专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07570069B2 Resilient contact probes 失效
标题翻译：弹性接触探针
公开(公告)号：US07570069B2
公开(公告)日：2009-08-04
申请号：US11269085
申请日：2005-11-07
申请人： Daniel P. Cram , Scott L. Hoagland
发明人： Daniel P. Cram , Scott L. Hoagland
IPC分类号： G01R1/067
CPC分类号： G01R1/06722 , G01R1/07314 , Y10T29/49204
摘要： Carriers comprising a carrier body having a plurality of openings holding a plurality of resilient contact probes are disclosed. A number of different embodiments for the resilient contact probes is also disclosed. The carriers of the present invention may be secured to an interface board (i.e., a printed circuit board (PCB)) and assembled with a substrate (e.g., a wafer having integrated circuitry thereon, a PCB, etc.). The resilient contact probes electrically contact the terminal pads of the interface board and the electrical contacts of the substrate to enable electrical testing of the substrate. The configuration of the resilient contact probes, in combination with the carrier body, enables preferential, high mechanical loading of the terminal pads with controlled, predictable loading of the electrical contacts. Methods of making and use are also disclosed, as are a plurality of embodiments of resilient contact probes.
摘要翻译：公开了一种载体，其包括具有多个保持多个弹性接触探针的开口的载体主体。还公开了用于弹性接触探针的许多不同实施例。本发明的载体可以固定到接口板（即，印刷电路板（PCB））上，并与基板（例如，其上集成有电路的晶片，PCB等）组装。弹性接触探针与接触板的端子焊盘和衬底的电触点电接触以使得能够对衬底进行电气测试。弹性接触探针的结构与载体本体相结合，能够以可控的，可预测的电接触负载实现端子焊盘的优先，高机械负载。还公开了制造和使用的方法，以及弹性接触探针的多个实施例。

2. 发明授权

US07427869B2 Resilient contact probe apparatus 失效
标题翻译：弹性接触探针装置
公开(公告)号：US07427869B2
公开(公告)日：2008-09-23
申请号：US11493974
申请日：2006-07-27
申请人： Daniel P. Cram , Scott L. Hoagland
发明人： Daniel P. Cram , Scott L. Hoagland
IPC分类号： G01R31/02
CPC分类号： G01R1/06722 , G01R1/07314 , Y10T29/49204
摘要： Carriers comprising a carrier body having a plurality of openings holding a plurality of resilient contact probes are disclosed. A number of different embodiments for the resilient contact probes is also disclosed. The carriers of the present invention may be secured to an interface board (i.e., a printed circuit board (PCB)) and assembled with a substrate (e.g., a wafer having integrated circuitry thereon, a PCB, etc.). The resilient contact probes electrically contact the terminal pads of the interface board and the electrical contacts of the substrate to enable electrical testing of the substrate. The configuration of the resilient contact probes, in combination with the carrier body, enables preferential, high mechanical loading of the terminal pads with controlled, predictable loading of the electrical contacts. Methods of making and use are also disclosed, as are a plurality of embodiments of resilient contact probes.
摘要翻译：公开了一种载体，其包括具有多个保持多个弹性接触探针的开口的载体主体。还公开了用于弹性接触探针的许多不同实施例。本发明的载体可以固定到接口板（即，印刷电路板（PCB））上，并与基板（例如，其上集成有电路的晶片，PCB等）组装。弹性接触探针与接触板的端子焊盘和衬底的电触点电接触以使得能够对衬底进行电气测试。弹性接触探针的结构与载体本体相结合，能够以可控的，可预测的电接触负载实现端子焊盘的优先，高机械负载。还公开了制造和使用的方法，以及弹性接触探针的多个实施例。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式