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1. 发明授权

US07450378B2 Power module having self-contained cooling system 有权
标题翻译：电源模块具有独立的冷却系统
公开(公告)号：US07450378B2
公开(公告)日：2008-11-11
申请号：US11552564
申请日：2006-10-25
申请人： David F. Nelson , James M. Nagashima , Peter J. Savagian , Gregory S. Smith
发明人： David F. Nelson , James M. Nagashima , Peter J. Savagian , Gregory S. Smith
IPC分类号： H05K7/20 , H01L23/36
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor module comprises a housing having a cavity therein, and at least one semiconductor device residing within the cavity. A cooling system is contained within the housing and comprises a dielectric fluid disposed within the housing and a flow passageway disposed through the housing. The flow passageway is fluidly coupled to the cavity, and the cooling system is configured to circulate the dielectric fluid through the flow passageway and onto the at least one semiconductor device.
摘要翻译：半导体模块包括其中具有空腔的壳体和位于空腔内的至少一个半导体器件。冷却系统被容纳在壳体内并且包括设置在壳体内的介电流体和设置穿过壳体的流动通道。流动通道流体地联接到空腔，并且冷却系统被配置为使介电流体通过流动通道循环到至少一个半导体器件上。

2. 发明申请

US20080101013A1 POWER MODULE HAVING SELF-CONTAINED COOLING SYSTEM 有权
标题翻译：具有自含冷却系统的电源模块
公开(公告)号：US20080101013A1
公开(公告)日：2008-05-01
申请号：US11552564
申请日：2006-10-25
申请人： David F. Nelson , James M. Nagashima , Peter J. Savagian , Gregory S. Smith
发明人： David F. Nelson , James M. Nagashima , Peter J. Savagian , Gregory S. Smith
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor module comprises a housing having a cavity therein, and at least one semiconductor device residing within the cavity. A cooling system is contained within the housing and comprises a dielectric fluid disposed within the housing and a flow passageway disposed through the housing. The flow passageway is fluidly coupled to the cavity, and the cooling system is configured to circulate the dielectric fluid through the flow passageway and onto the at least one semiconductor device.
摘要翻译：半导体模块包括其中具有空腔的壳体和位于空腔内的至少一个半导体器件。冷却系统被容纳在壳体内并且包括设置在壳体内的介电流体和设置穿过壳体的流动通道。流动通道流体地联接到空腔，并且冷却系统被配置为使介电流体通过流动通道循环到至少一个半导体器件上。

3. 发明授权

US07973433B2 Power electronics devices with integrated gate drive circuitry 有权
标题翻译：具有集成栅极驱动电路的电力电子设备
公开(公告)号：US07973433B2
公开(公告)日：2011-07-05
申请号：US12178847
申请日：2008-07-24
申请人： David F. Nelson , George John , Gregory S. Smith , David Tang , James M. Nagashima , Gabriel Gallegos-Lopez
发明人： David F. Nelson , George John , Gregory S. Smith , David Tang , James M. Nagashima , Gabriel Gallegos-Lopez
IPC分类号： H01H9/54 , H01H33/59 , H01H47/00 , H01H85/46 , H01H3/26 , H01H3/28
CPC分类号： B60K6/48 , B60K2001/003 , B60L2240/36 , H01L24/48 , H01L2224/48227 , H01L2224/4846 , H01L2224/48472 , H01L2224/73265 , H01L2924/00014 , H01L2924/12041 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/19105 , H05K7/20854 , Y02T10/6221 , Y10T307/944 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A power switch apparatus includes a substrate; a semiconductor die mounted on the substrate and including power electronics circuitry for a high power, alternating current motor application; and gate drive circuitry mounted on the substrate and electrically coupled to the power electronics circuitry on the semiconductor die.
摘要翻译：电源开关装置包括：基板; 安装在基板上的半导体管芯，并且包括用于高功率，交流电动机应用的电力电子电路; 以及栅极驱动电路，其安装在所述基板上并电耦合到所述半导体管芯上的所述电力电子电路。

