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    • 6. 发明申请
    • DIELECTRIC HEATING OF THERMOPLASTIC COMPOSITIONS
    • 热塑性组合物的介电加热
    • WO2002088229A1
    • 2002-11-07
    • PCT/US2002/012021
    • 2002-04-17
    • DOW GLOBAL TECHNOLOGIES, INC.BEULICH, InkenKELLEY, David, C.BUTLER, Thomas, I.
    • BEULICH, InkenKELLEY, David, C.BUTLER, Thomas, I.
    • C08J5/00
    • C08K3/34C08L23/02C08L23/06C08L23/08C08L23/0838C08L23/0853C08L23/10C08L23/12C08L2666/04
    • A HF responsive composition is described comprising (A) a molecular sieve material, and (B) at least one interpolymer comprising (i) polymer units derived from at least one aliphatic olefin monomer having from 2 to 20 carbon atoms; and (ii) polymer units derived from (a) at least one vinyl or vinylidene aromatic monomer, or (b) from at least one sterically hindered aliphatic or cycloaliphatic vinyl or vinylidene monomer, or (c) from a combination of at least one vinyl or vinylidene aromatic monomer and at least one sterically hindered aliphatic or cycloaliphatic vinyl or vinylidene monomer, and optionally (d) polymer units derived from at least one ethylenically unsatured polymerizable monomer other than that derived from (a), (b) or (c). The HF responsive composition of the invention can be heated in a dielectric heating process and is useful, for example, to make articles of manufacture which are formed or assembled using HF welding technology.
    • 描述了HF响应组合物,其包含(A)分子筛材料和(B)至少一种共聚体,其包含(i)衍生自至少一种具有2至20个碳原子的脂族烯烃单体的聚合物单元; 和(ii)衍生自(a)至少一种乙烯基或亚乙烯基芳族单体或(b)至少一种空间位阻脂族或脂环族乙烯基或亚乙烯基单体的聚合物单元,或(c)至少一种乙烯基或亚乙烯基芳族单体的组合 或亚乙烯基芳族单体和至少一种空间位阻脂族或脂环族乙烯基或亚乙烯基单体,以及任选地(d)衍生自除(a),(b)或(c)所衍生的至少一种烯键式不可聚合单体的聚合物单元, 。 本发明的HF响应性组合物可以在电介质加热过程中加热,并且可用于例如制造使用HF焊接技术形成或组装的制品。