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1. 发明申请

US20070127016A1 WAFER EDGE INSPECTION 有权
标题翻译： WAFER EDGE检查
公开(公告)号：US20070127016A1
公开(公告)日：2007-06-07
申请号：US11560477
申请日：2006-11-16
申请人： Steven Meeks , Rusmin Kudinar , William Wheeler , Hung Nguyen , Vamsi Velidandla , Anoop Somanchi , Ronny Soetarman
发明人： Steven Meeks , Rusmin Kudinar , William Wheeler , Hung Nguyen , Vamsi Velidandla , Anoop Somanchi , Ronny Soetarman
IPC分类号： G01N21/88
CPC分类号： G01N21/94 , G01B11/303 , G01B11/306 , G01N21/21 , G01N21/211 , G01N21/55 , G01N21/9501 , G01N21/9503 , G01N2021/556 , H01L22/12
摘要： In one embodiment, a system to measure defects on a surface of a wafer and an edge of the wafer using a single tool comprises a radial motor to move an optical head in a radial direction to detect defects at locations displaced from the edge of the wafer, and a rotational motor to rotate the optical head around the edge of the wafer to detect defects on the edge of the wafer.
摘要翻译：在一个实施例中，使用单个工具测量晶片表面和晶片边缘上的缺陷的系统包括径向马达以沿径向方向移动光学头以检测从晶片边缘移位的位置处的缺陷以及旋转电动机，用于围绕晶片的边缘旋转光学头以检测晶片边缘上的缺陷。

2. 发明授权

US07532318B2 Wafer edge inspection 有权
标题翻译：晶圆边缘检查
公开(公告)号：US07532318B2
公开(公告)日：2009-05-12
申请号：US11560477
申请日：2006-11-16
申请人： Steven W. Meeks , Rusmin Kudinar , William R. Wheeler , Hung Phi Nguyen , Vamsi Velidandla , Anoop Somanchi , Ronny Soetarman
发明人： Steven W. Meeks , Rusmin Kudinar , William R. Wheeler , Hung Phi Nguyen , Vamsi Velidandla , Anoop Somanchi , Ronny Soetarman
IPC分类号： G01N21/00
CPC分类号： G01N21/94 , G01B11/303 , G01B11/306 , G01N21/21 , G01N21/211 , G01N21/55 , G01N21/9501 , G01N21/9503 , G01N2021/556 , H01L22/12
摘要： In one embodiment, a system to measure defects on a surface of a wafer and an edge of the wafer using a single tool comprises a radial motor to move an optical head in a radial direction to detect defects at locations displaced from the edge of the wafer, and a rotational motor to rotate the optical head around the edge of the wafer to detect defects on the edge of the wafer.
摘要翻译：在一个实施例中，使用单个工具测量晶片表面和晶片边缘上的缺陷的系统包括径向马达以沿径向方向移动光学头以检测从晶片边缘移位的位置处的缺陷以及旋转电动机，用于围绕晶片的边缘旋转光学头以检测晶片边缘上的缺陷。

3. 发明申请

US20060250610A1 Wafer edge inspection 有权
标题翻译：晶圆边缘检查
公开(公告)号：US20060250610A1
公开(公告)日：2006-11-09
申请号：US11196540
申请日：2005-08-03
申请人： Steven Meeks , Rusmin Kudinar , William Wheeler , Hung Nguyen
发明人： Steven Meeks , Rusmin Kudinar , William Wheeler , Hung Nguyen
IPC分类号： G01N21/88
CPC分类号： G01B11/306 , G01N21/211 , G01N21/47 , G01N21/55 , G01N21/9501 , G01N21/9503 , G01N21/9506 , G01N2021/556 , G01N2201/0612 , G01N2201/065
摘要： In one embodiment, a surface analyzer system comprises a radiation targeting assembly to target a radiation beam onto a surface; and a reflected radiation collecting assembly that collects radiation reflected from the surface, wherein the reflected radiation collecting assembly comprises a mirror to collect radiation reflected from the surface.
摘要翻译：在一个实施例中，表面分析器系统包括将辐射束对准到表面上的辐射瞄准组件; 以及收集从表面反射的辐射的反射辐射收集组件，其中反射的辐射收集组件包括用于收集从表面反射的辐射的反射镜。

