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    • 1. 发明授权
    • Thermoacid generator for antireflection film formation, composition for antireflection film formation, and antireflection film made therefrom
    • 用于防反射膜形成的热酸发生器,用于防反射膜形成的组合物和由其制成的抗反射膜
    • US07785768B2
    • 2010-08-31
    • US11916575
    • 2006-05-24
    • Daisuke KawanaYasushi FujiiHisanobu HaradaNaoki Yamashita
    • Daisuke KawanaYasushi FujiiHisanobu HaradaNaoki Yamashita
    • G03F7/11H01L21/027
    • G03F7/091
    • A thermoacid generator for antireflective film formation, characterized by being represented by the following formula (1): (wherein R1 represents C1-20 alkyl, alkenyl, oxoalkyl, or oxoalkenyl (hydrogen atoms in these groups may have been replaced with fluorine atoms); R2 represents linear, branched, or cyclic C1-20 alkyl, alkenyl, oxoalkyl, or oxoalkenyl, C6-20 aryl, or C7-12 aralkyl or aryloxoalkyl; R3 represents hydrogen or alkyl; and Y− represents a non-nucleophilic counter ion); a composition for forming an antireflective film; and an antireflective film made from the composition. With the thermoacid generator and composition, satisfactory etching resistance and the satisfactory ability to prevent the reflection of short-wavelength light (ability to absorb short-wavelength light) are attained. Furthermore, the antireflective film can inhibit an overlying photoresist film from generating a scum.
    • 用于抗反射膜形成的热酸发生器,其特征在于由下式(1)表示:(其中R 1表示C 1-20烷基,烯基,氧代烷基或氧代烯基(这些基团中的氢原子可被氟原子取代); R 2表示直链,支链或环状C 1-20烷基,烯基,氧代烷基或氧代烯基,C 6-20芳基或C 7-12芳烷基或芳氧基烷基; R 3表示氢或烷基; Y-表示非亲核抗衡离子) ; 用于形成抗反射膜的组合物; 和由该组合物制成的抗反射膜。 利用热酸发生器和组合物,可获得令人满意的耐蚀刻性和令人满意的防止短波长光反射(能够吸收短波长光)的能力。 此外,抗反射膜可以抑制上覆的光致抗蚀剂膜产生浮渣。
    • 2. 发明申请
    • Thermoacid Generator for Antireflection Film Formation, Composition for Antireflection Film Formation, and Antireflection Film Made Therefrom
    • 用于防反射膜形成的热酸发生器,用于防反射膜形成的组合物和由此制成的抗反射膜
    • US20090130595A1
    • 2009-05-21
    • US11916575
    • 2006-05-24
    • Daisuke KawanaYasushi FujiiHisanobu HaradaNaoki Yamashita
    • Daisuke KawanaYasushi FujiiHisanobu HaradaNaoki Yamashita
    • G03F7/004C07C69/017
    • G03F7/091
    • A thermoacid generator for antireflective film formation, characterized by being represented by the following formula (1): (wherein R1 represents C1-20 alkyl, alkenyl, oxoalkyl, or oxoalkenyl (hydrogen atoms in these groups may have been replaced with fluorine atoms); R2 represents linear, branched, or cyclic C1-20 alkyl, alkenyl, oxoalkyl, or oxoalkenyl, C6-20 aryl, or C7-12 aralkyl or aryloxoalkyl; R3 represents hydrogen or alkyl; and Y− represents a non-nucleophilic counter ion); a composition for forming an antireflective film; and an antireflective film made from the composition. With the thermoacid generator and composition, satisfactory etching resistance and the satisfactory ability to prevent the reflection of short-wavelength light (ability to absorb short-wavelength light) are attained. Furthermore, the antireflective film can inhibit an overlying photoresist film from generating a scum.
