Nowicki
发明人： David J. Fenoglio , Douglas E. Fjare , John L. Melquist , Edwin F. Morello , Neal R. Nowicki
IPC分类号： C08G69/32 , H05K1/03 , H05K3/00
CPC分类号： C08G69/32 , H05K1/0346 , H05K3/0017
摘要： Resinous condensation polymers of polycarboxylic acid compounds and aromatic diprimary amines comprising diamino-t-butylbenzenes are described. In particular, film-forming polyamides, polyimides and polyamide-imides and their copolymers made using diamino-t-butylbenzenes which have amino groups meta or para to each other on a benzene ring are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high glass transition temperature, excellent thermal stability, and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.
摘要翻译：描述了包含二氨基叔丁基苯的聚羧酸化合物和芳族二胺的树脂缩聚物。特别地，描述了使用在苯环上彼此具有氨基或氨基的二氨基 - 叔丁基苯制备的成膜聚酰胺，聚酰亚胺和聚酰胺 - 酰亚胺及其共聚物。这些聚合物在有机溶剂如N-甲基吡咯烷酮中具有一定的溶解度，玻璃化转变温度高，热稳定性优异，并且可用于膜，纤维和复合材料，并且在电子工业中可用作电组件衬底，保护涂层，层间电介质和类似。

4. 发明授权

US4946934A Polyamide from 3,5-diamino-t-butylbenzene 失效
标题翻译：聚酰胺由3,5-二氨基 - 叔丁基苯
公开(公告)号：US4946934A
公开(公告)日：1990-08-07
申请号：US212510
申请日：1988-06-28
申请人： David J. Fenoglio , Douglas E. Fjare , Edwin F. Morello , Neal R. Nowicki
发明人： David J. Fenoglio , Douglas E. Fjare , Edwin F. Morello , Neal R. Nowicki
IPC分类号： C08G69/32 , H05K1/03 , H05K3/00
CPC分类号： C08G69/32 , H05K1/0346 , H05K3/0017
摘要： Soluble, film-forming, polyamides, polyimides, and polyamide-imides and their copolymers made using 3,5-diamino-t-butylbenzene are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high Tg, excellent thermal stability, lower density and lower moisture uptake and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.
摘要翻译：描述了可溶性，成膜，聚酰胺，聚酰亚胺和聚酰胺 - 酰亚胺及其使用3,5-二氨基 - 叔丁基苯制备的共聚物。这些聚合物在诸如N-甲基吡咯烷酮的有机溶剂中具有一定的溶解度，Tg高，热稳定性优异，密度低，吸湿性更低，并且可用于膜，纤维和复合材料，并且在电子工业中用作电子元件基材，保护涂层，层间电介质等。

5. 发明授权

US5003037A Polyamide, polyimide, and polyamide-imide polymers and copolymers using 3, 5-diamino-t-butylbenzene 失效
标题翻译：使用3,5-二氨基 - 叔丁基苯的聚酰胺，聚酰亚胺和聚酰胺 - 酰亚胺聚合物和共聚物
公开(公告)号：US5003037A
公开(公告)日：1991-03-26
申请号：US562621
申请日：1990-08-03
申请人： David J. Fenoglio , Douglas E. Fjare , Edwin F. Morello , Neal B. Nowicki
发明人： David J. Fenoglio , Douglas E. Fjare , Edwin F. Morello , Neal B. Nowicki
IPC分类号： C08G69/32 , H05K1/03 , H05K3/00
CPC分类号： C08G69/32 , H05K1/0346 , H05K3/0017
摘要： Soluble, film-forming, polyamides, polyimides, and polyamide-imides and their copolymers made using 3,5-diamino-t-butylbenzene are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high Tg, excellent thermal stability, lower density and lower moisture uptake and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.
摘要翻译：描述了可溶性，成膜，聚酰胺，聚酰亚胺和聚酰胺 - 酰亚胺及其使用3,5-二氨基 - 叔丁基苯制备的共聚物。这些聚合物在诸如N-甲基吡咯烷酮的有机溶剂中具有一定的溶解度，Tg高，热稳定性优异，密度低，吸湿性更低，并且可用于膜，纤维和复合材料，并且在电子工业中用作电子元件基材，保护涂层，层间电介质等。