4. 发明申请

US20060250609A1 Wafer edge inspection 有权
标题翻译：晶圆边缘检查
公开(公告)号：US20060250609A1
公开(公告)日：2006-11-09
申请号：US11123913
申请日：2005-05-06
申请人： Steven Meeks , Rusmin Kudinar , William Wheeler , Hung Nguyen
发明人： Steven Meeks , Rusmin Kudinar , William Wheeler , Hung Nguyen
IPC分类号： G01N21/88
CPC分类号： G01B11/306 , G01N21/211 , G01N21/47 , G01N21/55 , G01N21/9501 , G01N21/9503 , G01N21/9506 , G01N2021/556 , G01N2201/0612 , G01N2201/065
摘要： In one embodiment, a system to inspect the edge of a wafer, comprises an surface analyzer assembly, a first drive assembly to impart linear motion between the surface analyzer and a first surface of the wafer, and a second drive assembly to impart rotary motion between the surface analyzer and the wafer about an axis parallel to the first surface of the wafer.
摘要翻译：在一个实施例中，用于检查晶片边缘的系统包括表面分析器组件，用于在表面分析器和晶片的第一表面之间施加线性运动的第一驱动组件，以及第二驱动组件，表面分析器和晶片围绕平行于晶片的第一表面的轴线。

5. 发明授权

US09036869B2 Multi-surface optical 3D microscope 有权
标题翻译：多面光学3D显微镜
公开(公告)号：US09036869B2
公开(公告)日：2015-05-19
申请号：US13220595
申请日：2011-08-29
申请人： Ken Kinsun Lee , Ronny Soetarman , Zhen Hou , James Jianguo Xu , Rusmin Kudinar , Vamsi Mohan Velidandla , Ben Garland
发明人： Ken Kinsun Lee , Ronny Soetarman , Zhen Hou , James Jianguo Xu , Rusmin Kudinar , Vamsi Mohan Velidandla , Ben Garland
IPC分类号： G06K9/00 , G02B21/00 , G02B21/36
CPC分类号： G02B21/365 , G02B21/0016 , G02B21/367 , G06K9/46 , G06T5/00 , G06T7/40 , G06T2207/10056 , H04N5/357
摘要： A method of detecting multi-surfaces of an object includes providing an imaging system capable of detecting surfaces of the object. After system parameters are set up, two-dimensional images of the object at multiple Z steps can be acquired. Each surface of the object can then be extracted using two steps. In a first step, the surface can be constructed based on a confidence threshold. In a second step, the surface can be enhanced using an interpolation filter.
摘要翻译：检测物体的多面的方法包括提供能够检测物体表面的成像系统。在设置系统参数后，可以获取多个Z步骤的对象的二维图像。然后可以使用两个步骤提取对象的每个表面。在第一步骤中，可以基于置信阈值构建表面。在第二步中，可以使用内插滤波器来增强表面。

6. 发明申请

US20120327414A1 System And Method For Monitoring LED Chip Surface Roughening Process 有权
标题翻译： LED芯片表面粗糙化处理系统及方法
公开(公告)号：US20120327414A1
公开(公告)日：2012-12-27
申请号：US13494949
申请日：2012-06-12
申请人： James Jianguo Xu , Ken Kinsun Lee , Rusmin Kudinar , Ronny Soetarman , Hung Phi Nguyen , Zhen Hou
发明人： James Jianguo Xu , Ken Kinsun Lee , Rusmin Kudinar , Ronny Soetarman , Hung Phi Nguyen , Zhen Hou
IPC分类号： G01J3/42 , G01J3/447
CPC分类号： G01J3/2823 , G01J3/0208 , G01J3/0218 , G01N21/274 , G01N21/55 , G02B21/0092
摘要： A measurement system for monitoring an LED chip surface roughening process is described. A reflective illuminator can run reflectance measurements. A vertical positioning means can adjust a distance between an objective lens and an industrial sample. A horizontal positioning means can move objects in XY plane, and is specifically configured to hold the industrial sample and a reference sample. An optical sensor can acquire images of the industrial sample. A spectrometer can acquire reflectance spectrums of the industrial sample and the reference sample. A processor can control these components. The processor can perform deskew, and calculate an average reflectance and an oscillation amplitude from the reflectance spectrums of the industrial sample.
摘要翻译：描述了一种用于监测LED芯片表面粗糙化工艺的测量系统。反射照明器可以进行反射测量。垂直定位装置可以调节物镜和工业样品之间的距离。水平定位装置可以在XY平面中移动物体，并且被特别地配置成保持工业样品和参考样品。光学传感器可以获取工业样品的图像。光谱仪可以获得工业样品和参考样品的反射光谱。处理器可以控制这些组件。处理器可以进行偏斜校正，并从工业样品的反射光谱计算平均反射率和振荡幅度。

