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1. 发明申请

US20070115483A1 SURFACE FINISH ROUGHNESS MEASUREMENT 失效
标题翻译：表面粗糙度测量
公开(公告)号：US20070115483A1
公开(公告)日：2007-05-24
申请号：US11623415
申请日：2007-01-16
申请人： Dave Oak , Tri Do , Ronny Soetarman , Steven Meeks , Vamsi Velidandla
发明人： Dave Oak , Tri Do , Ronny Soetarman , Steven Meeks , Vamsi Velidandla
IPC分类号： G01B11/30
CPC分类号： G01B11/303 , G01B11/306 , G01N21/9501
摘要： A method comprises generating a data set comprising first surface roughness data from a first orientation and second surface roughness data from a second orientation and determining a roughness bias parameter from the first surface roughness data and the second surface roughness data.
摘要翻译：一种方法包括从第一方向生成包括第一表面粗糙度数据和来自第二取向的第二表面粗糙度数据的数据集，以及根据第一表面粗糙度数据和第二表面粗糙度数据确定粗糙度偏差参数。

2. 发明申请

US20070127016A1 WAFER EDGE INSPECTION 有权
标题翻译： WAFER EDGE检查
公开(公告)号：US20070127016A1
公开(公告)日：2007-06-07
申请号：US11560477
申请日：2006-11-16
申请人： Steven Meeks , Rusmin Kudinar , William Wheeler , Hung Nguyen , Vamsi Velidandla , Anoop Somanchi , Ronny Soetarman
发明人： Steven Meeks , Rusmin Kudinar , William Wheeler , Hung Nguyen , Vamsi Velidandla , Anoop Somanchi , Ronny Soetarman
IPC分类号： G01N21/88
CPC分类号： G01N21/94 , G01B11/303 , G01B11/306 , G01N21/21 , G01N21/211 , G01N21/55 , G01N21/9501 , G01N21/9503 , G01N2021/556 , H01L22/12
摘要： In one embodiment, a system to measure defects on a surface of a wafer and an edge of the wafer using a single tool comprises a radial motor to move an optical head in a radial direction to detect defects at locations displaced from the edge of the wafer, and a rotational motor to rotate the optical head around the edge of the wafer to detect defects on the edge of the wafer.
摘要翻译：在一个实施例中，使用单个工具测量晶片表面和晶片边缘上的缺陷的系统包括径向马达以沿径向方向移动光学头以检测从晶片边缘移位的位置处的缺陷以及旋转电动机，用于围绕晶片的边缘旋转光学头以检测晶片边缘上的缺陷。

3. 发明授权

US07630086B2 Surface finish roughness measurement 失效
标题翻译：表面粗糙度测量
公开(公告)号：US07630086B2
公开(公告)日：2009-12-08
申请号：US11623415
申请日：2007-01-16
申请人： Dave S. Oak , Tri Do , Ronny Soetarman , Steven W. Meeks , Vamsi Velidandla
发明人： Dave S. Oak , Tri Do , Ronny Soetarman , Steven W. Meeks , Vamsi Velidandla
IPC分类号： G01B11/24
CPC分类号： G01B11/303 , G01B11/306 , G01N21/9501
摘要： A method comprises generating a data set comprising first surface roughness data from a first orientation and second surface roughness data from a second orientation and determining a roughness bias parameter from the first surface roughness data and the second surface roughness data.
摘要翻译：一种方法包括从第一方向生成包括第一表面粗糙度数据和来自第二取向的第二表面粗糙度数据的数据集，以及根据第一表面粗糙度数据和第二表面粗糙度数据确定粗糙度偏差参数。

4. 发明申请

US20060250611A1 Wafer edge inspection 有权
标题翻译：晶圆边缘检查
公开(公告)号：US20060250611A1
公开(公告)日：2006-11-09
申请号：US11365221
申请日：2006-03-01
申请人： Vamsi Velidandla , Anoop Somanchi , Ronny Soetarman , Steven Meeks
发明人： Vamsi Velidandla , Anoop Somanchi , Ronny Soetarman , Steven Meeks
IPC分类号： G01N21/88
CPC分类号： G01N21/94 , G01B11/303 , G01B11/306 , G01N21/21 , G01N21/211 , G01N21/55 , G01N21/9501 , G01N21/9503 , G01N2021/556 , H01L22/12
摘要： In one embodiment, a system to inspect an edge region of a wafer, comprises a surface analyzer assembly comprising a radiation targeting assembly that targets a radiation beam onto a surface of the wafer; a reflected radiation collection assembly to collect radiation reflected from a surface of the wafer; means for rotating the surface analyzer assembly about an edge surface of the wafer; and means for detecting one or more defects in the edge region of the wafer.
摘要翻译：在一个实施例中，检查晶片的边缘区域的系统包括表面分析器组件，其包括将辐射束对准到晶片表面上的辐射瞄准组件; 用于收集从晶片表面反射的辐射的反射辐射收集组件; 用于使表面分析器组件围绕晶片的边缘表面旋转的装置; 以及用于检测晶片边缘区域中的一个或多个缺陷的装置。

