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1. 发明专利

JP2004042050A Flux for soldering, and electronic circuit 有权
公开(公告)号：JP2004042050A
公开(公告)日：2004-02-12
申请号：JP2002199423
申请日：2002-07-09
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Harima Chem Inc , ハリマ化成株式会社 , 株式会社大和化成研究所
发明人： IKEDA KAZUTERU , ISHIKAWA SHUNSUKE , ANADA TAKAAKI , OBATA KEIGO , TAKEUCHI TAKAO , INOUE NAOYA
IPC分类号： B23K3/00 , B23K35/363 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To restrain the diffusion of nickel into molten solder alloy when the soldering is performed, to improve the joined strength of the soldering by preventing the concentration increase of phosphorus and to restrain the reduction-precipitation of silver and/or copper into a part except an circuit pattern. SOLUTION: In a flux used when the soldering is performed in the circuit applied to a non-electrolytic nickel plating or further applying a gold-plating on the non-electrolytic nickel plating, one or more kinds of complexes of the silver ion and/or the copper ion are contained in this flux. COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2004244711A METHOD OF PRODUCING TIN ALLOY LOW IN α RAY 有权
公开(公告)号：JP2004244711A
公开(公告)日：2004-09-02
申请号：JP2003038661
申请日：2003-02-17
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Harima Chem Inc , ハリマ化成株式会社 , 株式会社大和化成研究所
发明人： IKEDA KAZUTERU , KUMAMOTO SATOSHI , IRIE HISAO , OBATA KEIGO , TAKEUCHI TAKAO
IPC分类号： B23K35/26 , B23K35/40 , C22B3/46 , C22B25/08 , C22C13/00 , H05K3/34
CPC分类号： Y02P10/234
摘要： PROBLEM TO BE SOLVED: To provide a method of simply and inexpensively producing a tin alloy reduced in the amount of α rays and suitable to a soldering material for electronic components or the like. SOLUTION: In the method of producing a low α ray tin alloy, a composition containing tin powder including lead as impurities and the salt or complex of metal having an ionization tendency lower than that of lead such as silver and copper is heated, so that a low α ray tin alloy is precipitated. When the tin alloy obtained thereby is applied to a soldering material, errors of memory in a semiconductor or the like are suppressed, and the reliability of an electronic component can be improved. COPYRIGHT: (C)2004,JPO&NCIPI

