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    • 1. 发明授权
    • Memory cells, methods of forming dielectric materials, and methods of forming memory cells
    • 记忆单元,介电材料的形成方法以及形成记忆单元的方法
    • US08183110B2
    • 2012-05-22
    • US13116401
    • 2011-05-26
    • D. V. Nirmal RamaswamyNoel RockleinKyu S. Min
    • D. V. Nirmal RamaswamyNoel RockleinKyu S. Min
    • H01L21/336
    • H01L29/7881H01L29/513H01L29/518H01L29/66825H01L29/66833H01L29/792
    • Some embodiments include memory cells. The memory cells may include a tunnel dielectric material, a charge-retaining region over the tunnel dielectric material, crystalline ultra-high k dielectric material over the charge-retaining region, and a control gate material over the crystalline ultra-high k dielectric material. Additionally, the memory cells may include an amorphous region between the charge-retaining region and the crystalline ultra-high k dielectric material, and/or may include an amorphous region between the crystalline ultra-high k dielectric material and the control gate material. Some embodiments include methods of forming memory cells which contain an amorphous region between a charge-retaining region and a crystalline ultra-high k dielectric material, and/or which contain an amorphous region between a crystalline ultra-high k dielectric material and a control gate material.
    • 一些实施例包括存储器单元。 存储单元可以包括隧道电介质材料,隧道电介质材料上方的电荷保持区域,电荷保持区域上的结晶超高k电介质材料,以及结晶超高k电介质材料上的控制栅极材料。 此外,存储器单元可以包括电荷保持区域和结晶超高k电介质材料之间的非晶区域,和/或可以包括晶体超高k电介质材料和控制栅极材料之间的非晶区域。 一些实施例包括形成在电荷保持区域和结晶超高k电介质材料之间形成非晶区域的存储单元的方法,和/或在晶体超高k电介质材料和控制栅极之间包含非晶区域的方法 材料。
    • 2. 发明申请
    • Memory Cells, Methods Of Forming Dielectric Materials, And Methods Of Forming Memory Cells
    • 记忆细胞,形成介电材料的方法和形成记忆细胞的方法
    • US20110220989A1
    • 2011-09-15
    • US13116401
    • 2011-05-26
    • D. V. Nirmal RamaswamyNoel RockleinKyu S. Min
    • D. V. Nirmal RamaswamyNoel RockleinKyu S. Min
    • H01L29/792H01L21/28
    • H01L29/7881H01L29/513H01L29/518H01L29/66825H01L29/66833H01L29/792
    • Some embodiments include memory cells. The memory cells may include a tunnel dielectric material, a charge-retaining region over the tunnel dielectric material, crystalline ultra-high k dielectric material over the charge-retaining region, and a control gate material over the crystalline ultra-high k dielectric material. Additionally, the memory cells may include an amorphous region between the charge-retaining region and the crystalline ultra-high k dielectric material, and/or may include an amorphous region between the crystalline ultra-high k dielectric material and the control gate material. Some embodiments include methods of forming memory cells which contain an amorphous region between a charge-retaining region and a crystalline ultra-high k dielectric material, and/or which contain an amorphous region between a crystalline ultra-high k dielectric material and a control gate material.
    • 一些实施例包括存储器单元。 存储单元可以包括隧道电介质材料,隧道电介质材料上方的电荷保持区域,电荷保持区域上的结晶超高k电介质材料,以及结晶超高k电介质材料上的控制栅极材料。 此外,存储器单元可以包括电荷保持区域和结晶超高k电介质材料之间的非晶区域,和/或可以包括晶体超高k电介质材料和控制栅极材料之间的非晶区域。 一些实施例包括形成在电荷保持区域和结晶超高k电介质材料之间形成非晶区域的存储单元的方法,和/或在晶体超高k电介质材料和控制栅极之间包含非晶区域的方法 材料。
    • 3. 发明授权
    • Memory cells, methods of forming dielectric materials, and methods of forming memory cells
    • 记忆单元,介电材料的形成方法以及形成记忆单元的方法
    • US07968406B2
    • 2011-06-28
    • US12351099
    • 2009-01-09
    • D. V. Nirmal RamaswamyNoel RockleinKyu S. Min
    • D. V. Nirmal RamaswamyNoel RockleinKyu S. Min
    • H01L21/336
    • H01L29/7881H01L29/513H01L29/518H01L29/66825H01L29/66833H01L29/792
    • Some embodiments include memory cells. The memory cells may include a tunnel dielectric material, a charge-retaining region over the tunnel dielectric material, crystalline ultra-high k dielectric material over the charge-retaining region, and a control gate material over the crystalline ultra-high k dielectric material. Additionally, the memory cells may include an amorphous region between the charge-retaining region and the crystalline ultra-high k dielectric material, and/or may include an amorphous region between the crystalline ultra-high k dielectric material and the control gate material. Some embodiments include methods of forming memory cells which contain an amorphous region between a charge-retaining region and a crystalline ultra-high k dielectric material, and/or which contain an amorphous region between a crystalline ultra-high k dielectric material and a control gate material.
    • 一些实施例包括存储器单元。 存储单元可以包括隧道电介质材料,隧道电介质材料上方的电荷保持区域,电荷保持区域上的结晶超高k电介质材料,以及结晶超高k电介质材料上的控制栅极材料。 此外,存储器单元可以包括电荷保持区域和结晶超高k电介质材料之间的非晶区域,和/或可以包括晶体超高k电介质材料和控制栅极材料之间的非晶区域。 一些实施例包括形成在电荷保持区域和结晶超高k电介质材料之间形成非晶区域的存储单元的方法,和/或在晶体超高k电介质材料和控制栅极之间包含非晶区域的方法 材料。