4. 发明授权

US08139371B2 Power electronics devices with integrated control circuitry 有权
标题翻译：具有集成控制电路的电力电子设备
公开(公告)号：US08139371B2
公开(公告)日：2012-03-20
申请号：US12178478
申请日：2008-07-23
申请人： David F. Nelson , George John , Gregory S. Smith , David Tang , James M. Nagashima , Gabriel Gallegos-Lopez
发明人： David F. Nelson , George John , Gregory S. Smith , David Tang , James M. Nagashima , Gabriel Gallegos-Lopez
IPC分类号： H05K7/00
CPC分类号： H03K17/567 , H01L2224/48227 , H01L2224/4846 , H01L2224/48472 , H01L2224/73265 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/3025 , H05K1/181 , H05K3/4061 , H05K7/1432 , H05K7/20936 , H05K2201/0723 , H05K2201/10166 , H05K2203/1572 , Y02P70/611 , H01L2924/00012 , H01L2924/00
摘要： A power switch apparatus includes a substrate; a semiconductor die mounted on the substrate and including power electronics circuitry for a high power, alternating current motor application; gate drive circuitry mounted on the substrate and electrically coupled to the power electronics circuitry on the semiconductor die; and control circuitry mounted on the substrate and electrically coupled to the gate drive circuitry.
摘要翻译：电源开关装置包括：基板; 安装在基板上的半导体管芯，并且包括用于高功率，交流电动机应用的电力电子电路; 栅极驱动电路，其安装在所述衬底上并电耦合到所述半导体管芯上的所述电力电子电路; 以及安装在基板上并电耦合到栅极驱动电路的控制电路。

5. 发明授权

US07723874B2 Cooling systems and methods for integration electric motor-inverters 有权
标题翻译：集成电动机逆变器的冷却系统和方法
公开(公告)号：US07723874B2
公开(公告)日：2010-05-25
申请号：US12032359
申请日：2008-02-15
申请人： George R. Woody , Karl D. Conroy , James M. Nagashima , David F. Nelson , Eric R. Ostrom , Gregory S. Smith
发明人： George R. Woody , Karl D. Conroy , James M. Nagashima , David F. Nelson , Eric R. Ostrom , Gregory S. Smith
IPC分类号： H02K9/00
CPC分类号： H02K9/20
摘要： Cooling systems and methods are provided for an integrated electric motor-inverter, where the integrated electric motor-inverter includes a housing, a motor, and an inverter, the motor and the inverter are disposed within the housing, and the motor includes a stator. The system includes a cooling jacket, a first coolant, a condenser, a spray head, and a second coolant. The cooling jacket is disposed concentric to the stator and includes an inner wall and an outer wall. The inner wall is in direct contact with the stator. The first coolant is disposed between the cooling jacket inner and outer walls. The condenser is disposed concentric to the cooling jacket. The spray head is disposed adjacent the inverter. The second coolant is in flow communication with the spray head.
摘要翻译：为集成电动机 - 逆变器提供冷却系统和方法，其中集成电动机 - 逆变器包括壳体，电动机和逆变器，电动机和逆变器设置在壳体内，并且电动机包括定子。该系统包括冷却套，第一冷却剂，冷凝器，喷头和第二冷却剂。冷却套与所述定子同心地设置，并且包括内壁和外壁。内壁与定子直接接触。第一冷却剂设置在冷却套内壁和外壁之间。冷凝器与冷却套筒同心设置。喷头靠近逆变器设置。第二冷却剂与喷头流体连通。

6. 发明授权

US08400775B2 Capacitor with direct DC connection to substrate 有权
标题翻译：直接与基板直接连接的电容器
公开(公告)号：US08400775B2
公开(公告)日：2013-03-19
申请号：US11774329
申请日：2007-07-06
申请人： Terence G. Ward , George John , Edward P. Yankoski , David F. Nelson , Gregory S. Smith , James M. Nagashima
发明人： Terence G. Ward , George John , Edward P. Yankoski , David F. Nelson , Gregory S. Smith , James M. Nagashima
IPC分类号： H05K1/18
CPC分类号： H02M7/003
摘要： A subcomponent is provided for a power inverter module. The apparatus comprises a capacitor having a terminal and integrated into a housing. A substrate is mounted on the housing. The substrate incorporates a power semiconductor switch and has at least one direct current (DC) tab. The direct current tab is directly connected to the terminal of the capacitor.
摘要翻译：为功率逆变器模块提供了一个子部件。该装置包括具有端子并且集成到壳体中的电容器。衬底安装在壳体上。该基板包括功率半导体开关，并具有至少一个直流（DC）接头。直流标签直接连接到电容器的端子。

7. 发明申请

US20090009980A1 CAPACITOR WITH DIRECT DC CONNECTION TO SUBSTRATE 有权
标题翻译：直接与基板直流连接的电容器
公开(公告)号：US20090009980A1
公开(公告)日：2009-01-08
申请号：US11774329
申请日：2007-07-06
申请人： Terence G. Ward , George John , Edward P. Yankoski , David F. Nelson , Gregory S. Smith , James M. Nagashima
发明人： Terence G. Ward , George John , Edward P. Yankoski , David F. Nelson , Gregory S. Smith , James M. Nagashima
IPC分类号： H05K7/00 , H02M7/5387 , H05K1/00
CPC分类号： H02M7/003
摘要： A subcomponent is provided for a power inverter module. The apparatus comprises a capacitor having a terminal and integrated into a housing. A substrate is mounted on the housing. The substrate incorporates a power semiconductor switch and has at least one direct current (DC) tab. The direct current tab is directly connected to the terminal of the capacitor.
摘要翻译：为功率逆变器模块提供一个子部件。该装置包括具有端子并且集成到壳体中的电容器。衬底安装在壳体上。该基板包括功率半导体开关，并具有至少一个直流（DC）接头。直流标签直接连接到电容器的端子。