6. 发明授权

US4418189A Polyamides from itaconic acid and diamines 失效
标题翻译：来自衣康酸和二胺的聚酰胺
公开(公告)号：US4418189A
公开(公告)日：1983-11-29
申请号：US211587
申请日：1980-12-01
申请人： Edwin F. Morello
发明人： Edwin F. Morello
IPC分类号： C08G69/26
CPC分类号： C08G69/26 , Y10T428/31721 , Y10T428/31725
摘要： Novel polyamides are prepared from itaconic acid and diamines. These polyamides are useful as molded objects, fibers, films, laminates and coatings.
摘要翻译：由衣康酸和二胺制备新型聚酰胺。这些聚酰胺可用作模塑物品，纤维，薄膜，层压材料和涂料。

7. 发明授权

US4186263A Injection moldable amide-imide terpolymers containing divalent aromatic quinone radicals 失效
标题翻译：含有二价芳族醌基的注塑成型酰胺 - 酰亚胺三元共聚物
公开(公告)号：US4186263A
公开(公告)日：1980-01-29
申请号：US947087
申请日：1978-09-29
申请人： Edwin F. Morello
发明人： Edwin F. Morello
IPC分类号： C08G73/14 , C08G73/10 , C08G73/16
CPC分类号： C08G73/14
摘要： Novel terpolymers of the amide-imide type are prepared from tricarboxylic-acid-anhydride derivatives, aromatic diamino quinones and two other wholly-aromatic primary diamines. The novel terpolymers are useful for preparing molded articles of superior properties at injection molding temperatures lower than required for molding the amide-imide copolymers disclosed in the prior art.
摘要翻译：酰胺 - 酰亚胺型的新型三元共聚物由三羧酸酐衍生物，芳族二氨基醌和两种其它全芳族伯二胺制备。新颖的三元共聚物可用于制备在注塑温度低于现有技术中公开的酰胺 - 酰亚胺共聚物成型所需的注塑温度下具有优异性能的模塑制品。

8. 发明授权

US4420608A Polyamides from itaconic acid and diamines 失效
标题翻译：来自衣康酸和二胺的聚酰胺
公开(公告)号：US4420608A
公开(公告)日：1983-12-13
申请号：US327605
申请日：1981-12-04
申请人： Edwin F. Morello
发明人： Edwin F. Morello
IPC分类号： C08G69/26 , C08G69/14
CPC分类号： C08G69/26
摘要： Novel polyamides are prepared for itaconic acid, other diacids and diamines. These polyamides are useful as molded objects, fibers, films, laminates and coatings.
摘要翻译：为衣康酸，其他二酸和二胺制备新型聚酰胺。这些聚酰胺可用作模塑物品，纤维，薄膜，层压材料和涂料。

9. 发明授权

US4016140A Amide-imide copolymer moldings and method of preparation 失效
标题翻译：酰亚胺共聚物模塑料及其制备方法
公开(公告)号：US4016140A
公开(公告)日：1977-04-05
申请号：US537255
申请日：1974-12-30
申请人： Edwin F. Morello
发明人： Edwin F. Morello
IPC分类号： C08G73/14 , B29F5/00
CPC分类号： C08G73/14 , Y10S264/65
摘要： Copolymers of the amide-imide variety are made from a mixture of two or more largely- or wholly-aromatic primary diamines and an aromatic polycarboxylic-acid-anhydride derivative. A process for fabricating molded articles from these copolymers is described which comprises heat treating the copolymers from about 300.degree. to about 700.degree. F. and then applying a pressure of about 200 p.s.i. to about 30,000 p.s.i. to said partially cured material which has been preheated to a temperature within the range of about 200.degree. to about 750.degree. F. and subsequentlyejecting the coalesced polyamide-imide in the form of a shaped article.
摘要翻译：酰胺 - 酰亚胺衍生物的共聚物由两种或多种主要或全部芳族伯二胺和芳族多元羧酸酐衍生物的混合物制成。描述了由这些共聚物制造模塑制品的方法，该方法包括将共聚物热处理约300至约700°F，然后施加约200p.s.i的压力。至约30,000 p.s.i 所述部分固化的材料已被预热至约200至约750°F的温度，随后将成形制品形式的聚结聚酰胺 - 酰亚胺喷射。

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