7. 发明申请

US20120019626A1 3D Microscope And Methods Of Measuring Patterned Substrates 有权
标题翻译： 3D显微镜和测量图案基板的方法
公开(公告)号：US20120019626A1
公开(公告)日：2012-01-26
申请号：US13172686
申请日：2011-06-29
申请人： Zhen Hou , James Jianguo Xu , Ken Kinsun Lee , James Nelson Stainton , Hung Phi Nguyen , Rusmin Kudinar , Ronny Soetarman
发明人： Zhen Hou , James Jianguo Xu , Ken Kinsun Lee , James Nelson Stainton , Hung Phi Nguyen , Rusmin Kudinar , Ronny Soetarman
IPC分类号： H04N13/02 , H04N7/18
CPC分类号： G02B21/006 , G01N21/9501 , G01N21/956 , G01N2021/0168 , G02B21/0016 , G02B21/0028 , G02B21/0032 , G02B21/367 , G06T7/60 , G06T2207/10056 , G06T2207/10152 , G06T2207/20068 , G06T2207/30148
摘要： A three-dimensional (3D) microscope for patterned substrate measurement can include an objective lens, a reflected illuminator, a transmitted illuminator, a focusing adjustment device, an optical sensor, and a processor. The focusing adjustment device can automatically adjust the objective lens focus at a plurality of Z steps. The optical sensor can be capable of acquiring images at each of these Z steps. The processor can control the reflected illuminator, the transmitted illuminator, the focusing adjustment device, and the optical sensor. The processor can be configured to capture first and second images at multiple Z steps, the first image with the pattern using the reflected illuminator and the second image without the pattern using one of the reflected illuminator and the transmitted illuminator.
摘要翻译：用于图案化衬底测量的三维（3D）显微镜可以包括物镜，反射照明器，透射照明器，聚焦调节装置，光学传感器和处理器。聚焦调节装置可以在多个Z步骤自动调节物镜焦点。光学传感器能够在这些Z步骤的每个步骤中获取图像。处理器可以控制反射照明器，透射照明器，聚焦调节装置和光学传感器。处理器可以被配置成以多个Z步骤捕获第一和第二图像，第一图像使用反射照明器的图案，而不使用反射照明器和透射照明器之一的图案的第二图像。