    • 用于抗反射膜形成的热酸发生器,其特征在于由下式(1)表示:(其中R 1表示C 1-20烷基,烯基,氧代烷基或氧代烯基(这些基团中的氢原子可被氟原子取代); R 2表示直链,支链或环状C 1-20烷基,烯基,氧代烷基或氧代烯基,C 6-20芳基或C 7-12芳烷基或芳氧基烷基; R 3表示氢或烷基; Y-表示非亲核抗衡离子) ; 用于形成抗反射膜的组合物; 和由该组合物制成的抗反射膜。 利用热酸发生器和组合物,可获得令人满意的耐蚀刻性和令人满意的防止短波长光反射(能够吸收短波长光)的能力。 此外,抗反射膜可以抑制上覆的光致抗蚀剂膜产生浮渣。
    • 7. 发明申请
    • Positive resist composition and method for forming resist pattern
    • 正型抗蚀剂组合物和形成抗蚀剂图案的方法
    • US20060251986A1
    • 2006-11-09
    • US10540056
    • 2003-12-18
    • Kazufumi SatoMitsuo HagiharaDaisuke Kawana
    • Kazufumi SatoMitsuo HagiharaDaisuke Kawana
    • G03C1/00
    • G03F7/0392G03F7/0397Y10S430/106Y10S430/111
    • A positive resist composition including a resin component (A) containing an acid dissociable dissolution inhibiting group whose alkali solubility increases under action of acid and an acid generator component (B) that generates acid on exposure, wherein the resin component (A) is a copolymer comprising a first structural unit (a1) derived from a hydroxystyrene and a second structural unit (a2) derived from a (meth)acrylate ester containing an alcoholic hydroxyl group, in which 10 mol % or more and 25 mol % or less of a combined total of hydroxyl groups within the structural units (a1) and alcoholic hydroxyl groups within the structural units (a2) are protected with the acid dissociable dissolution inhibiting groups, and a weight average molecular weight of the copolymer prior to protection with the acid dissociable dissolution inhibiting groups is 2,000 or more and 8,500 or less.
    • 一种正型抗蚀剂组合物,其包含在酸的作用下碱溶解度增加的酸解离溶解抑制基团和在曝光时产生酸的酸产生剂组分(B)的树脂组分(A),其中树脂组分(A)是共聚物 包含衍生自羟基苯乙烯的第一结构单元(a1)和衍生自含有醇羟基的(甲基)丙烯酸酯的第二结构单元(a2),其中10摩尔%以上且25摩尔%以下的组合 结构单元(a1)中的羟基和结构单元(a2)中的醇羟基的总数被酸解离溶解抑制基团保护,并且在用酸解离溶解抑制之前保护共聚物的重均分子量 组别为2,000以上至8,500以下。
    • 10. 发明授权
    • Positive resist composition and method for forming resist pattern
    • 正型抗蚀剂组合物和形成抗蚀剂图案的方法
    • US07666569B2
    • 2010-02-23
    • US10540056
    • 2003-12-18
    • Kazufumi SatoMitsuo HagiharaDaisuke Kawana
    • Kazufumi SatoMitsuo HagiharaDaisuke Kawana
    • G03F7/004
    • G03F7/0392G03F7/0397Y10S430/106Y10S430/111
    • A positive resist composition including a resin component (A) containing an acid dissociable dissolution inhibiting group whose alkali solubility increases under action of acid and an acid generator component (B) that generates acid on exposure, wherein the resin component (A) is a copolymer comprising a first structural unit (a1) derived from a hydroxystyrene and a second structural unit (a2) derived from a (meth)acrylate ester containing an alcoholic hydroxyl group, in which 10 mol % or more and 25 mol % or less of a combined total of hydroxyl groups within the structural units (a1) and alcoholic hydroxyl groups within the structural units (a2) are protected with the acid dissociable dissolution inhibiting groups, and a weight average molecular weight of the copolymer prior to protection with the acid dissociable dissolution inhibiting groups is 2,000 or more and 8,500 or less.
    • 一种正型抗蚀剂组合物,其包含在酸的作用下碱溶解度增加的酸解离溶解抑制基团和在曝光时产生酸的酸产生剂组分(B)的树脂组分(A),其中树脂组分(A)是共聚物 包含衍生自羟基苯乙烯的第一结构单元(a1)和衍生自含有醇羟基的(甲基)丙烯酸酯的第二结构单元(a2),其中10摩尔%以上且25摩尔%以下的组合 结构单元(a1)中的羟基和结构单元(a2)中的醇羟基的总数被酸解离溶解抑制基团保护,并且在用酸解离溶解抑制之前保护共聚物的重均分子量 组别为2,000以上至8,500以下。