5. 发明申请

US20060215289A1 Servo pattern characterization on magnetic disks 失效
标题翻译：磁盘上的伺服模式表征
公开(公告)号：US20060215289A1
公开(公告)日：2006-09-28
申请号：US11432609
申请日：2006-05-11
申请人： Zhen Hou , Ronny Soetarman , Vamsi Velidandla , Steven Meeks
发明人： Zhen Hou , Ronny Soetarman , Vamsi Velidandla , Steven Meeks
IPC分类号： G11B5/02 , G11B5/596
CPC分类号： G11B5/59627
摘要： In one embodiment, a surface analyzer system comprises a radiation targeting assembly to target radiation onto a surface, a reflected radiation collecting assembly that collects radiation reflected from the surface, and a signal processing module. The signal processing module generates an image of magnetic characteristics of the magnetic disk, wherein the image comprises a plurality of servo sector arcs, locates a sample of points on a plurality of the servo sector arcs, fits a circle to the sample of points on each of the plurality of servo sector arcs, and determines at least one pivot-to-gap measurement from the radius of the circles.
摘要翻译：在一个实施例中，表面分析器系统包括将辐射瞄准到表面上的辐射瞄准组件，收集从表面反射的辐射的反射辐射收集组件和信号处理模块。信号处理模块生成磁盘的磁特性的图像，其中图像包括多个伺服扇区弧，定位多个伺服扇区弧上的点样本，将圆适合于每个点上的点样本并且从圆的半径确定至少一个枢轴对间隙测量。

6. 发明授权

US07532318B2 Wafer edge inspection 有权
标题翻译：晶圆边缘检查
公开(公告)号：US07532318B2
公开(公告)日：2009-05-12
申请号：US11560477
申请日：2006-11-16
申请人： Steven W. Meeks , Rusmin Kudinar , William R. Wheeler , Hung Phi Nguyen , Vamsi Velidandla , Anoop Somanchi , Ronny Soetarman
发明人： Steven W. Meeks , Rusmin Kudinar , William R. Wheeler , Hung Phi Nguyen , Vamsi Velidandla , Anoop Somanchi , Ronny Soetarman
IPC分类号： G01N21/00
CPC分类号： G01N21/94 , G01B11/303 , G01B11/306 , G01N21/21 , G01N21/211 , G01N21/55 , G01N21/9501 , G01N21/9503 , G01N2021/556 , H01L22/12
摘要： In one embodiment, a system to measure defects on a surface of a wafer and an edge of the wafer using a single tool comprises a radial motor to move an optical head in a radial direction to detect defects at locations displaced from the edge of the wafer, and a rotational motor to rotate the optical head around the edge of the wafer to detect defects on the edge of the wafer.
摘要翻译：在一个实施例中，使用单个工具测量晶片表面和晶片边缘上的缺陷的系统包括径向马达以沿径向方向移动光学头以检测从晶片边缘移位的位置处的缺陷以及旋转电动机，用于围绕晶片的边缘旋转光学头以检测晶片边缘上的缺陷。

7. 发明授权

US07397621B2 Servo pattern characterization on magnetic disks 失效
标题翻译：磁盘上的伺服模式表征
公开(公告)号：US07397621B2
公开(公告)日：2008-07-08
申请号：US11432609
申请日：2006-05-11
申请人： Zhen Hou , Ronny Soetarman , Vamsi Velidandla , Steven W. Meeks
发明人： Zhen Hou , Ronny Soetarman , Vamsi Velidandla , Steven W. Meeks
IPC分类号： G11B5/02
CPC分类号： G11B5/59627
摘要： In one embodiment, a surface analyzer system comprises a radiation targeting assembly to target radiation onto a surface, a reflected radiation collecting assembly that collects radiation reflected from the surface, and a signal processing module. The signal processing module generates an image of magnetic characteristics of the magnetic disk, wherein the image comprises a plurality of servo sector arcs, locates a sample of points on a plurality of the servo sector arcs, fits a circle to the sample of points on each of the plurality of servo sector arcs, and determines at least one pivot-to-gap measurement from the radius of the circles.
摘要翻译：在一个实施例中，表面分析器系统包括将辐射瞄准到表面上的辐射瞄准组件，收集从表面反射的辐射的反射辐射收集组件和信号处理模块。信号处理模块生成磁盘的磁特性的图像，其中图像包括多个伺服扇区弧，定位多个伺服扇区弧上的点样本，将圆适合于每个点上的点样本并且从圆的半径确定至少一个枢轴对间隙测量。