8. 发明授权

US08462529B2 Power converter assembly with symmetrical layout of power modules 有权
标题翻译：功率转换器组件，功率模块对称布局
公开(公告)号：US08462529B2
公开(公告)日：2013-06-11
申请号：US12178865
申请日：2008-07-24
申请人： Terence G. Ward , Gregory S. Smith , George John , David F. Nelson
发明人： Terence G. Ward , Gregory S. Smith , George John , David F. Nelson
IPC分类号： H02M7/537
CPC分类号： B60L11/14 , B60L3/003 , B60L3/0061 , B60L11/00 , B60L15/007 , B60L2240/36 , H01L25/18 , H01L2924/0002 , H02K11/048 , Y02T10/641 , Y02T10/645 , Y02T10/70 , Y02T10/7077 , H01L2924/00
摘要： A power converter assembly is provided. The power converter assembly includes first, second, and third power modules. The second power module is coupled to the first power module such that the second power module is separated from the first power module by a first distance. The third power module is coupled to the first and second power modules such that the third power module is separated from the second power module by a second distance and is separated from the first power module by a third distance. The first, second, and third distances are substantially the same.
摘要翻译：提供功率转换器组件。功率转换器组件包括第一，第二和第三功率模块。第二功率模块耦合到第一功率模块，使得第二功率模块与第一功率模块分离第一距离。第三功率模块耦合到第一和第二功率模块，使得第三功率模块与第二功率模块分离第二距离并且与第一功率模块分离第三距离。第一，第二和第三距离基本相同。

9. 发明授权

US07884468B2 Cooling systems for power semiconductor devices 有权
标题翻译：功率半导体器件的冷却系统
公开(公告)号：US07884468B2
公开(公告)日：2011-02-08
申请号：US12178489
申请日：2008-07-23
申请人： Brooks S Mann , George R. Woody , Terence G. Ward , David F. Nelson
发明人： Brooks S Mann , George R. Woody , Terence G. Ward , David F. Nelson
IPC分类号： H01L23/34
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A cooling device is provided for liquid cooling a power semiconductor device. The device includes a coolant diverter for guiding liquid coolant to the power semiconductor device. The coolant diverter has a first plate for dividing the coolant diverter into a first cavity and a second cavity. The second cavity positioned adjacent the power semiconductor device. The first plate further includes an opening to fluidly couple the first cavity with the second cavity such that the liquid coolant flows into the first cavity, through the opening in the first plate, and into the second cavity to cool the power semiconductor device. The first cavity has a cross-sectional area that generally decreases in a downstream direction, and the second cavity has a cross-sectional area that generally increases in the downstream direction.
摘要翻译：提供一种用于液体冷却功率半导体器件的冷却装置。该装置包括用于将液体冷却剂引导到功率半导体器件的冷却剂分流器。冷却剂分流器具有用于将冷却剂分流器分成第一腔和第二腔的第一板。位于功率半导体器件附近的第二腔。第一板还包括用于将第一空腔与第二空腔流体耦合的开口，使得液体冷却剂通过第一板中的开口流入第一空腔，并进入第二腔以冷却功率半导体器件。第一腔体具有在下游方向上大致减小的横截面积，并且第二腔体具有在下游方向上大致增加的横截面面积。

10. 发明授权

US06585774B2 Dynamic variable geometry fitting system for use with a body appliance 有权
公开(公告)号：US06585774B2
公开(公告)日：2003-07-01
申请号：US09840955
申请日：2001-04-24
申请人： Robert C. Dean, Jr. , Michael B. Mayor , David F. Nelson , Chad S. Braley , Mark W. Blanchard
发明人： Robert C. Dean, Jr. , Michael B. Mayor , David F. Nelson , Chad S. Braley , Mark W. Blanchard
IPC分类号： A61F280
CPC分类号： A61F2/76 , A61F2/68 , A61F2/7843 , A61F2002/501 , A61F2002/745 , A61F2002/748 , A61F2002/7655 , A61F2002/802 , A61F2002/805
摘要： A dynamic variable geometry fitting system with fluid-filled bladders and automatically regulating their volumes to provide a continuously secure fit. This system can vary volume continuously to accommodate natural variation in an amputee's residuum. It makes reliable suction retention of a prosthesis easier for the prosthetist to achieve while reducing the potential for tissue lesions. By maintaining a continuous, secure fit, the amputee's sense of confidence and willingness to use the prosthesis increases.

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