8. 发明授权

US06198533B1 High temperature thin film property measurement system and method 有权
标题翻译：高温薄膜性能测量系统及方法
公开(公告)号：US06198533B1
公开(公告)日：2001-03-06
申请号：US09376711
申请日：1999-08-17
申请人： Steven W. Meeks , Rusmin Kudinar , Ronny Soetarman
发明人： Steven W. Meeks , Rusmin Kudinar , Ronny Soetarman
IPC分类号： G01B2117
CPC分类号： G01B11/065 , G01B11/303
摘要： A system and method for measuring lubricant thickness and degradation, carbon wear and carbon thickness, and surface roughness and debris on thin film magnetic disks at angles that are not substantially Brewster's angle of the thin film (carbon) protective overcoat in a high temperature environment. A focused optical light whose polarization can be switched between P or S polarization is incident at an angle to the surface of the thin film magnetic disk. The polarization switch can be accomplished using a temperature compensated quartz half plate. The range of angles can be from zero degrees from normal to near Brewster's angle and from an angle greater than Brewster's angle to 90 degrees. This range of angles allows the easy measurement of the change in lubricant thickness due to the interaction of the thin film head, the absolute lubricant thickness and degradation of the lubricant. It also allows the measurement of changes in carbon thickness and the absolute carbon thickness. The surface roughness can also be measured at any of the angles specified above.
摘要翻译：用于测量薄膜磁盘上的润滑剂厚度和降解，碳磨损和碳厚度的表面粗糙度和碎屑的系统和方法，其在高温环境中基本上不是薄膜（碳）保护涂层的布鲁斯特角。其偏振可以在P或S偏振之间切换的聚焦光学光以与薄膜磁盘的表面成一定角度入射。偏光开关可以使用温度补偿的石英半板完成。角度范围可以从普通到布鲁斯特角附近的零度以及从布鲁斯特角度大到90度的角度。这种角度范围可以容易地测量润滑剂厚度的变化，这是由于薄膜头的相互作用，绝对润滑剂厚度和润滑剂的劣化。它还允许测量碳厚度和绝对碳厚度的变化。表面粗糙度也可以在上述任何角度测量。

9. 发明授权

US10048480B2 3D microscope including insertable components to provide multiple imaging and measurement capabilities 有权
公开(公告)号：US10048480B2
公开(公告)日：2018-08-14
申请号：US13333938
申请日：2011-12-21
申请人： James Jianguo Xu , Ken Kinsun Lee , Rusmin Kudinar , Ronny Soetarman , Hung Phi Nguyen , Zhen Hou
发明人： James Jianguo Xu , Ken Kinsun Lee , Rusmin Kudinar , Ronny Soetarman , Hung Phi Nguyen , Zhen Hou
IPC分类号： H04N7/18 , G02B21/06 , G02B21/00 , G02B21/36
摘要： A three-dimensional (3D) microscope includes various insertable components that facilitate multiple imaging and measurement capabilities. These capabilities include Nomarski imaging, polarized light imaging, quantitative differential interference contrast (q-DIC) imaging, motorized polarized light imaging, phase-shifting interferometry (PSI), and vertical-scanning interferometry (VSI).

10. 发明授权

US08976366B2 System and method for monitoring LED chip surface roughening process 有权
标题翻译： LED芯片表面粗糙化处理系统及方法
公开(公告)号：US08976366B2
公开(公告)日：2015-03-10
申请号：US13494949
申请日：2012-06-12
申请人： James Jianguo Xu , Ken Kinsun Lee , Rusmin Kudinar , Ronny Soetarman , Hung Phi Nguyen , Zhen Hou
发明人： James Jianguo Xu , Ken Kinsun Lee , Rusmin Kudinar , Ronny Soetarman , Hung Phi Nguyen , Zhen Hou
IPC分类号： G01B11/30 , G01J3/28 , G02B21/00 , G01J3/02 , G01N21/27 , G01N21/55
CPC分类号： G01J3/2823 , G01J3/0208 , G01J3/0218 , G01N21/274 , G01N21/55 , G02B21/0092
摘要： A measurement system for monitoring an LED chip surface roughening process is described. A reflective illuminator can run reflectance measurements. A vertical positioning means can adjust a distance between an objective lens and an industrial sample. A horizontal positioning means can move objects in XY plane, and is specifically configured to hold the industrial sample and a reference sample. An optical sensor can acquire images of the industrial sample. A spectrometer can acquire reflectance spectrums of the industrial sample and the reference sample. A processor can control these components. The processor can perform deskew, and calculate an average reflectance and an oscillation amplitude from the reflectance spectrums of the industrial sample.
摘要翻译：描述了一种用于监测LED芯片表面粗糙化工艺的测量系统。反射照明器可以进行反射测量。垂直定位装置可以调节物镜和工业样品之间的距离。水平定位装置可以在XY平面中移动物体，并且被特别地配置成保持工业样品和参考样品。光学传感器可以获取工业样品的图像。光谱仪可以获得工业样品和参考样品的反射光谱。处理器可以控制这些组件。处理器可以进行偏斜校正，并从工业样品的反射光谱计算平均反射率和振荡幅度。

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