3. 发明专利

JP2007197791A Composition of post-treatment agent for plating 审中-公开
标题翻译：后处理剂的组成
公开(公告)号：JP2007197791A
公开(公告)日：2007-08-09
申请号：JP2006018933
申请日：2006-01-27
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
发明人： TAKEUCHI TAKAO , YOSHIMOTO MASAKAZU , OBATA KEIGO
IPC分类号： C25D5/48 , C25D5/26
CPC分类号： C23C22/58
摘要： PROBLEM TO BE SOLVED: To develop and provide a post-treatment agent for plating, which improves fusion-joining resistance more effectively than sodium phosphate treatment solution.
SOLUTION: A composition of the post-treatment agent for plating to improve fusion-joining resistance is a solution which includes one or more selected from among compounds having amino nitrogen having at least two methylene groups coupled with a phosphonic acid group; and has a pH adjusted to an acidic region of 7 or lower. The solution also includes one or more compounds selected from among: a heterocyclic nitrogen-containing compound or a salt thereof; an aliphatic amine or an aromatic amine; and a C6-C24 straight-chain or branched-chain aliphatic carboxylic acid, or a salt of the carboxylic acid and the above amine. The composition can extremely effectively improve the fusion joinability of a plating film surface of tin or a tin alloy.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：开发并提供电镀后处理剂，其比磷酸钠处理溶液更有效地提高熔接接合电阻。解决方案：用于电镀以提高熔接接合电阻的后处理剂的组合物是包含选自具有至少两个亚甲基与膦酸基团连接的氨基氮的化合物中的一种或多种的溶液; 并且将pH调节至7以下的酸性区域。该溶液还包括一种或多种选自以下的化合物：杂环含氮化合物或其盐; 脂族胺或芳族胺; 和C 6 -C 24直链或支链脂族羧酸，或羧酸和上述胺的盐。该组合物可以极大地提高锡或锡合金的镀膜表面的熔融连接性。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2007084850A Method for forming pattern of circuit 有权
标题翻译：形成电路图的方法
公开(公告)号：JP2007084850A
公开(公告)日：2007-04-05
申请号：JP2005272081
申请日：2005-09-20
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
发明人： NAWAFUNE HIDEMI , AKAMATSU KENSUKE , HASEGAWA JUN , TERAHATA HIROAKI , OKUHAMA YOSHIAKI , OBATA KEIGO , TAKEUCHI TAKAO , NAKAO SEIICHIRO
IPC分类号： C23C18/18 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide a method for forming a pattern of a circuit while using an electroless plating technique. SOLUTION: This pattern-forming method comprises the steps of: preparing a substrate having a pattern formed of a hydrophilic part and a hydrophobic part thereon; immersing the substrate into a catalyzing liquid containing a thiol compound and particles of a precious metal to make the particles of the precious metal adsorbed selectively on one of the hydrophilic part and the hydrophobic part of the substrate; and subsequently forming a pattern of a circuit on the substrate by electroless-plating a metal thereon while using the precious metal as a catalyst. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种在使用化学镀技术时形成电路图案的方法。解决方案：该图案形成方法包括以下步骤：制备具有由亲水部分和疏水部分形成的图案的基底; 将基材浸入含有硫醇化合物和贵金属的颗粒的催化液中，使贵金属的颗粒选择性地吸附在基材的亲水部分和疏水部分之一上; 然后在使用贵金属作为催化剂的同时通过在其上对金属进行无电镀处理而在基板上形成电路图案。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2004137530A Compound alloy metal ball used as connector of electrical/ electronic circuit component and method for manufacturing the same 有权
标题翻译：用作电气/电子电路部件的连接器的化合物金属球及其制造方法
公开(公告)号：JP2004137530A
公开(公告)日：2004-05-13
申请号：JP2002301753
申请日：2002-10-16
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Fukuda Metal Foil & Powder Co Ltd , 株式会社大和化成研究所 , 福田金属箔粉工業株式会社
发明人： IMAE SHINYA , NISHIDA MOTONORI , KAJITA OSAMU , YAKIDA YOSHINOBU , OKUHAMA YOSHIAKI , TAKEUCHI TAKAO , OBATA KEIGO , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/56 , C22C5/06 , C22C9/00 , C25D3/64 , C25D5/10 , C25D7/00 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To comparatively inexpensively and stably provide compound alloy metal balls of a high melting point excellent as connectors of electrical/electronic circuit components.
SOLUTION: The metal ball surfaces are provided with electroplating silver-copper alloy film layers and the silver content of the silver-copper alloy films is specified 5 to 97wt% and the film thickness to ≥0.5 μm. In addition, the metal balls are composed of single metal or alloy having the melting point higher than the melting point of the silver-copper alloy film layers. The metal balls which are minute, are excellent in sphericity and have uniform dimensional accuracy are produced by an equal liquid droplet spray process, plasma rotating electrode process or flushing process and thereafter the silver-copper alloy film layers of a uniform film thickness are formed by an electroplating process on the resultant metal ball surfaces. The compound alloy metal ball of the high melting point having excellent joining characteristics can thus be provided by taking advantage of the sphericity and dimensional accuracy of the workpiece metal balls.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了相对便宜且稳定地提供具有优异的电气/电子电路部件的连接器的高熔点的复合合金金属球。解决方案：金属球表面设有电镀银 - 铜合金膜层，银 - 铜合金膜的银含量为5-97重量％，膜厚为≥0.5μm。此外，金属球由熔点高于银 - 铜合金膜层的熔点的单一金属或合金构成。通过相等的液滴喷雾法，等离子体旋转电极法或冲洗法制造细小的球状，均匀的尺寸精度的金属球，其后通过以下方法形成均匀膜厚的银 - 铜合金膜层：在所得金属球表面上进行电镀工艺。因此，通过利用工件金属球的球形度和尺寸精度，可以提供具有优异接合特性的高熔点复合合金金属球。版权所有（C）2004，JPO

6. 发明专利

JP2007197790A Discoloration preventing agent composition 有权
标题翻译：防腐剂组合物
公开(公告)号：JP2007197790A
公开(公告)日：2007-08-09
申请号：JP2006018899
申请日：2006-01-27
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
发明人： TAKEUCHI TAKAO , YOSHIMOTO MASAKAZU , OBATA KEIGO
IPC分类号： C23F11/04 , C25D5/48
摘要： PROBLEM TO BE SOLVED: To develop and provide a discoloration prevention/treatment agent effective for a lead-free plating film instead of sodium phosphate solution treatment.
SOLUTION: The discoloration in the surface of tin or a tin alloy can be extremely effectively prevented by using a discoloration preventing agent composition obtained by incorporating one or more kinds selected from heterocyclic nitrogen-containing compounds or the salts thereof, aliphatic or aromatic amines and 6 to 24C straight chain or branched aliphatic carboxylic acids or the salts between the carboxylic acids and the amines into a solution comprising one or more kinds selected from compounds containing amino nitrogen having two or more methylene groups to which phosphonic acid groups are bonded, and whose solution pH is controlled to an acidic region of pH ≤7.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：开发并提供对无铅镀膜有效的防变色剂，代替磷酸钠溶液处理。解决方案：通过使用通过掺入选自杂环含氮化合物或其盐，脂族或芳族化合物中的一种或多种获得的防变色剂组合物，可以极其有效地防止锡或锡合金表面的变色胺和6至24C直链或支链脂族羧酸或羧酸和胺之间的盐形成包含一种或多种选自含有键合有膦酸基的具有两个或更多个亚甲基的氨基氮的化合物的溶液的溶液，并将其pH值控制在pH≤7的酸性区域。版权所有（C）2007，JPO＆INPIT

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