8. 发明授权

US07161669B2 Wafer edge inspection 有权
标题翻译：晶圆边缘检查
公开(公告)号：US07161669B2
公开(公告)日：2007-01-09
申请号：US11365221
申请日：2006-03-01
申请人： Vamsi Velidandla , Anoop Somanchi , Ronny Soetarman , Steven W. Meeks
发明人： Vamsi Velidandla , Anoop Somanchi , Ronny Soetarman , Steven W. Meeks
IPC分类号： G01N21/88
CPC分类号： G01N21/94 , G01B11/303 , G01B11/306 , G01N21/21 , G01N21/211 , G01N21/55 , G01N21/9501 , G01N21/9503 , G01N2021/556 , H01L22/12
摘要： In one embodiment, a system to inspect an edge region of a wafer, comprises a surface analyzer assembly comprising a radiation targeting assembly that targets a radiation beam onto a surface of the wafer; a reflected radiation collection assembly to collect radiation reflected from a surface of the wafer; means for rotating the surface analyzer assembly about an edge surface of the wafer; and means for detecting one or more defects in the edge region of the wafer.
摘要翻译：在一个实施例中，检查晶片的边缘区域的系统包括表面分析器组件，其包括将辐射束对准到晶片表面上的辐射瞄准组件; 用于收集从晶片表面反射的辐射的反射辐射收集组件; 用于使表面分析器组件围绕晶片的边缘表面旋转的装置; 以及用于检测晶片边缘区域中的一个或多个缺陷的装置。

9. 发明授权

US07201799B1 System and method for classifying, detecting, and counting micropipes 有权
标题翻译：微孔分类，检测和计数的系统和方法
公开(公告)号：US07201799B1
公开(公告)日：2007-04-10
申请号：US10997328
申请日：2004-11-24
申请人： Vamsi Velidandla
发明人： Vamsi Velidandla
IPC分类号： C30B25/12
CPC分类号： C30B29/36 , C30B25/16
摘要： An automated, non-invasive method for classifying, detecting, and counting micropipes contained within silicon wafers, and generally any assortment of transparent wafers. Classifying, detecting, and counting micropipes takes place through the use of a data processing algorithm that incorporates information regarding: defect size; pit signature; area of pit signature when comparing a topography, specular, or scatter images; and detecting a tail within the standard pit signature. The method of the present invention teaches the development of a topography defect map, specular defect map, and scatter defect map for a complete analysis of the surface of a particular transparent wafer. Conventional detection, classification, and counting of micropipes involve characterization of micropipes in a manual fashion and rely upon an extremely invasive form of sample preparation. The method disclosed in the present invention is completely automated and non-invasive with regards to the treatment of the transparent wafer to be analyzed.
摘要翻译：一种用于分类，检测和计数硅晶片内的微孔以及通常各种透明晶片的自动化非侵入性方法。通过使用包含以下信息的数据处理算法进行分类，检测和计数微孔：缺陷尺寸; 坑签名; 比较地形，镜面或散射图像时的坑签名区域; 并检测标准坑签名内的尾部。本发明的方法教导了用于完整分析特定透明晶片的表面的形貌缺陷图，镜面缺陷图和散射缺陷图。微管的常规检测，分类和计数涉及以手动方式表征微管，并且依赖于极其侵入性的样品制备形式。关于待分析透明晶片的处理，本发明公开的方法是完全自动化且非侵入性的。

10. 发明授权

US07592616B1 Detecting micropipes 有权
标题翻译：检测微管
公开(公告)号：US07592616B1
公开(公告)日：2009-09-22
申请号：US11563996
申请日：2006-11-28
申请人： Vamsi Velidandla
发明人： Vamsi Velidandla
IPC分类号： G01N21/88 , G01N21/86 , G01N21/00
CPC分类号： C30B29/36 , C30B25/16
摘要： An automated, non-invasive method for classifying, detecting, and counting micropipes contained within silicon wafers, and generally any assortment of transparent wafers. Classifying, detecting, and counting micropipes takes place through the use of a data processing algorithm that incorporates information regarding: defect size; pit signature; area of pit signature when comparing a topography, specular, or scatter images; and detecting a tail within the standard pit signature. The method of the present invention teaches the development of a topography defect map, specular defect map, and scatter defect map for a complete analysis of the surface of a particular transparent wafer. Conventional detection, classification, and counting of micropipes involve characterization of micropipes in a manual fashion and rely upon an extremely invasive form of sample preparation. The method disclosed in the present invention is completely automated and non-invasive with regards to the treatment of the transparent wafer to be analyzed.
摘要翻译：一种用于分类，检测和计数硅晶片内的微孔以及通常各种透明晶片的自动化非侵入性方法。通过使用包含以下信息的数据处理算法进行分类，检测和计数微孔：缺陷尺寸; 坑签名; 比较地形，镜面或散射图像时的坑签名区域; 并检测标准坑签名内的尾部。本发明的方法教导了用于完整分析特定透明晶片的表面的形貌缺陷图，镜面缺陷图和散射缺陷图。微管的常规检测，分类和计数涉及以手动方式表征微管，并且依赖于极其侵入性的样品制备形式。关于待分析透明晶片的处理，本发明公开的方法是完全自动化且非侵入性的。

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